US4436806A — Method and apparatus for making printed circuit b…

Claim 1

Independent Claim 138 words

A process for making a resist pattern on circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable to a solid by means of non-coherent collimated light radiation; (c) projecting a pattern of substantially collimated non-coherent light radiation patterned by patterning means out of contact with said liquid polymer coating; (d) exposing said coating of liquid polymer composition to said projected pattern of substantially collimated non-coherent light radiation and curing the polymer composition to a solid polymer in said pattern of substantially collimated non-coherent light and maintaining said liquid polymer a substantially uncured liquid polymer outside of said pattern of substantially collimated non-coherent light; and (e) removing said substantially uncured liquid polymer leaving said solid polymer in said pattern on said circuit board substrate.

Claim 2

Dependent Claim 138 words

A process for making a resist pattern on circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable to a solid by means of non-coherent collimated light radiation; (c) projecting a pattern of substantially collimated non-coherent light radiation patterned by patterning means out of contact with said liquid polymer coating; (d) exposing said coating of liquid polymer composition to said projected pattern of substantially collimated non-coherent light radiation and curing the polymer composition to a solid polymer in said pattern of substantially collimated non-coherent light and maintaining said liquid polymer a substantially uncured liquid polymer outside of said pattern of substantially collimated non-coherent light; and (e) removing said substantially uncured liquid polymer leaving said solid polymer in said pattern on said circuit board substrate.

Claim 3

Dependent Claim 50 words

A process for making a resist pattern on circuit boards as in claim 1 wherein the patterning means is a photo tool and said photo tool having substantially vertical edges such that the angle of the substantially vertical edges of the photoresist is within about ±3 degrees of the vertical.

Claim 4

Dependent Claim 45 words

A process for making a resist pattern on circuit boards as in claim 1 wherein said non-coherent substantially collimated light radiation has a half angle of not more than about 3 degrees as measured by the angles of the substantially vertical edges of the photoresist.

Claim 5

Dependent Claim 25 words

A process for making a resist pattern on circuit boards as in claim 1 wherein said coating procedure (b) is carried out by roller coating.

Claim 6

Dependent Claim 86 words

A process for making a resist pattern on circuit boards as in claim 3 wherein procedure (c) is carried out by placing a photo tool out of contact with but in close relationship with said liquid polymer coating and contacting said photo tool with non-coherent substantially collimated light radiation, passing a portion of said non-coherent substantially collimated light radiation through said photo tool which portion of said non-coherent substantially collimated light passing through said photo tool forms said projected pattern of non-coherent substantially collimated light radiation.

Claim 7

Dependent Claim 48 words

A process for making a resist pattern on circuit boards as in claim 5 wherein the image dimension deviation factor is more than about 0.5 mil and an air gap is maintained between the photo tool and the liquid polymer coated surface of about 5 to 500 mils.

Claim 8

Dependent Claim 28 words

A process for making a resist pattern on circuit boards as in claim 1 wherein said coating (b) is in a thickness of about 0.1 to 10 mils.

Claim 9

Dependent Claim 58 words

The process of making a resist pattern on circuit boards as in claim 6 wherein said coating (b) is carried out in reverse roller coating in a thickness of about 0.5 to 5 mils, said half angle is not more than about 1.5 degrees from the vertical and said image deviation is not more than about 0.25 mil.

Claim 10

Dependent Claim 173 words

A process for making a resist pattern on a printed circuit board substrate comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with non-coherent collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light selectively passes through parts of said photo tool, contact said liquid polymer coated surface, and causes said liquid polymer to cure to a solid polymer where contacted by said light; (e) discontinuing the application of said light leaving a solid cured polymer on at least portions of said circuit board substrate; and (f) removing substantially uncured liquid polymer leaving said solid cured polymer in said resist pattern on said circuit board substrate.

Claim 11

Dependent Claim 173 words

A process for making a resist pattern on a printed circuit board substrate comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with non-coherent collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light selectively passes through parts of said photo tool, contact said liquid polymer coated surface, and causes said liquid polymer to cure to a solid polymer where contacted by said light; (e) discontinuing the application of said light leaving a solid cured polymer on at least portions of said circuit board substrate; and (f) removing substantially uncured liquid polymer leaving said solid cured polymer in said resist pattern on said circuit board substrate.

Claim 12

Dependent Claim 48 words

A process for making a resist pattern on a printed circuit board substrate as in claim 9 wherein the air gap between the photo tool and the liquid polymer coated surface, while contacting the photo tool with said light radiation is maintained at about 5 to 500 mils.

