Apparatus for thermal diffusion by high frequency induction heating of semiconductor substrates

Claim 1

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment, (f) said open air sealing means including a clean chamber in which said heating base transfer means is provided being air tightly connected to one end of said furnace tube, and (g) a guide member being provided inside said furnace tube for guiding said heating bases from the inlet to the outlet of said furnace tube.

Claim 2

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment, (f) said open air sealing means including a clean chamber in which said heating base transfer means is provided being air tightly connected to one end of said furnace tube, and (g) a guide member being provided inside said furnace tube for guiding said heating bases from the inlet to the outlet of said furnace tube.

Claim 9

An apparatus for thermal diffusion treatment of semiconductor substrates by means of a high frequency induction heating, comprising: (a) a diffusion furnace tube having open end for containing a predetermined atmosphere, therein, (b) the first and second clean chambers, purified and sealed from the open air and each airtightly connected to the respective end of said diffusion furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases, designed to carry semiconductor substrates to be processed for thermal diffusion treatment into said furnace tube and to be subjected to induction heating by the abovesaid heating means in order to give a predetermined thermal treatment to said semiconductor substrates, and made of a material having good electric conductivity which is hardly liable to discharge ions at high temperature, (e) a guide member provided in said furnace tube for guiding said heating bases from the inlet opening toward the outlet opening of said furnace tube, (f) pushing means disposed in the first of said clean chambers for pushing said plurality of heating bases in contact with the adjacent heating bases one after another from the inlet opening toward the outlet opening of said furnace tube, and (g) take-out means disposed in said furnace tube for taking out said heating bases one after the other upon their arrival at the outlet end of said furnace tube.

Claim 10

An apparatus for thermal diffusion treatment of semiconductor substrates by means of a high frequency induction heating, comprising: (a) a diffusion furnace tube having open end for containing a predetermined atmosphere, therein, (b) the first and second clean chambers, purified and sealed from the open air and each airtightly connected to the respective end of said diffusion furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases, designed to carry semiconductor substrates to be processed for thermal diffusion treatment into said furnace tube and to be subjected to induction heating by the abovesaid heating means in order to give a predetermined thermal treatment to said semiconductor substrates, and made of a material having good electric conductivity which is hardly liable to discharge ions at high temperature, (e) a guide member provided in said furnace tube for guiding said heating bases from the inlet opening toward the outlet opening of said furnace tube, (f) pushing means disposed in the first of said clean chambers for pushing said plurality of heating bases in contact with the adjacent heating bases one after another from the inlet opening toward the outlet opening of said furnace tube, and (g) take-out means disposed in said furnace tube for taking out said heating bases one after the other upon their arrival at the outlet end of said furnace tube.

Claim 11

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, and (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment; said heating base transfer means including a transfer device for transporting said heating bases automatically from a predetermined position to the position which they are pushed into the inlet opening of said furnace tube.

Claim 12

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, and (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment; said heating base transfer means including a transfer device for transporting said heating bases automatically from a predetermined position to the position which they are pushed into the inlet opening of said furnace tube.

Claim 14

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, and (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment; the said furnce tube being disposed substantially in vertical direction, and said heating bases being pushed up successively from the inet opening at the bottom end toward the outlet opening at the top end of said furnace tube by said pushing means.

Claim 15

An apparatus for thermal diffusion treatment of semiconductor substrates by means of high frequency induction heating comprising; (a) a diffusion furnace tube having open ends and a predetermined atmosphere, (b) means for sealing the furnace tube from open air provided at both ends of said furnace tube, (c) high frequency induction heating means, including an induction heating coil provided around the outer periphery of said furnace tube, (d) a plurality of heating bases made of a material having a good electric conductivity which is hardly liable to discharge ions at high temperature and designed to load semiconductor substrates to be treated for thermal diffusion in said furnace tube, and (e) transfer means for the successive transportation of said plurality of heating bases from the inlet opening toward the outlet opening of said furnace tube, including a means for pushing said plurality of heating bases successively one after the other from the inlet opening toward the outlet opening of said furnace tube, thereby said heating bases are subjected to induction heating with said heating means so that they receive substantially the same thermal treatment; the said furnce tube being disposed substantially in vertical direction, and said heating bases being pushed up successively from the inet opening at the bottom end toward the outlet opening at the top end of said furnace tube by said pushing means.