US3601667A
Expired / Lapsed
US
⏱️ 0.0 years remaining
A semiconductor device with a heat sink having a foot portion
Assignee: General Electric Co
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Filing: 1968-12-09
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Granted: 1971-08-24
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Expires: 1988-12-09
Abstract
Abstract A foot portion is bent up from a planar, electrically conductive heat sink, and a header rigidly mounting circular cross section electrical leads positions one of the leads in engagement with the foot portion. A semiconductor crystal is attached to the heat sink with a soft solder and a contact having an upstanding flange is similarly attached to the semiconductor crystal with a soft solder. The flange is attached to an electrical lead positioned by the header. A pliant, substantially fluid impervious material, such as silicone rubber, is cured around the semiconductor crystal and a casement is then molded to the leads and heat sink to form a shock and strain resistant semiconductive device. The header is in one form enclosed by the casement, but in alternate forms may be partially or entirely stripped after molding.
Inventors
- 👤 Richard J Desmond
- 👤 Paul W Koenig
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 07:15
CPC Classifications
H; H10; H10D; H10D99/00; H10P; H10P95/00; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/20; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/121; H10W74/131; H10W74/137; H10W74/40; H10W74/47; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
21 words
A semiconductor device according to claim 1 in which at least one of said lead means is circular in cross section.
Claim 2
Dependent Claim
63 words
A semiconductor device according to claim 1 in which said mating portion of said header is provided with a window, said one lead means is mounted by said header with one portion extending into said window, and said foot portion is fitted within said window with said conforming surface mating with said one portion of said one lead means extending into said window.
Claim 3
Dependent Claim
41 words
A semiconductor device according to claim 1 in which said foot portion is an integral extension of said heat sink, oriented in upstanding relation therewith, and provided with an aperture to form said conforming surface mating with said one lead means.
Claim 4
Dependent Claim
43 words
A semiconductor device according to claim 1 in which said foot portion is an integral extension of said heat sink and oriented in upstanding relation therewith and said header is at least partially interposed between said foot portion and said semiconductor crystal means.
Claim 5
Dependent Claim
46 words
A semiconductor device according to claim 1 in which said contact means overlies one entire surface of said semiconductor crystal means and is provided with an integral upstanding flange portion tangentially associated with said one remaining lead means along one edge of said semiconductor crystal means.
Claim 6
Dependent Claim
64 words
A semiconductor device according to claim 1 in which said contact means is comprised of a terminal portion and a spaced gate portion, said terminal portion being provided with a first flange formed integral therewith and extending along one edge of said semiconductor crystal means, and said first flange being electrically connected to one remaining of said lead means positioned tangentially along its length.
Claim 7
Dependent Claim
185 words
A semiconductor device comprising an electrically conductive heat sink including an upstanding foot portion as an integral extension thereof, semiconductor crystal means including a glass passivation layer conductively associated with said heat sink, contact means conductively associated with a portion of said semiconductor crystal means separated from said heat sink by at least one junction, a plurality of spaced lead means of circular cross section, one of said lead means mating with a conforming surface of said foot portion and having a low impedance electrical interconnection therewith, at least one remaining of said lead means being electrically interconnected with said contact means, said contact means including an upstanding flange portion tangentially associated with said one remaining lead means, means laterally spaced from said semiconductor crystal means fixedly positioned on said foot portion of said heat sink mounting said lead means to protect against mechanical stress being transmitted through said lead means, a pliant, substantially fluid impervious material cooperating with said heat sink to envelop said semiconductor crystal means, and a molded casement cooperating with said lead means and heat sink to envelop said pliant material.
Claim 8
Dependent Claim
17 words
A semiconductor device according to claim 8 in which said pliant fluid impervious material is silicone rubber.
Claim 9
Dependent Claim
179 words
A semiconductor device comprising an electrically conductive heat sink carrying a foot portion integrally joined at one edge and upstanding from one planar surface thereof, semiconductor rectifier means soldered to said one planar surface spaced from said foot portion, a rigid insulative header associated with said upstanding foot portion and interposed between said semiconductor rectifier means and said foot portion, a plurality of lead means rigidly mounted by said header in substantially parallel relation, one of said lead means mating with a conforming surface of said foot portion and having a low impedance electrical interconnection therewith, contact means soldered to a portion of said semiconductor rectifier means separated from said heat sink by at least one junction, said contact means including an integral upstanding flange portion tangentially aligned with and attached to a remaining of said lead means along one edge of said semiconductor rectifier means, a resilient, substantially fluid impervious rubber cooperating with said heat sink to envelop said semiconductor crystal means, and a molded casement cooperating with said lead means and heat sink to envelop said rubber.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-08-23 | 1975-02-22 | 1975-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-08-23 | 1979-02-22 | 1979-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-08-23 | 1983-02-22 | 1983-08-24 | $7700.00 | Window Closed / Lapsed |