Claim 13

Dependent Claim 77 words

A process for making a resist pattern on a printed circuit board substrate as in claim 10 wherein said circuit board substrate has a metal cladding on at least one side and said liquid polymer which has remained liquid after the step in which said photo tool has been contacted with said light radiation is removed by contacting with an aqueous solution in which said polymer is at least partially soluble thereby partly exposing said metal cladding.

Claim 14

Dependent Claim 39 words

A process for making a resist pattern on a printed circuit board substrate as in claim 9 wherein said liquid polymer composition is coated onto said substrate in a thickness of about 0.1 to 10 mils by roller coating.

Claim 15

Dependent Claim 38 words

A process for making a resist pattern on a printed circuit board substrate as in claim 12 wherein said roller coating is reverse roller coating with said coating having a thickness of from about 0.5 to 5 mils.

Claim 16

Dependent Claim 48 words

A process for making a resist pattern on a printed circuit board substrate as in claim 12 wherein said non-coherent collimated light, radiation has a half angle of not more than about 1.5 degrees from the vertical and an image deviation of no more than about 0.25 mil.

Claim 17

Dependent Claim 176 words

A process for making printed circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with non-coherent collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light selectively passed through parts of said photo tool, contacts said liquid polymer coated surface, and causes said liquid polymer to cure to a solid polymer where contacted by said light; (e) discontinuing the application of said light radiation and removing the uncured liquid polymer to leave a solid cured polymer on at least portions thereof; (f) treating the areas not covered by said cured liquid polymer to produce a defined circuit; and (g) removing the cured liquid polymer from said substrate.

Claim 18

Dependent Claim 176 words

A process for making printed circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with non-coherent collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light selectively passed through parts of said photo tool, contacts said liquid polymer coated surface, and causes said liquid polymer to cure to a solid polymer where contacted by said light; (e) discontinuing the application of said light radiation and removing the uncured liquid polymer to leave a solid cured polymer on at least portions thereof; (f) treating the areas not covered by said cured liquid polymer to produce a defined circuit; and (g) removing the cured liquid polymer from said substrate.

Claim 19

Dependent Claim 42 words

A process for making printed circuit boards as in claim 15, wherein the air gap between the photo tool and the liquid polymer coated surface, while coating the photo tool with said light radiation, is maintained at about 5 to 500 mils.

Claim 20

Dependent Claim 84 words

A process for making printed circuit boards as in claim 15, wherein said circuit board substrate has a metal cladding on at least one side; said liquid polymer which has remained liquid after the step in which said photo tool has been contacted with said light radiation is removed by contact with an aqueous solution in which the liquid polymer is at least partially soluble, and said cured polymer is removed by contact with an aqueous solution containing cations derived from a strong base.

Claim 21

Dependent Claim 31 words

A process for making printed circuit boards as in claim 17, wherein said cations derived from a strong base are selected from the group consisting of sodium, potassium and ammonium cations.

Claim 22

Dependent Claim 33 words

A process for making printed circuit boards as in claim 15, wherein said liquid polymer composition is coated onto said substrate in a thickness of about 0.1 to 10 mils by roller coating.

Claim 23

Dependent Claim 32 words

A process for making printed circuit boards as in claim 19, wherein said roller coating is reverse roller coating with said coating having a thickness of from about 0.5 to 5 mils.

Claim 24

Dependent Claim 42 words

A process for making printed circuit boards as in claim 19, wherein said non-coherent collimated light radiation has a half angle of not more than about 1.5 degrees from the vertical and an image deviation of no more than about 0.25 mil.

Claim 25

Dependent Claim 36 words

A process for making printed circuit boards as in claim 19, wherein said liquid polymer consists primarily of a urethane molecule having terminal unsaturation at one end and a terminal carboxy group on the other end.

Claim 26

Dependent Claim 72 words

A process for making printed circuit boards as in claim 22, wherein said liquid polymer consists primarily of: ##STR4## wherein R 1 is an alkyl group of from 1 to 6 carbon atoms, R 2 is the organic moeity of a diisocyanate and is an alicyclic, aryl, alkyl or arylalkyl group, and (PE) X is a polyester or polyether extending chain unit where X is an integer of from 2 to 50.

Claim 27

Dependent Claim 24 words

A process for making printed circuit boards as in claim 23, wherein said liquid polymer composition contains a carboxy terminated methacrylate and a photosensitizer.

Claim 28

Dependent Claim 24 words

A process for making printed circuit boards as in claim 24, wherein said liquid polymer composition contains a cross-linking agent containing terminal unsaturated groups.

