Patent USRE36907E successfully refreshed from Google Patents.
USRE36907E
Expired / Lapsed
US
⏱️ 0.0 years remaining
Leadframe with power and ground planes
Assignee: Renesas Electronics America Inc
•
Filing: 1997-10-09
•
Granted: 2000-10-10
•
Expires: 2017-10-09
Abstract
Abstract A leadframe for use in an integrated circuit package is described. The leadframe comprises a plurality of electrically conductive leads, a die attach pad, and an electrically conductive ring or rings formed generally around the circumference of the die attach pad and between the die attach pad and leads. In one embodiment, at least one of the leads is formed integrally with each ring. The die attach pad may also be formed integrally with one or more leads. In another embodiment, the ring or rings are formed so that they are electrically isolated from the die attach pad, and the die attach pad, leads, and ring or rings are all formed in substantially the same plane. In some embodiments, the ring or rings are broken into electrically isolated sections. Each of the ring sections (and die attach pad, if appropriate) may be electrically connected to a voltage source outside the integrated circuit package (e.g., a power supply or ground). The leadframe is formed from a single sheet of material by, for instance, stamping or etching. The leadframe may be used in either ceramic or plastic packages. The leadframe reduces switching noise and crosstalk, allows more flexibility in placement of power and/or ground bond pads on the die, and allows provision of ground and power planes in an integrated circuit package that is thinner than previous integrated circuit packages containing both ground and power planes.
Inventors
- 👤 Thomas H. Templeton, Jr.
- 👤 Christopher P. Wyland
- 👤 David L. Campbell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:39
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/411; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 57
Claim 1
Independent Claim
82 words
A .[.leadframe,.]. .Iadd.structure .Iaddend.comprising .Iadd.a single layer, wherein the single layer comprises.Iaddend.: a plurality of electrically conductive leads; a die attach pad on which a semiconductor die can be mounted; and an electrically conductive ring outside a perimeter of the die attach pad, the electrically conductive ring being electrically isolated from the die attach pad and being located between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.
Claim 2
Dependent Claim
82 words
A .[.leadframe,.]. .Iadd.structure .Iaddend.comprising .Iadd.a single layer, wherein the single layer comprises.Iaddend.: a plurality of electrically conductive leads; a die attach pad on which a semiconductor die can be mounted; and an electrically conductive ring outside a perimeter of the die attach pad, the electrically conductive ring being electrically isolated from the die attach pad and being located between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.
Claim 3
Dependent Claim
127 words
A .[.leadframe.]. .Iadd.structure, .Iaddend.comprising: a plurality of electrically conductive leads; a die attach pad on which a semiconductor die can be mounted, wherein the die attach pad is electrically conductive, and at least one of the leads is formed integrally with the die attach pad; .[.and.]. an electrically conductive ring outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.Iadd.; a semiconductor die mounted on the die attach pad, the semiconductor die including bond pads; and electrically conductive bond wires that connect selected ones of the bond pads to selected ones of electrically conductive leads or selected bond locations on the electrically conductive ring.Iaddend..
Claim 4
Dependent Claim
127 words
A .[.leadframe.]. .Iadd.structure, .Iaddend.comprising: a plurality of electrically conductive leads; a die attach pad on which a semiconductor die can be mounted, wherein the die attach pad is electrically conductive, and at least one of the leads is formed integrally with the die attach pad; .[.and.]. an electrically conductive ring outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.Iadd.; a semiconductor die mounted on the die attach pad, the semiconductor die including bond pads; and electrically conductive bond wires that connect selected ones of the bond pads to selected ones of electrically conductive leads or selected bond locations on the electrically conductive ring.Iaddend..
Claim 5
Dependent Claim
20 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, wherein a plurality of leads are formed integrally with the die attach pad.
Claim 6
Dependent Claim
18 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 3, wherein a plurality of leads are formed integrally with the ring.
Claim 7
Dependent Claim
27 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 4, formed by stamping the .[.leadframe.]. .Iadd.die attach pad, the plurality of leads, and the ring .Iaddend.out of a single plate.
Claim 8
Dependent Claim
27 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 4, formed by etching the .[.leadframe.]. .Iadd.die attach pad, the plurality of leads, and the ring .Iaddend.out of a single plate.
Claim 9
Dependent Claim
18 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, wherein a plurality of leads are formed integrally with the ring.
