Anodized articles and process of preparing same

Claim 2

A process for forming anodized porous metal material containing articles which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer, the porous metal oxide-forming layer being thicker than the electrically conductive layer; C. anodizing at least a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous anodized material; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B) and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and thickness of said conductive layer being such that it requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; and then E. treating said electrically conductive layer to render it nonconductive.

Claim 3

The process of claim 1 wherein said dielectric is silicon dioxide or glass.

Claim 4

The process of claim 1 wherein said electrically conductive layer contains material selected from the group consisting of Group IIA metals, Group IVA materials, Group VB substances, and Group VIB metals.

Claim 5

The process of claim 1 wherein the electrically conductive layer contains a member selected from the group consisting of niobium, tantalum, and hafnium.

Claim 6

The process of claim 1 wherein the porous metal oxide-forming layer is at least about 5 times as thick as the electrically conductive layer.

Claim 7

The process of claim 1 wherein said porous metal oxide-forming layer is between about 50 and 250 times as thick as said electrically conductive layer.

Claim 8

The process of claim 1 wherein said metal oxide-forming layer contains aluminum.

Claim 9

The process of claim 1 wherein said metal oxide-forming layer is an aluminum-copper alloy containing at least about 95% by weight of aluminum.

Claim 10

An article obtained by the process of claim 1.

Claim 11

A process for forming anodized porous metal material containing articles which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer, the porous metal oxide-forming layer being thicker than the electrically conductive layer; C. anodizing at least a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous anodized material; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B) and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and thickness of said conductive layer being such that it requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; and then E. oxidizing said electrically conductive layer.

Claim 12

A process for forming anodized porous metal material containing articles which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer, the porous metal oxide-forming layer being thicker than the electrically conductive layer; C. anodizing at least a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous anodized material; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B) and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and thickness of said conductive layer being such that it requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; and then E. oxidizing said electrically conductive layer.

Claim 13

The process of claim 10 wherein oxidizing of the electrically conductive layer includes at least one of the steps of: A. anodization; B. oxidation at elevated temperature in oxygen-containing atmosphere; and C. oxidation due to the presence of a substance which can readily give up oxygen at elevated temperature.

Claim 14

The process of claim 10 which comprises oxidizing said electrically conductive layer in the same anodizing solution as used to anodize the porous metal oxide-forming layer in step (C) but using a higher potential than used in step (C).

Claim 15

The process of claim 10 wherein said electrically conductive layer is selected from the group consisting of niobium, tantalum, and hafnium; said porous metal oxide-forming layer contains aluminum, and said porous metal oxide-forming layer is between about 50 and 250 times as thick as said electrically conductive layer, and which comprises oxidizing said electrically conductive layer in the same anodizing solution as employed in step (C) but using a higher potential than employed in step (C).

Claim 16

The process of claim 10 which includes anodizing the electrically conductive layer.

Claim 17

The process of claim 10 which includes anodizing the electrically conductive layer and then heating the article to temperature sufficient to cause release of water which may be present in the anodized layers as free water, water of hydration or metal hydroxides.

Claim 18

The process of claim 15 which comprises heating the article to about 300° to about 350° C in air.

Claim 19

The process of claim 10 wherein said dielectric is silicon dioxide or glass.

Claim 20

The process of claim 10 wherein the electrically conductive layer contains a member selected from the group consisting of niobium, tantalum, and hafnium.

Claim 21

The process of claim 10 wherein said metal oxide-forming layer contains aluminum.

Claim 22

The process of claim 10 wherein said metal oxide-forming layer is an aluminum-copper alloy containing at least about 95% by weight of aluminum.

Claim 23

A process for forming a multilevel metallurgical integrated structure which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer, wherein the porous metal oxide-forming layer is thicker than the electrically conductive layer; C. anodizing only a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous material while protecting from anodization preselected portions of the porous metal oxide-forming layer which are to form desired electrical connections; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B), and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; E. then treating the electrically conductive layer to render it nonconductive; F. depositing a dielectric or semiconductive layer on the layer containing the anodized porous metal oxide and the desired electrical connections; and G. then repeating steps (A) to (E).

