Mounting and excitation system for reaction in the plasma state

Claim 1

Apparatus for supporting a plurality of wafer-like substrates so as to be treatable in a plasma environment, comprising: at least three plate-like electrically conductive electrodes each having a face parallel to and spaced from one another along an axis; support means adjacent to each of said electrodes for supporting a wafer-like substrate against at least one of said faces between each pair of adjacent electrodes; a first conductive bus conductively connected to a first set of alternate ones of said electrodes; a second conductive bus; and an individual capacitative coupling respective to each member of a second set of said electrodes, said second set of electrodes comprising the electrodes located between the electrodes of said first set, each said capacitative coupling being connected to its respective electrode and to said second bus but not directly to any other capacitative coupling, whereby in a circuit including said first and second buses, each pair of adjacent electrodes and the respective capacitative coupling are in series relationship, and the respective members of said pairs are in parallel connection with one another.