Claim 10
Dependent Claim
21 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 7, wherein the ring is formed in sections that are electrically isolated from each other.
Claim 11
Dependent Claim
53 words
A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, further .[.comprising.]. .Iadd.comprises .Iaddend.a second electrically conductive ring outside a perimeter of the first electrically conductive ring and between one or more of the leads and the first electrically conductive ring, at least one of the leads being formed integrally with the second electrically conductive ring.
Claim 12
Dependent Claim
114 words
A leadframe, comprising: an electrically conductive die attach pad having a surface on which a semiconductor die can be mounted; a plurality of electrically conductive leads, wherein each of the leads has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the die attach pad; and an electrically conductive ring formed between one or more of the leads and the die attach pad, wherein the ring has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the ring.
Claim 13
Dependent Claim
114 words
A leadframe, comprising: an electrically conductive die attach pad having a surface on which a semiconductor die can be mounted; a plurality of electrically conductive leads, wherein each of the leads has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the die attach pad; and an electrically conductive ring formed between one or more of the leads and the die attach pad, wherein the ring has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the ring.
Claim 14
Dependent Claim
30 words
A leadframe as in claim 10, wherein: a plurality of leads are formed integrally with the die attach pad; and a plurality of leads are formed integrally with the ring.
Claim 15
Dependent Claim
20 words
A leadframe as in claim 11, wherein the ring is formed in sections that are electrically isolated from each other.
Claim 16
Dependent Claim
16 words
A leadframe as in claim 10, formed by stamping the leadframe out of a single plate.
Claim 17
Dependent Claim
16 words
A leadframe as in claim 10, formed by etching the leadframe out of a single plate.
Claim 18
Dependent Claim
49 words
A leadframe as in claim 10, further comprising a second electrically conductive ring formed between one or more of the leads and the first electrically conductive ring, wherein the second electrically conductive ring has a surface in substantially the same plane as the surface of the die attach pad.
Claim 19
Dependent Claim
160 words
A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted; a plurality of electrically conductive leads; and an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.
Claim 20
Dependent Claim
160 words
A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted; a plurality of electrically conductive leads; and an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.
Claim 21
Dependent Claim
199 words
A structure comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted, wherein the die attach pad is electrically conductive; a plurality of electrically conductive leads, wherein at least one of the leads is formed integrally with the die attach pad; .[.and.]. an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the die attach pack; at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.
Claim 22
Dependent Claim
199 words
A structure comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted, wherein the die attach pad is electrically conductive; a plurality of electrically conductive leads, wherein at least one of the leads is formed integrally with the die attach pad; .[.and.]. an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the die attach pack; at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.
Claim 23
Dependent Claim
19 words
A structure .Iadd.as .Iaddend.in claim 17, wherein a plurality of leads are formed integrally with the die attach pad.
Claim 24
Dependent Claim
17 words
A structure as in claim 18, wherein a plurality of leads are formed integrally with the ring.
Claim 25
Dependent Claim
31 words
A structure as in claim 19, wherein the .[.leadframe is.]. .Iadd.die attach pad, the plurality of leads, and the ring are .Iaddend.formed by stamping .[.the leadframe out.]. of a single plate.
Claim 26
Dependent Claim
32 words
A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein the .[.leadframe is.]. .Iadd.die attach pad, the plurality of leads, and the ring are .Iaddend.formed by etching .[.the leadframe out.]. of a single plate.
Claim 27
Dependent Claim
23 words
A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein: the die attach pad is a ground plane; and the ring is a power plane.
Claim 28
Dependent Claim
23 words
A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein: the die attach pad is a power plane; and the ring is a ground plane.
Claim 29
Dependent Claim
18 words
A structure as in claim .[.16.]. .Iadd.17.Iaddend., wherein a plurality of leads are formed integrally with the ring.
Claim 30
Dependent Claim
20 words
A structure as in claim 24, wherein the ring is formed in sections that are electrically isolated from each other.
Claim 31
Dependent Claim
28 words
A structure as in claim 25, wherein: a first section of the ring is a ground plane; and a second section of the ring is a power plane.
Claim 32
Dependent Claim
27 words
A structure as in claim 25, wherein at least one section of the ring is held at a different voltage potential than other sections of the ring.
Claim 33
Dependent Claim
22 words
A structure as in claim 17, wherein: the die attach pad is a ground plane; and the ring is a power plane.
