US3621114A
Expired / Lapsed
US
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Lead frame configuration
Assignee: Motorola Solutions Inc
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Filing: 1969-08-19
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Granted: 1971-11-16
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Expires: 1989-08-19
Abstract
Abstract A lead frame configuration for the concurrent fabrication of a plurality of semiconductor devices. Two lead frame structures, each having an elongated metallic member with a plurality of leads integral with the metallic member and extending substantially perpendicular therefrom in parallel alignment, are axially opposed to one another. The leads of each frame structure are spaced substantially equidistant from each other, joined by an intermediate crossmember substantially parallel to the elongated metallic strip. The opposing ends of each lead frame have a resilient receiving member adapted for contacting a surface of a semiconductor device. The method includes the steps of bonding the semiconductor devices to the lead frames, encapsulating the semiconductor devices and severing the individual semiconductor devices from the completed structure.
Inventors
- 👤 Josef Ref
- 👤 Mort Finhill
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 15:56
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/40; H10W70/421; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12188; Y10T428/12201; Y10T428/12347; Y10T428/12354; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
109 words
An article of manufacture comprising: a. semiconductor elements having portions thereof for making electrical and mechanical contact thereto; b. a first and second metal lead frame each having a plurality of interconnected, substantially parallel leads, the leads of said first lead frame being axially opposed to those of said second lead frame; c. contact means at an end of each of said plurality of leads for contacting said portions of said semiconductor element; d. conductive bonding layers disposed between and joined to each of said semiconductor element portions and said respective contact means; and e. an encapsulating layer disposed about each of said semiconductor elements and the connections thereto.
Claim 2
Dependent Claim
109 words
An article of manufacture comprising: a. semiconductor elements having portions thereof for making electrical and mechanical contact thereto; b. a first and second metal lead frame each having a plurality of interconnected, substantially parallel leads, the leads of said first lead frame being axially opposed to those of said second lead frame; c. contact means at an end of each of said plurality of leads for contacting said portions of said semiconductor element; d. conductive bonding layers disposed between and joined to each of said semiconductor element portions and said respective contact means; and e. an encapsulating layer disposed about each of said semiconductor elements and the connections thereto.
Claim 3
Dependent Claim
29 words
a crossmember connected to said plurality of leads between said elongated strip and an end of said plurality of leads, said crossmember being substantially parallel to said elongated strip;
Claim 4
Dependent Claim
29 words
a crossmember connected to said plurality of leads between said elongated strip and an end of said plurality of leads, said crossmember being substantially parallel to said elongated strip;
Claim 5
Dependent Claim
29 words
a plurality of leads depending from said elongated strip, said leads being substantially parallel and equidistant from each other and approximately at a right angle to said elongated strip;
Claim 6
Dependent Claim
29 words
a plurality of leads depending from said elongated strip, said leads being substantially parallel and equidistant from each other and approximately at a right angle to said elongated strip;
Claim 7
Dependent Claim
17 words
An article of manufacture as in claim 1 wherein said contact means is a resilient, hook-shaped contact.
Claim 8
Dependent Claim
15 words
A lead frame as in claim 1 wherein said leads are equidistant from each other.
Claim 9
Dependent Claim
27 words
a severable metal crossmember connecting said plurality of leads between said elongated strip and ends of said leads, said crossmember being substantially parallel to said elongated strip;
Claim 10
Dependent Claim
27 words
a severable metal crossmember connecting said plurality of leads between said elongated strip and ends of said leads, said crossmember being substantially parallel to said elongated strip;
Claim 11
Dependent Claim
50 words
contact means depending from said lead ends for contacting said portions of said semiconductor element; c. conductive bonding layers disposed between and joined to each of said semiconductor element portions and said respective contact means; and d. an encapsulating layer disposed about each of said semiconductor elements and connections thereto.
Claim 12
Dependent Claim
50 words
contact means depending from said lead ends for contacting said portions of said semiconductor element; c. conductive bonding layers disposed between and joined to each of said semiconductor element portions and said respective contact means; and d. an encapsulating layer disposed about each of said semiconductor elements and connections thereto.
