Selective diffusion and etching method for isolation of integrated logic circuit

Claim 1

A method for the fabrication of an integrated semiconductor injection logic circuit having an inverted, multiple-collector transistor wherein the base region includes a plurality of lightly-doped active portions and a heavily-doped extrinsic portion, comprising the steps of: (a) forming a mask layer on a semiconductor slice, said mask layer being resistant to diffusion, etching and oxidation, (b) patterning said mask layer by removing a portion thereof to define mask apertures which expose an area of said slice to be located between two of said base and/or collector portions. (c) selectively diffusing a suitable dopant thru said mask apertures into said exposed area of the semiconductor slice, whereby regions are formed which have both vertically and laterally-doped portions, (d) then selectively etching said exposed area of the slice thru the same mask apertures to remove the full vertical extent of the vertically-doped portions, while leaving at least a part of the laterally-doped portions. (e) selectively oxidizing the etched areas of the slice to form isolation regions therein which are in some regions adjacent the retained part of said laterally-doped portions, and (f) completing the device to include active base portions isolated by said oxidized regions, whereby channel inversion is prevented along the isolated boundary of said active base portions.

Claim 2

A method for the fabrication of an integrated semiconductor injection logic circuit having an inverted, multiple-collector transistor wherein the base region includes a plurality of lightly-doped active portions and a heavily-doped extrinsic portion, comprising the steps of: (a) forming a mask layer on a semiconductor slice, said mask layer being resistant to diffusion, etching and oxidation, (b) patterning said mask layer by removing a portion thereof to define mask apertures which expose an area of said slice to be located between two of said base and/or collector portions. (c) selectively diffusing a suitable dopant thru said mask apertures into said exposed area of the semiconductor slice, whereby regions are formed which have both vertically and laterally-doped portions, (d) then selectively etching said exposed area of the slice thru the same mask apertures to remove the full vertical extent of the vertically-doped portions, while leaving at least a part of the laterally-doped portions. (e) selectively oxidizing the etched areas of the slice to form isolation regions therein which are in some regions adjacent the retained part of said laterally-doped portions, and (f) completing the device to include active base portions isolated by said oxidized regions, whereby channel inversion is prevented along the isolated boundary of said active base portions.

Claim 5

A method for the fabrication of a semiconductor circuit including a dielectric isolation region surrounded by a channel-stop diffusion layer including the steps of: (a) patterning a mask layer on the surface of a semiconductor slice to define mask apertures which expose an area thereof where an isolation region is located, (b) selectively diffusing a suitable dopant thru said mask apertures into said exposed area of the semiconductor slice, whereby regions are formed which have both vertically and laterally-doped portions, (c) then selectively etching said exposed area through the same mask apertures to remove the full vertical extent of the vertically-doped portion, while leaving at least a part of the laterally-doped portion, (d) then selectively oxidizing the etched areas of the slice to form isolation regions therein adjacent the retained parts of said laterally-doped portions.

Claim 6

A method for the fabrication of a semiconductor circuit including a dielectric isolation region surrounded by a channel-stop diffusion layer including the steps of: (a) patterning a mask layer on the surface of a semiconductor slice to define mask apertures which expose an area thereof where an isolation region is located, (b) selectively diffusing a suitable dopant thru said mask apertures into said exposed area of the semiconductor slice, whereby regions are formed which have both vertically and laterally-doped portions, (c) then selectively etching said exposed area through the same mask apertures to remove the full vertical extent of the vertically-doped portion, while leaving at least a part of the laterally-doped portion, (d) then selectively oxidizing the etched areas of the slice to form isolation regions therein adjacent the retained parts of said laterally-doped portions.