Double field oxidation process

Claim 2

In the fabrication of a metal-oxide-semiconductor memory on a silicon substrate which substrate includes a first area for a storage array and a second area for peripheral circuits, an improved process comprising the steps of: growing an oxide on said substrate at predetermined first regions of said first area forming first oxide regions and simultaneously growing an oxide at predetermined second regions of said second area forming second oxide regions, said first and second oxide regions being grown to a thickness of approximately 3000 A, or less; forming polysilicon members on said substrate in at least said first area of said substrate; growing an oxide on said polysilicon members in said first area while simultaneously thickening said second oxide regions; whereby a memory is fabricated having thinner oxide regions in the storage array and thicker oxide regions for the peripheral circuits, thereby reducing the area required for the storage array.

Claim 3

The process defined by claim 1 wherein said first regions and second regions are defined by openings in a silicon nitride layer.

Claim 4

The process defined by claim 2 wherein said polysilicon members extend over portions of said first oxide regions and prevent the thickening of said portions of said first oxide regions during said growing of an oxide on said polysilicon members.

Claim 5

The process defined by claim 3 wherein said substrate is doped at said openings prior to said growing of said first and second oxide regions.

Claim 6

The process defined by claim 4 including the step of doping said substrate beneath said polysilicon members.

Claim 7

The process defined by claim 3 wherein said second oxide region is thickened to a thickness of approximately 7000 A-8000 A.

Claim 8

In the fabrication of a metal-oxide-semiconductor memory on a silicon substrate where first field oxide regions are used in the storage array for isolation and second field oxide regions are used in the peripheral circuits for isolation, an improved process for forming said first and second oxide regions comprising the steps of: forming openings through a silicon nitride layer at the proposed sites of said first and second oxide regions; growing an oxide on said substrate to a thickness of approximately 3000 A, or less; removing at least a portion of said silicon nitride layer at said first oxide regions; forming polysilicon members which extend over portions of said first oxide regions, generally where said removal of said silicon nitride has occurred; growing an oxide on said polysilicon members while thickening said second field oxides; whereby a memory is fabricated having thinner field oxide regions in the storage array and thicker oxide regions for the peripheral circuits, thereby reducing the area required for the storage array.

Claim 9

In the fabrication of a metal-oxide-semiconductor memory on a silicon substrate where first field oxide regions are used in the storage array for isolation and second field oxide regions are used in the peripheral circuits for isolation, an improved process for forming said first and second oxide regions comprising the steps of: forming openings through a silicon nitride layer at the proposed sites of said first and second oxide regions; growing an oxide on said substrate to a thickness of approximately 3000 A, or less; removing at least a portion of said silicon nitride layer at said first oxide regions; forming polysilicon members which extend over portions of said first oxide regions, generally where said removal of said silicon nitride has occurred; growing an oxide on said polysilicon members while thickening said second field oxides; whereby a memory is fabricated having thinner field oxide regions in the storage array and thicker oxide regions for the peripheral circuits, thereby reducing the area required for the storage array.

Claim 10

The process defined by claim 7 wherein said second field oxide is thickened to a thickness of approximately 7000 A-8000 A or thicker.

Claim 11

The process defined by claim 7 wherein said substrate is doped at said openings prior to growing said oxide.

Claim 12

The process defined by claim 9 including the step of doping the substrate below said polysilicon members.

Claim 13

The process defined by claim 7 wherein said polysilicon members are formed from a layer of polysilicon which is approximately 5500 A thick.

Claim 14

The process defined by claim 7 wherein said growing of said oxide on said polysilicon members continues to an oxide thickness of approximately 5000 A-6000 A.