Claim 13
Dependent Claim
29 words
An article of manufacture comprising: a. semiconductor elements having portions thereof form making electrical and mechanical contact thereto; b. a pair of metal lead frames, each lead frame comprising:
Claim 14
Dependent Claim
29 words
An article of manufacture comprising: a. semiconductor elements having portions thereof form making electrical and mechanical contact thereto; b. a pair of metal lead frames, each lead frame comprising:
Claim 15
Dependent Claim
81 words
a substantially hook-shaped contact at said end of each of said plurality of leads; c. a conductive bonding layer disposed between and joined to each of said first and second portions of each of said semiconductor elements and one of said contacts of said first and second lead frames respectively, the leads of said first and second lead frames being axially opposed to one another; and, d. an encapsulating layer disposed about each of said semiconductor elements and the connections thereto.
Claim 16
Dependent Claim
81 words
a substantially hook-shaped contact at said end of each of said plurality of leads; c. a conductive bonding layer disposed between and joined to each of said first and second portions of each of said semiconductor elements and one of said contacts of said first and second lead frames respectively, the leads of said first and second lead frames being axially opposed to one another; and, d. an encapsulating layer disposed about each of said semiconductor elements and the connections thereto.
Claim 17
Dependent Claim
17 words
An article of manufacture as in claim 4 wherein said contact means is a resilient, hook-shaped contact.
Claim 18
Dependent Claim
15 words
A lead frame as in claim 4 wherein said leads are equidistant from each other.
Claim 19
Dependent Claim
17 words
A lead frame as in claim 4 wherein said elongated strips and said cross-sectional members are severable.
Claim 20
Dependent Claim
39 words
An article of manufacture comprising: a. a plurality of semiconductor elements having a first and second portion thereof for makinG electrical and mechanical contact thereto; b. a first and second metal contact frame, each of said lead frames comprising:
Claim 21
Dependent Claim
39 words
An article of manufacture comprising: a. a plurality of semiconductor elements having a first and second portion thereof for makinG electrical and mechanical contact thereto; b. a first and second metal contact frame, each of said lead frames comprising:
Claim 22
Independent Claim
144 words
A method for the fabrication of semiconductor devices comprising the steps of: a. providing a plurality of semiconductor elements having portions thereof for making electrical and mechanical contact thereto; b. providing a first and second metal lead frame comprising a plurality of parallel leads being connected at a first end thereof by a severable elongated strip and at a location between said elongated strip and a second end of said leads by a severable crossmember, said second end being resiliently adapted for mechanical and electrical contact; c. connecting said second end of said first and second lead frames to said portions of said plurality of semiconductor elements establishing said leads of said first and second lead frames in axial opposition with one another; d. encapsulating each of said semiconductor elements and connections thereto; and, e. severing said crossmembers and elongated strips from said leads.
Claim 23
Independent Claim
144 words
A method for the fabrication of semiconductor devices comprising the steps of: a. providing a plurality of semiconductor elements having portions thereof for making electrical and mechanical contact thereto; b. providing a first and second metal lead frame comprising a plurality of parallel leads being connected at a first end thereof by a severable elongated strip and at a location between said elongated strip and a second end of said leads by a severable crossmember, said second end being resiliently adapted for mechanical and electrical contact; c. connecting said second end of said first and second lead frames to said portions of said plurality of semiconductor elements establishing said leads of said first and second lead frames in axial opposition with one another; d. encapsulating each of said semiconductor elements and connections thereto; and, e. severing said crossmembers and elongated strips from said leads.
Claim 24
Dependent Claim
16 words
A method as in claim 9 wherein a semiconductor element of stacked silicon dice is provided.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-11-15 | 1975-05-17 | 1975-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-11-15 | 1979-05-17 | 1979-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-11-15 | 1983-05-17 | 1983-11-16 | $7700.00 | Window Closed / Lapsed |