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Fully ion implanted junction field effect transistor

Assignee: United States Department of the Navy
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Filing: 1986-05-07
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Granted: 1987-06-02
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Expires: 2006-05-07
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Abstract

Abstract A method of making a planar junction field-effect transistor in which a semi-insulating substrate of a III-V semiconductor, particularly InP, is ion implanted by two ions to produce both an n-type region and a p-type region. The gate is further defined by selectively etching through the gate-implant region to the source/drain channel.

Inventors

  • 👤 John B. Boos

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 19:49
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/051; H10D30/0512; H10D30/80; H10D30/83; H10D62/00; H10D62/10; H10D62/17; H10D62/343

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 134 words
A field-effect transistor, comprising: a residual substrate essentially consisting of semi-insulating InP; an active region essentially consisting of n-type InP doped with Si, the source end and drain end of which have a surface substantially co-planar with the surface of the residual substrate and which are connected by a source/drain channel part of said active region the upper surface of which is recessed below the surface of said source end and said drain end; a gate consisting of p-type InP doped with Be oerlaying a portion of said source/drain channel but not the entire source/drain channel and contacting said source/drain channel on only one side, a gate contact comprising Au-Zn overlaying said gate; a drain contact comprising eutectic AuGe overlaying said drain end; and a source contact comprising eutectic AuGe overlaying said source end.
Claim 2
Dependent Claim 134 words
A field-effect transistor, comprising: a residual substrate essentially consisting of semi-insulating InP; an active region essentially consisting of n-type InP doped with Si, the source end and drain end of which have a surface substantially co-planar with the surface of the residual substrate and which are connected by a source/drain channel part of said active region the upper surface of which is recessed below the surface of said source end and said drain end; a gate consisting of p-type InP doped with Be oerlaying a portion of said source/drain channel but not the entire source/drain channel and contacting said source/drain channel on only one side, a gate contact comprising Au-Zn overlaying said gate; a drain contact comprising eutectic AuGe overlaying said drain end; and a source contact comprising eutectic AuGe overlaying said source end.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-06-01 1990-12-01 1991-06-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-06-01 1994-12-01 1995-06-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-06-01 1998-12-01 1999-06-02 $7700.00 Window Closed / Lapsed

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