Claim 24

A process for forming a multilevel metallurgical integrated structure which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer, wherein the porous metal oxide-forming layer is thicker than the electrically conductive layer; C. anodizing only a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous material while protecting from anodization preselected portions of the porous metal oxide-forming layer which are to form desired electrical connections; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B), and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; E. then treating the electrically conductive layer to render it nonconductive; F. depositing a dielectric or semiconductive layer on the layer containing the anodized porous metal oxide and the desired electrical connections; and G. then repeating steps (A) to (E).

Claim 25

The process of claim 21 wherein the dielectric layer is silicon containing a multiplicity of semiconductive devices.

Claim 26

The process of claim 21 wherein said electrically conductive layers contain material selected from the group consisting of Group IIA metals, Group IVA materials, Group VB substances, and Group VIB metals.

Claim 27

The process of claim 21 wherein the electrically conductive layer contains a member selected from the group consisting of niobium, tantalum, and hafnium.

Claim 28

The process of claim 21 wherein the porous metal oxide-forming layers are at least about 5 times as thick as the electrically conductive layers.

Claim 29

The process of claim 21 wherein said porous metal oxide-forming layers are between about 50 and 250 times as thick as said electrically conductive layers.

Claim 30

The process of claim 21 wherein said metal oxide-forming layers contain aluminum.

Claim 31

The process of claim 21 wherein said metal oxide-forming layers are aluminum-copper alloy containing at least about 95% by weight of aluminum.

Claim 32

The process of claim 21 which comprises coating said preselected portions of the porous metal oxide-forming layer with a photoresist or electron sensitive resist polymer composition to protect said preselected portions from anodization.

Claim 33

The process of claim 29 which comprises preoxidizing the porous oxide-forming layer to a thickness of approximately the buildup of barrier layer of oxide and just at about the beginning of the formation of porous oxide, and thereafter coating said preselected portions with said photoresist polymer composition.

Claim 34

The process of claim 29 which comprises preoxidizing the porous metal oxide-forming layer to a depth of about 500° to 1200° A, then exposing the preoxidized layer to 1% oxygen in CF 4 plasma at about 50 watt power input at room temperature for about 5 minutes, then heating at about 150° C for about 1 hour in air, next coating said preselected portions with said photoresist or electron sensitive resist polymer composition, then heating at about 75° C for about 1/2 hour, next exposing to the desired pattern followed by developing; next heating at about 110° C for about 20 minutes and then exposing to 1% oxygen in CF 4 plasma at about 50 watt power input at room temperature for about 5 minutes to remove organic residue after development.

Claim 35

A multilevel metallurgical integrated structure obtained by the process of claim 21.

Claim 36

A process for forming a multilevel metallurgical integrated structure which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer; wherein the porous metal oxide-forming layer is thicker than the electrically conductive layer; C. anodizing only a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous material while protecting from anodization preselected portions of the porous metal oxide-forming layer which are to form desired electrical connections; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B), and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; E. then oxidizing the electrically conductive layer; F. depositing a dielectric or semiconductive layer on the layer containing the anodized porous metal oxide and the desired electrical connections; and G. then repeating steps (A) to (E).

Claim 37

A process for forming a multilevel metallurgical integrated structure which comprises: A. depositing an electrically conductive layer on a dielectric layer; B. depositing a porous metal oxide-forming layer on the electrically conductive layer; wherein the porous metal oxide-forming layer is thicker than the electrically conductive layer; C. anodizing only a portion of the porous metal oxide-forming layer through the complete thickness of the layer to provide a layer containing porous material while protecting from anodization preselected portions of the porous metal oxide-forming layer which are to form desired electrical connections; D. the electrically conductive layer deposited in step (A) constituting a material different from the material deposited in step (B), and having a higher conductivity than said substrate, and the conditions of anodization being such that the material deposited in step (A) acts as a valve metal during the anodizing of the porous metal oxide-forming layer and requires a higher potential for its anodization than is required for anodization of the porous metal oxide-forming metallic layer; E. then oxidizing the electrically conductive layer; F. depositing a dielectric or semiconductive layer on the layer containing the anodized porous metal oxide and the desired electrical connections; and G. then repeating steps (A) to (E).

Claim 38

The process of claim 33 wherein oxidizing of the electrically conductive layer includes at least one of the steps of: A. anodization; B. oxidation at elevated temperature in oxygen-containing atmosphere; and C. oxidation due to the presence of a substance which can readily give up oxygen.