Claim 29

Dependent Claim 24 words

A process for making printed circuit boards as in claim 24, wherein said liquid polymer composition includes a cross-linking agent containing terminal thiol groups.

Claim 30

Dependent Claim 190 words

A process for making printed circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with said collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light radiation selectively passes through parts of said photo tool, contacts said liquid polymer coated surface, causes said liquid polymer to cure to a solid polymer where contacted with said light radiation; (e) discontinuing the application of said light radiation and removing the uncured liquid polymer leaving a solid cured polymer on at least portions thereof; (f) plating metals onto areas of said circuit board substrate from which said liquid polymer has been removed; (g) removing the cured liquid polymer; and (h) treating the areas not covered by said plated metal to produce a defined circuit.

Claim 31

Dependent Claim 190 words

A process for making printed circuit boards comprising: (a) providing a circuit board substrate; (b) coating at least a portion of said substrate with a liquid polymer composition curable by means of non-coherent collimated light radiation; (c) forming an air gap by placing a photo tool in close relationship with said liquid polymer coated surface; (d) contacting said photo tool with said collimated light radiation having a half angle of not more than about 3 degrees from the vertical and an image dimension deviation factor of no more than about 0.5 mil, whereby said light radiation selectively passes through parts of said photo tool, contacts said liquid polymer coated surface, causes said liquid polymer to cure to a solid polymer where contacted with said light radiation; (e) discontinuing the application of said light radiation and removing the uncured liquid polymer leaving a solid cured polymer on at least portions thereof; (f) plating metals onto areas of said circuit board substrate from which said liquid polymer has been removed; (g) removing the cured liquid polymer; and (h) treating the areas not covered by said plated metal to produce a defined circuit.

Claim 32

Dependent Claim 40 words

A process for making printed circuit boards as in claim 27, wherein the air gap between the photo tool and the liquid polymer coated surface, while contacting the photo tool with said light radiation, is about 5 to 500 mils.

Claim 33

Dependent Claim 84 words

A process for making printed circuit boards as in claim 27, wherein said circuit board substrate has a metal cladding on at least one side, said liquid polymer which has remained liquid after the step in which said photo tool has been contacted with said light radiation is removed by contact with an aqueous solution in which said liquid polymer is at least partially soluble; and said cured polymer is removed by contact with an aqueous solution containing cations derived from a strong base.

Claim 34

Dependent Claim 31 words

A process for making printed circuit boards as in claim 29, wherein said cations derived from a strong base are selected from the group consisting of sodium, potassium, and ammonium ions.

Claim 35

Dependent Claim 35 words

A process for making printed circuit boards as in claim 27, wherein said liquid polymer composition is coated onto said circuit board substrate in a thickness of about 0.1 to 10 mils by roller coating.

Claim 36

Dependent Claim 32 words

A process for making printed circuit boards as in claim 31, wherein said roller coating is reverse roller coating with said coating having a thickness of from about 0.5 to 5 mils.

Claim 37

Dependent Claim 42 words

A process for making printed circuit boards as in claim 31, wherein said non-coherent collimated light radiation has a half angle of not more than about 1.5 degrees from the vertical and an image deviation of no more than about 0.25 mil.

Claim 38

Dependent Claim 36 words

A process for making printed circuit boards as in claim 31, wherein said liquid polymer consists primarily of a urethane molecule having terminal unsaturation at one end and a terminal carboxy group on the other end.

Claim 39

Dependent Claim 72 words

A process for making printed circuit boards as in claim 33, wherein said liquid polymer consists primarily of: ##STR5## wherein R 1 is an alkyl group of from 1 to 6 carbon atoms, R 2 is the organic moeity of a diisocyanate and is an alicyclic, aryl, alkyl or arylalkyl group, and (PE) X is a polyester or polyether extending chain unit where X is an integer of from 2 to 50.

Claim 40

Dependent Claim 24 words

A process for making printed circuit boards as in claim 33, wherein said liquid polymer composition contains a carboxy terminated methacrylate and a photosensitizer.

Claim 41

Dependent Claim 23 words

A process for making printed circuit boards as in claim 36, wherein said liquid polymer composition contains a cross-linking agent containing terminal unsaturation.

Claim 42

Dependent Claim 24 words

A process for making printed circuit boards as in claim 36, wherein said liquid polymer composition contains a cross-linking agent containing terminal thiol groups.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1987-03-13	1987-09-12	1988-03-13	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1991-03-13	1991-09-12	1992-03-13	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1995-03-13	1995-09-12	1996-03-13	$7700.00	Window Closed / Lapsed

Method and apparatus for making printed circuit boards

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