US4270138A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enhanced thermal transfer package for a semiconductor device
Assignee: General Electric Co
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Filing: 1979-03-02
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Granted: 1981-05-26
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Expires: 1999-03-02
Abstract
Abstract A semiconductor device for flush mounting to an external heatsink includes an integral encapsulating body and an internal heatsink having a surface for heat transfer to an external heatsink. The encapsulating body encloses a semiconductor element and a portion of the internal heatsink but has a lower surface which when mounted to the external heatsink, lies above the surface thereof thereby insuring that flush mounting can be consistently achieved.
Inventors
- 👤 Richard J. Desmond
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 02:05
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W40/00; H10W40/70; H10W40/77; H10W40/778
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
152 words
A semiconductor device manufacturable by molding of an encapsulating body onto an integral heat sink adapted for mounting to an external heat sink comprising: a semiconductor element mounted in heat transfer relationship with said integral heat sink; a peripheral burr on said integral heat sink extending away from said body for cooperating with a mold member during manufacture to keep a mounting surface of said body free from encapsulant; an encapsulating body surrounding said semiconductor element and a portion of said integral heat sink and having a lower major surface spaced from a lower surface of said integral heat sink a distance sufficient to insure that said major surface of said encapsulating body does not interfere with an interface between said integral heat sink and an external heat sink and a narrow rim portion surrounding said burr for easy removal without removal of any substantial amount of material from said major surface.
Claim 2
Dependent Claim
152 words
A semiconductor device manufacturable by molding of an encapsulating body onto an integral heat sink adapted for mounting to an external heat sink comprising: a semiconductor element mounted in heat transfer relationship with said integral heat sink; a peripheral burr on said integral heat sink extending away from said body for cooperating with a mold member during manufacture to keep a mounting surface of said body free from encapsulant; an encapsulating body surrounding said semiconductor element and a portion of said integral heat sink and having a lower major surface spaced from a lower surface of said integral heat sink a distance sufficient to insure that said major surface of said encapsulating body does not interfere with an interface between said integral heat sink and an external heat sink and a narrow rim portion surrounding said burr for easy removal without removal of any substantial amount of material from said major surface.
Claim 3
Dependent Claim
33 words
The device of claim 1 further comprising peripheral locking means extending outwardly from sidewalls of said integral heatsink and included within said encapsulating body for mechanically coupling said body to said integral heatsink.
Claim 4
Dependent Claim
21 words
The device of claim 1 wherein said encapsulating body comprises a material selected from the Group consisting of epoxy and silicone.
Claim 5
Dependent Claim
22 words
The method of claim 1 further comprising a layer of electrically insulating material disposed between said semiconductor element and said integral heatsink.
Claim 6
Dependent Claim
33 words
The device of claim 1 further comprising a plurality of leads connected to said semiconductor element and mechanically supported by and extending outside of said body for providing electrical connection to said element.
Claim 7
Dependent Claim
26 words
The device of claim 1 wherein said narrow rim portion has a height less than about 0.005 inches and a width less than about 0.005 inches.
Claim 8
Dependent Claim
14 words
The device of claim 1 wherein said distance is between 0.001 and 0.005 inches.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-05-25 | 1984-11-24 | 1985-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-05-25 | 1988-11-24 | 1989-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-05-25 | 1992-11-24 | 1993-05-26 | $7700.00 | Window Closed / Lapsed |