Semiconductor device with novel lead attachments
Abstract
Abstract A header is associated with two leads mediate their ends to form upstanding pin portions. A semiconductive sub-assembly comprised of a stack of junction containing semiconductive elements together with end-most junction-less semiconductive attachment elements are bonded to the pin portions in spaced relation with the header. The semiconductive sub-assembly may be fitted into depressions in the pin portions and a bonding material used to further improve the ohmic connection therebetween. A metal filled settable plastic may be employed for this purpose. The bonding material has an application and setting temperature below the softening temperature of bonding material used to form ohmic interconnections between the elements of the semiconductive subassembly. A passivant and a plastic casement surround the semiconductive sub-assembly. In an alternate form, the leads and attachment elements of the semiconductive sub-assembly are associated with an insulative substrate while the junction containing semiconductive elements remain free of contact with the substrate.
Inventors
- 👤 E Smith
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-03-19 | 1976-09-18 | 1977-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-03-19 | 1980-09-18 | 1981-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-03-19 | 1984-09-18 | 1985-03-20 | $7700.00 | Window Closed / Lapsed |