Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
101 words
A configuration terminal for integrated devices, comprising a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 2
Dependent Claim
101 words
A configuration terminal for integrated devices, comprising a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 3
Dependent Claim
30 words
The configuration terminal according to claim 1 , further comprising a local connection area suitable to short circuit said contact terminal with one of said first and second conductive portions.
Claim 4
Dependent Claim
31 words
The configuration terminal according to claim 2 , wherein said local connection area includes a conductive ball connecting the contact terminal and the one of said first and second conductive portions.
Claim 5
Dependent Claim
17 words
The configuration terminal according to claim 2 , wherein said local connection area includes a bonded connection.
Claim 6
Dependent Claim
20 words
The configuration terminal according to claim 1 , wherein said first and second terminals are connected to respective supply references.
Claim 7
Dependent Claim
20 words
The configuration terminal according to claim 1 , wherein said first and second terminals are connected to respective input signals.
Claim 8
Dependent Claim
20 words
The configuration terminal according to claim 1 , wherein said first and second terminals are connected to respective input functions.
Claim 9
Dependent Claim
59 words
The configuration terminal according to claim 1 , wherein each conductive portion comprises: a non-final metallization level connected to the respective terminal of the first and second terminals; a final metallization level completely laterally surrounded by the respective one of the peripheral portions; and a first plurality of vias connecting the non-final metallization level to the final metallization level.
Claim 10
Dependent Claim
57 words
The configuration terminal according to claim 8 , wherein said final metallization level includes first sub-portions connected to said non-final metallization level and the contact terminal includes second sub-portions which are not connected to said non-final metallization level, are interdigitized with the first sub-portions, and extend between opposite sides of the respective one of the peripheral portions.
Claim 11
Dependent Claim
29 words
The configuration terminal according to claim 9 , wherein said interdigitizing of said final metallization level is suitably chosen so as to facilitate a short-circuiting operation of said level.
Claim 12
Dependent Claim
38 words
The configuration terminal according to claim 8 , further comprising an intermediate metallization level interposed between said non-final metallization level and said final metallization level and connected to the final metallization level by a second plurality of vias.
Claim 13
Dependent Claim
26 words
The configuration terminal according to claim 11 , wherein said non-final metallization levels of the first and second conductive portions are connected to respective supply references.
Claim 14
Dependent Claim
13 words
The configuration terminal according to claim 8 wherein said vias comprise metallic plugs.
Claim 15
Dependent Claim
54 words
The configuration terminal according to claim 1 , further comprising a third conductive portion interposed between said first and second conductive portions, said contact terminal including a conductive, unitary third peripheral portion spaced apart from and completely laterally surrounding the third conductive portion, the third peripheral portions being in contact with the central portion.
Claim 16
Dependent Claim
35 words
The configuration terminal according to claim 14 , wherein said third conductive portion is connected to an external reference signal that is transmitted to said contact terminal when the first and second terminals are floating.
Claim 17
Dependent Claim
23 words
The configuration terminal according to claim 15 , wherein the first and second conductive portions are connected to external and internal structures, respectively.
Claim 18
Dependent Claim
32 words
The configuration terminal according to claim 14 , further comprising a local connection area suitable to short-circuit said third conductive portion with at least one of said first and second conductive portions.
Claim 19
Dependent Claim
114 words
A semiconductor-integrated device, comprising: a plurality of address pads; a plurality of supply pins; and a configuration terminal that includes: a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 20
Dependent Claim
114 words
A semiconductor-integrated device, comprising: a plurality of address pads; a plurality of supply pins; and a configuration terminal that includes: a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 21
Dependent Claim
25 words
The semiconductor-integrated device of claim 18 , further comprising a conductive ball connecting the contact terminal and one of said first and second conductive portions.
Claim 22
Dependent Claim
58 words
The semiconductor-integrated device of claim 18 , wherein each conductive portion comprises: a non-final metallization level connected to the respective terminal of said first and second terminals; a final metallization level completely laterally surrounded by the respective one of the peripheral portions; and a first plurality of vias connecting the non-final metallization level to the final metallization level.
Claim 23
Dependent Claim
56 words
The semiconductor-integrated device of claim 20 , wherein said final metallization level includes first portions connected to said non-final metallization level and the contact terminal includes second portions which are not connected to said non-final metallization level, are interdigitized with the first portions, and extend between opposite sides of the respective one of the peripheral portions.
Claim 24
Dependent Claim
40 words
The semiconductor-integrated device of claim 20 , wherein each conductive portion comprises an intermediate metallization level interposed between said non-final metallization level and said final metallization level and connected to the final metallization level by a second plurality of vias.
Claim 25
Dependent Claim
56 words
The semiconductor-integrated device of claim 18 , wherein the configuration terminal includes a third conductive portion interposed between said first and second conductive portions, said contact terminal including a conductive, unitary third peripheral portion spaced apart from and completely laterally surrounding the third conductive portion, the third peripheral portions being in contact with the central portion.
Claim 26
Dependent Claim
119 words
A stacked structure, comprising: a plurality of devices arranged on a plurality of levels, each of said devices having a configuration terminal that includes: a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second conductive terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 27
Dependent Claim
119 words
A stacked structure, comprising: a plurality of devices arranged on a plurality of levels, each of said devices having a configuration terminal that includes: a first conductive portion and a second conductive portion; first and second terminals electrically connected to the first and second conductive portions, respectively; and a contact terminal suitable to be selectively connected to said first and second conductive terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.
Claim 28
Dependent Claim
28 words
The stacked structure of claim 24 , wherein each configuration terminal includes a conductive ball connecting the contact terminal and one of said first and second conductive portions.
Claim 29
Dependent Claim
58 words
The stacked structure of claim 24 , wherein each conductive portion comprises: a non-final metallization level connected to the respective terminal of the first and second terminals; a final metallization level completely laterally surrounded by the respective one of the peripheral portions; and a first plurality of vias connecting the non-final metallization level to the final metallization level.
Claim 30
Dependent Claim
51 words
The stacked structure of claim 26 , wherein said final metallization level includes first portions connected to said non-final metallization level second portions which are not connected to said non-final metallization level, are interdigitized with the first portions, and extend between opposite sides of the respective one of the peripheral portions.
Claim 31
Dependent Claim
39 words
The stacked structure of claim 26 , wherein each conductive portion comprises an intermediate metallization level interposed between said non-final metallization level and said final metallization level and connected to the final metallization by a second plurality of vias.
Claim 32
Dependent Claim
55 words
The stacked structure of claim 24 , wherein the configuration terminal includes a third portion interposed between said first and second conductive portions, said contact terminal including a conductive, unitary third peripheral portion spaced apart from and completely laterally surrounding the third conductive portion, the third peripheral portions being in contact with the central portion.
Claim 33
Dependent Claim
129 words
The semiconductor-integrated device of claim 18 , comprising a stacked structure that includes: a plurality of devices arranged on a plurality of levels, wherein the configuration terminal is one of a plurality of configuration terminals of the devices, respectively, each of said configuration terminals including: a first conductive portion and a second conductive portion first and second terminals; and a contact terminal suitable to be selectively connected to said first and second terminals, the contact terminal including: a conductive central portion; a conductive, unitary first peripheral portion spaced apart from and completely laterally surrounding the first conductive portion; and a conductive, unitary second peripheral portion spaced apart from and completely laterally surrounding the second conductive portion, the first and second peripheral portions being in contact with the central portion.