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Copper alloys for electric and electronic devices and method for producing same

Assignee: Kobe Steel Ltd
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Filing: 1983-06-06
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Granted: 1984-02-07
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Expires: 2003-06-06
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Abstract

Abstract A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.

Inventors

  • 👤 Motohisa Miyafuji
  • 👤 Takashi Matsui
  • 👤 Hidekazu Harada
  • 👤 Masumitsu Soeda
  • 👤 Shin Ishikawa
  • 👤 Hiroshi Murakado
  • 👤 Hiroaki Kawamoto
  • 👤 Takeo Tabuchi
  • 👤 Kunio Kamada
  • 👤 Yasuhiro Nakashima

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 15:59
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/02; H01B1/026; C; C22; C22C; C22C9/00; C22C9/06

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 33 words
A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn and the balance Cu and the inevitable impurities.
Claim 2
Dependent Claim 33 words
A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn and the balance Cu and the inevitable impurities.
Claim 3
Dependent Claim 37 words
A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn, 0.005-0.1 wt% of Cr, and the balance Cu and the inevitable impurities.
Claim 4
Dependent Claim 37 words
A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn, 0.005-0.1 wt% of Cr, and the balance Cu and the inevitable impurities.
Claim 5
Independent Claim 93 words
A method for producing a copper alloy for electric and electronic devices, comprising the steps of: (a) subjecting to hot working a copper alloy which comprises 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn, optionally containing 0.005-0.1 wt% of Cr, and the balance Cu and the inevitable impurities; (b) cooling the alloy at a rate of over 15° C. per second from a temperature exceeding 600° C.; and (c) after cold working, annealing the alloy at 400° C.-550° C. for 5 minutes to 4 hours.
Claim 6
Independent Claim 93 words
A method for producing a copper alloy for electric and electronic devices, comprising the steps of: (a) subjecting to hot working a copper alloy which comprises 3.0-3.5 wt% of Ni, 0.5-0.9 wt% of Si, 0.02-1.0 wt% of Mn, 0.1-5.0 wt% of Zn, optionally containing 0.005-0.1 wt% of Cr, and the balance Cu and the inevitable impurities; (b) cooling the alloy at a rate of over 15° C. per second from a temperature exceeding 600° C.; and (c) after cold working, annealing the alloy at 400° C.-550° C. for 5 minutes to 4 hours.

References Cited (Backward Citations)

DE2509892A1 Cited
US4191601A Cited
US4362579A Cited
US4366117A Cited
US4337089A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-02-06 1987-08-08 1988-02-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-02-06 1991-08-08 1992-02-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-02-06 1995-08-08 1996-02-07 $7700.00 Window Closed / Lapsed

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