Claim 39

The process of claim 33 wherein said electrically conductive layer contains a member selected from the group consisting of niobium, tantalum, and hafnium.

Claim 40

The process of claim 33 wherein said first metal oxide-forming layers contain aluminum.

Claim 41

The process of claim 33 wherein said metal oxide-forming layer is an aluminum-copper alloy containing at least about 95% by weight of aluminum.

Claim 42

The process of claim 33 which comprises treating said electrically conductive layer in the same anodizing solution as used to anodize the porous metal oxide-forming layer in step (C) but employing a higher potential than used in step (C).

Claim 43

The process of claim 33 wherein said electrically conductive layers are selected from the group consisting of niobium, titanium, tantalum, hafnium, amorphous silicon, polycrystalline silicon and magnesium; said porous metal oxide-forming layers are aluminum, and said porous metal oxide-forming layers are between about 50 and 250 times as thick as said electrically conductive layers and treating said electrically conductive layers in the same anodizing solution as employed in step (C) but employing a higher potential than used in step (C).

Claim 44

The process of claim 21 wherein the temperature of the anodization of step (C) is selected to render the height of the porous metal oxide more level with that of the unanodized metal.

Claim 45

The process of claim 33 which includes anodizing the electrically conductive layer.

Claim 46

The process of claim 33 which includes anodizing the electrically conductive layer and then heating the article to temperature sufficient to cause release of water which may be present in the anodized layers as free water, water of hydration or metal hydroxides.

Claim 47

The process of claim 42 which comprises heating the article to about 300° to about 350° C in air.

Claim 48

An anodized porous metal oxide-containing article which comprises: A. a dielectric layer; B. an anodized porous metal material containing layer on said dielectric layer; C. a nonelectrically conductive layer obtained from a conductive layer interposed between the anodized porous metal oxide-containing layer and the dielectric layer; and D. the anodized porous metal material containing layer being thicker than the nonelectrically conductive layer and being different material than said nonelectrically conductive layer.

Claim 49

An anodized porous metal oxide-containing article which comprises: A. a dielectric layer; B. an anodized porous metal material containing layer on said dielectric layer; C. a nonelectrically conductive layer obtained from a conductive layer interposed between the anodized porous metal oxide-containing layer and the dielectric layer; and D. the anodized porous metal material containing layer being thicker than the nonelectrically conductive layer and being different material than said nonelectrically conductive layer.

Claim 50

A multilevel metallurgical integrated structure which comprises: A. a first dielectric layer; B. a first anodized porous material containing layer on the dielectric layer; C. a first nonelectrically conductive layer obtained from an electrically conductive layer interposed between the anodized porous metal oxide-containing layer and the dielectric layer; D. the anodized porous metal oxide-containing layer being thicker than the nonelectrically conductive layer and being different material than said nonelectrically conductive layer; E. the anodized porous metal material containing layer also including unanodized metal portions which form predetermined electrical connections; F. elements (A)-(E) cooperating with one another to form one level of the multilevel metallurgical integrated structure; and G. at least one further level containing the same arrangement of elements described in (A)-(E), with the dielectric layer of the further level being superimposed on the anodized porous metal material containing layer of the one level.

Claim 51

A multilevel metallurgical integrated structure which comprises: A. a first dielectric layer; B. a first anodized porous material containing layer on the dielectric layer; C. a first nonelectrically conductive layer obtained from an electrically conductive layer interposed between the anodized porous metal oxide-containing layer and the dielectric layer; D. the anodized porous metal oxide-containing layer being thicker than the nonelectrically conductive layer and being different material than said nonelectrically conductive layer; E. the anodized porous metal material containing layer also including unanodized metal portions which form predetermined electrical connections; F. elements (A)-(E) cooperating with one another to form one level of the multilevel metallurgical integrated structure; and G. at least one further level containing the same arrangement of elements described in (A)-(E), with the dielectric layer of the further level being superimposed on the anodized porous metal material containing layer of the one level.

Claim 52

The process of claim 33 which comprises treating said electrically conductive layer in an anodizing solution different than that used to anodize the porous metal oxide-forming layer in step (C).