Claim 34
Dependent Claim
22 words
A structure as in claim 17, wherein: the die attach pad is a power plane; and the ring is a ground plane.
Claim 35
Dependent Claim
96 words
A structure as in claim 16, .[.wherein: the leadframe.]. further .[.comprises.]. .Iadd.comprising .Iaddend.a second electrically conductive ring.[.;.]..Iadd., wherein:.Iaddend. at least one of the leads is formed integrally with the second electrically conductive ring; the second electrically conductive ring is formed outside the perimeter of the die attach pad and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring; and at least one bond wire is connected between a bond pad and the second electrically conductive ring.
Claim 36
Dependent Claim
26 words
A structure as in claim 30, wherein: the first electrically conductive ring is a ground plane; and the second electrically conductive ring is a power plane.
Claim 37
Dependent Claim
26 words
A structure as in claim 30, wherein: the first electrically conductive ring is a power plane; and the second electrically conductive ring is a ground plane.
Claim 38
Dependent Claim
178 words
A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; a leadframe, the leadframe comprising: a die attach pad having a surface on which the semiconductor die is mounted; a plurality of electrically conductive leads, each having a surface in the same plane as the surface of the die attach pad; and an electrically conductive ring, wherein: the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; and the ring has a surface in substantially the same plane as the surface of the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, leadframe, and bond wires.
Claim 39
Dependent Claim
178 words
A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; a leadframe, the leadframe comprising: a die attach pad having a surface on which the semiconductor die is mounted; a plurality of electrically conductive leads, each having a surface in the same plane as the surface of the die attach pad; and an electrically conductive ring, wherein: the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; and the ring has a surface in substantially the same plane as the surface of the die attach pad; a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and protective, electrically insulative material enclosing the semiconductor die, leadframe, and bond wires.
Claim 40
Dependent Claim
57 words
A structure as in claim 33, wherein: the die attach pad is electrically conductive; at least one of the leads is formed integrally with the die attach pad; and at least one of the leads is formed integrally with the ring; at least one bond wire is connected between a bond pad and the die attach pad.
Claim 41
Dependent Claim
30 words
A structure as in claim 34, wherein: a plurality of leads are formed integrally with the die attach pad; and a plurality of leads are formed integrally with the ring.
Claim 42
Dependent Claim
22 words
A structure as in claim 35, wherein: the die attach pad is a ground plane; and the ring is a power plane.
Claim 43
Dependent Claim
22 words
A structure as in claim 35, wherein: the die attach pad is a power plane; and the ring is a ground plane.
Claim 44
Dependent Claim
20 words
A structure as in claim 35, wherein the ring is formed in sections that are electrically isolated from each other.
Claim 45
Dependent Claim
28 words
A structure as in claim 38, wherein: a first section of the ring is a ground plane; and a second section of the ring is a power plane.
Claim 46
Dependent Claim
27 words
A structure as in claim 38, wherein at least one section of the ring is held at a different voltage potential than other sections of the ring.
Claim 47
Dependent Claim
20 words
A structure as in claim 33, wherein the leadframe is formed by stamping the leadframe out of a metal plate.
Claim 48
Dependent Claim
20 words
A structure as in claim 33, wherein the leadframe is formed by etching the leadframe out of a metal plate.
Claim 49
Dependent Claim
22 words
A structure as in claim 33, wherein: the die attach pad is a ground plane; and the ring is a power plane.
Claim 50
Dependent Claim
22 words
A structure as in claim 33, wherein: the die attach pad is a power plane; and the ring is a ground plane.
Claim 51
Dependent Claim
100 words
A structure as in claim .[.34.]. .Iadd.33.Iaddend., wherein: the leadframe further comprises a second electrically conductive ring; the second electrically conductive ring is outside the perimeter of the die attach pad and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring; the second electrically conductive ring has a surface in substantially the same plane as the surface of the die attach pad; and at least one bond wire is connected between a bond pad and the second electrically conductive ring.
Claim 52
Dependent Claim
26 words
A structure as in claim 45, wherein: the first electrically conductive ring is a ground plane; and the second electrically conductive ring is a power plane.
