US3783345A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-dissipating encapsulated semi-conductor assembly
Assignee: Graham White Sales Corp
•
Filing: 1971-09-08
•
Granted: 1974-01-01
•
Expires: 1991-09-08
Abstract
Abstract A diode or other semi-conductor device encapsulated with a directly connected heat sink in a heat-conductive, electrically insulating plastic matrix and dissipating heat generated by the device from the heat sink to a mounting bracket through a thickness of the matrix only sufficient for electrical insulation.
Inventors
- 👤 T Taylor
- 👤 H Bredlow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 22:55
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
83 words
An encapsulated semi-conductor assembly, comprising a semiconductor device, a heat-conductive, electrically insulating plastic matrix encapsulatiNg said device, a heat sink encapsulated in said matrix and connected for heat transfer directly to said device for receiving heat generated thereby, and means at least in part external of said matrix and spaced and electrically insulated thereby from said heat sink for receiving heat therethrough from said heat sink, said heat sink and receiving means being metal members of high heat conductivity relative to said matrix.
Claim 2
Dependent Claim
83 words
An encapsulated semi-conductor assembly, comprising a semiconductor device, a heat-conductive, electrically insulating plastic matrix encapsulatiNg said device, a heat sink encapsulated in said matrix and connected for heat transfer directly to said device for receiving heat generated thereby, and means at least in part external of said matrix and spaced and electrically insulated thereby from said heat sink for receiving heat therethrough from said heat sink, said heat sink and receiving means being metal members of high heat conductivity relative to said matrix.
Claim 3
Dependent Claim
14 words
An assembly according to claim 1, wherein the matrix is a high silica epoxy.
Claim 4
Dependent Claim
26 words
An assembly according to claim 2, wherein the heat-receiving means is a mounting bracket securable directly to a metal mounting panel for transferring received heat thereto.
Claim 5
Dependent Claim
48 words
An assembly according to claim 3, wherein the heat sink includes a pair of inner metal plates thermally connected to the device and spaced therebeyond, and said receiving means includes a pair of outer plates straddling and spaced and electrically insulated by the matrix from said inner plates.
Claim 6
Dependent Claim
15 words
An assembly according to claim 4, wherein the outer plates are encapsulated in the matrix.
Claim 7
Dependent Claim
60 words
An assembly according to claim 5, including spaced terminals partly embedded in and projecting from the matrix, and wherein the device includes a diode and a thyrector connected in parallel between said terminals, and the inner heat sink plates are heat and electrically conductive and at least one thereof connects a side of the thyrector to one of said terminals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-31 | 1977-07-02 | 1978-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-31 | 1981-07-02 | 1982-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-31 | 1985-07-02 | 1986-01-01 | $7700.00 | Window Closed / Lapsed |