Semiconductor device

Claim 1

A resin-packaged semiconductor device comprising: a semiconductor element having obverse and reverse surfaces and a plurality of electrodes on said obverse surface; an insulating tape peripherally disposed around said semiconductor element and having obverse and reverse surfaces; a plurality of leads, each having inner and outer ends and including a power supply lead, a grounding lead, and signal line leads, fixed to said obverse surface of said insulating tape, said leads being connected at their inner ends to respective electrodes, the outer ends of said leads extending beyond said insulating tape; capacitive circuit means on which said semiconductor element, said insulating tape, and said plurality of leads are mounted, said capacitive circuit means including first and second electrically conductive plates respectively electrically connected to at least one of said plurality of leads and said semiconductor element, and first and second insulating layers, said second insulating layer being disposed between said electrically conductive plates to form a decoupling capacitor, said reverse surface of said semiconductor element being disposed on said first insulating layer; a heat radiating layer disposed on said first insulating layer opposite said semiconductive element for radiating heat generated in the semiconductor device; and a resin encapsulating said semiconductor element, said first and second conductive plates, and said first and second insulating layers, the outer end portions of said leads extending from the resin and at least part of said heat radiating layer not being encapsulated by said resin.