Claim 53
Dependent Claim
258 words
A structure as in claim 45, wherein: the first electrically conductive ring is a power plane; and the second electrically conductive ring is a ground plane. .Iadd.48. A structure as in claim 1, further comprising: a semiconductor die mounted on the die attach pad, the semiconductor die including bond pads; and electrically conductive bond wires that connect selected ones of the bond pads to selected ones of electrically conductive leads or selected bond locations on the electrically conductive ring..Iaddend..Iadd.49. A structure as in claim 1, wherein the leads, the die attach pad, and the ring are coplanar..Iaddend..Iadd.50. A structure as in claim 2, wherein a single layer comprises the leads, the die attach pad, and the ring..Iaddend..Iadd.51. A structure as in claim 2, wherein the leads, the die attach pad, and the ring are coplanar..Iaddend..Iadd.52. A structure comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed; a plurality of electrically conductive leads; an electrically conductive ring that includes a plurality of sections, wherein: the ring and the leads are coplanar; each section of the ring has at least one of the leads formed integrally with the section; and the ring is outside a perimeter of the semiconductor die and between one or more of the leads and the semiconductor die; and a plurality of electrically conductive bond wires, wherein: at least one of the bond wires is connected between a bond pad and the ring; and at least one of the bond wires is connected between a bond pad and a
Claim 54
Dependent Claim
75 words
selected one of the plurality of leads..Iaddend..Iadd.53. A structure as in claim 52, further comprising a protective, electrically insulative material enclosing the semiconductor die, the ring, and the bond wires..Iaddend..Iadd.54. A structure as in claim 52, wherein for each section of the ring, at least one bond wire is connected between the section and a bond pad on the semiconductor die..Iaddend..Iadd.55. A structure as in claim 52, wherein the sections of the ring include a
Claim 55
Dependent Claim
240 words
ground plane..Iaddend..Iadd.56. A structure as in claim 52, wherein the sections of the ring include a power plane..Iaddend..Iadd.57. A structure as in claim 52, wherein the sections of the ring are electrically isolated from each other, whereby each section can be at a voltage that is independent of voltages of the other sections..Iaddend..Iadd.58. A structure as in claim 57, wherein the sections of the ring include a power plane and a ground plane..Iaddend..Iadd.59. The structure of claim 52, wherein the plurality of leads and the ring are formed by stamping of a single plate..Iaddend..Iadd.60. The structure of claim 52, wherein the plurality of leads and the ring are formed by etching of a single plate..Iaddend..Iadd.61. A structure comprising: a semiconductor die on which circuitry and a plurality of bond pads are formed; a conductive surface on which the semiconductor die is mounted; a plurality of electrically conductive leads; and an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and the electrically conductive ring is and between one or more of the leads and the semiconductor die, the ring being electrically isolated from the electrically conductive surface on which the semiconductor die is mounted; and a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and at least one bond wire is connected between a bond pad and a selected one
Claim 56
Dependent Claim
115 words
of the plurality of leads..Iaddend..Iadd.62. A structure as in claim 61, further comprising a protective, electrically insulative material enclosing the semiconductor die, the ring, and the bond wires..Iaddend..Iadd.63. A structure as in claim 61, further comprising a second electrically conductive ring, wherein: at least one of the leads is formed integrally with the second electrically conductive ring; the second electrically conductive ring is outside the perimeter of the semiconductor die and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring; and at least one bond wire is connected between a bond pad and the second
Claim 57
Dependent Claim
99 words
electrically conductive ring..Iaddend..Iadd.64. A structure as in claim 63, wherein: the first electrically conductive ring is a ground plane; and the second electrically conductive ring is a power plane..Iaddend..Iadd.65. A structure as in claim 63, wherein: the first electrically conductive ring is a power plane; and the second electrically conductive ring is a ground plane..Iaddend..Iadd.66. A structure as in claim 61, wherein the plurality of leads and the ring are formed by stamping of a single plate..Iaddend..Iadd.67. A structure as in claim 61, wherein the plurality of leads and the ring are formed by etching of a single plate..Iaddend.
References Cited (Backward Citations)
US4680613A
Cited
GB2168533A
Cited
US4791473A
Cited
JPS63293869A
Cited
JPH01143246A
Cited
US4933741A
Cited
US4916506A
Cited
US5067005A
Cited
US5068708A
Cited
US4965654A
Cited
US5173767A
Cited
US5060052A
Cited
JPH04130653A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-10 | 2004-04-10 | 2004-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-10 | 2008-04-10 | 2008-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-10 | 2012-04-10 | 2012-10-10 | $7700.00 | Window Closed / Lapsed |