Patent US7213330B2 successfully refreshed from Google Patents.
US7213330B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating an electronic device
Assignee: Micron Technology Inc
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Filing: 2004-08-17
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Granted: 2007-05-08
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Expires: 2024-08-17
Abstract
Abstract A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component. The masses of conductive material may be formed into columnar members wherein the columnar members are skewed when formed between a pair of relatively offset contact pads.
Inventors
- 👤 John L. Caldwell
- 👤 William J. Casey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:24
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0379; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09427; H05K2203/00; H05K2203/04; H05K2203/048; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/01; H10W72/012; H10W72/01271; H10W72/071; H10W72/072; H10W72/07221; H10W72/07231; H10W72/07234; H10W72/07236; H10W72/07251; H10W72/07254; H10W72/241; H10W72/242; H10W72/244; H10W72/247; H10W72/251; H10W72/252; H10W72/90; H10W72/941; H10W72/9415; H10W72/944; H10W72/9445; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128; Y10T29/4913; Y10T29/49131; Y10T29/49133; Y10T29/49147; Y10T29/49155; Y10T29/49174; Y10T29/49204; Y10T29/49208; Y10T29/4921
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
205 words
A method of fabricating an electronic device, the method comprising: providing a first component having a first plurality of contact pads patterned on a face surface thereof; providing a second component having a second plurality of contact pads patterned on a face surface thereof including: arranging each of the second plurality of contact pads to correspond with an associated one of the first plurality of contact pads when the face surface of the second component is placed in a confronting spaced relationship with the face surface of the first component, laterally offsetting a first contact pad of the second plurality of contact pads relative to its associated one of the first plurality of contact pads in a first direction, and laterally offsetting a second contact pad of the second plurality of contact pads relative to its associated one of the first plurality of contact pads in a second direction different from the first direction; and forming a plurality of conductive columnar members subsequent laterally offsetting a first contact pad and laterally offsetting a second contact pad, each conductive columnar member of the plurality interconnecting a contact pad of the second plurality of contact pads and its associated one of the first plurality of contact pads.
Claim 2
Independent Claim
205 words
A method of fabricating an electronic device, the method comprising: providing a first component having a first plurality of contact pads patterned on a face surface thereof; providing a second component having a second plurality of contact pads patterned on a face surface thereof including: arranging each of the second plurality of contact pads to correspond with an associated one of the first plurality of contact pads when the face surface of the second component is placed in a confronting spaced relationship with the face surface of the first component, laterally offsetting a first contact pad of the second plurality of contact pads relative to its associated one of the first plurality of contact pads in a first direction, and laterally offsetting a second contact pad of the second plurality of contact pads relative to its associated one of the first plurality of contact pads in a second direction different from the first direction; and forming a plurality of conductive columnar members subsequent laterally offsetting a first contact pad and laterally offsetting a second contact pad, each conductive columnar member of the plurality interconnecting a contact pad of the second plurality of contact pads and its associated one of the first plurality of contact pads.
Claim 3
Dependent Claim
36 words
The method according to claim 1 , further comprising substantially symmetrically locating the first contact pad and the second contact pad of the second plurality of contact pads about a defined axis of the electronic device.
Claim 4
Dependent Claim
44 words
The method according to claim 2 , wherein laterally offsetting the second contact pad further includes laterally offsetting the second contact pad by a distance of approximately 30 microns to 150 microns relative to its associated one of the first plurality of contact pads.
Claim 5
Dependent Claim
20 words
The method according to claim 1 , further comprising defining the second direction to be opposite of the first direction.
Claim 6
Dependent Claim
44 words
The method according to claim 1 , wherein laterally offsetting the first contact pad further includes laterally offsetting the first contact pad by a distance of approximately 30 microns to 150 microns relative to its associated one of the first plurality of contact pads.
Claim 7
Dependent Claim
44 words
The method according to claim 1 , wherein laterally offsetting the first contact pad further includes laterally offsetting the first contact pad by a distance of approximately 60 microns to 120 microns relative to its associated one of the first plurality of contact pads.
Claim 8
Dependent Claim
44 words
The method according to claim 6 , wherein laterally offsetting the second contact pad further includes laterally offsetting the second contact pad by a distance of approximately 60 microns to 120 microns relative to its associated one of the first plurality of contact pads.
Claim 9
Dependent Claim
88 words
The method according to claim 1 , wherein forming the plurality of conductive columnar members further comprises: forming a first plurality of conductive bumps disposed on the first plurality of contact pads; forming a second plurality of conductive bumps disposed on the second plurality of contact pads; contacting each of the first plurality of conductive bumps with an associated one of the second plurality of conductive bumps; and melding each of the first plurality of conductive bumps with its associated one of the second plurality of conductive bumps.
Claim 10
Dependent Claim
31 words
The method according to claim 8 , further comprising forming each of the first plurality of conductive bumps and each of the second plurality of conductive bumps of a solder composition.
Claim 11
Dependent Claim
51 words
The method according to claim 9 , wherein melding each of the first plurality of conductive bumps with is associated one of the second plurality of conductive bumps includes reflowing the solder composition of at least one of the first plurality of conductive bumps and the second plurality of conductive bumps.
Claim 12
Dependent Claim
38 words
The method according to claim 9 , further comprising defining the solder composition of the first plurality of conductive bumps and the second plurality of conductive bumps to include 63 percent tin and 27 percent lead by weight.
Claim 13
Dependent Claim
28 words
The method according to claim 8 , further comprising forming the first plurality of conductive bumps and the second plurality of conductive bumps of a material comprising gold.
Claim 14
Dependent Claim
32 words
The method according to claim 1 , further comprising laterally offsetting a majority of the second plurality of contact pads relative to their associated ones of the first plurality of contact pads.
Claim 15
Dependent Claim
50 words
The method according to claim 13 , further comprising arranging the majority of the second plurality of contact pads which are laterally offset relative to their associated ones of the first plurality of contact pads in a pattern which is substantially symmetrical about a defined axis of the electronic device.
Claim 16
Dependent Claim
49 words
The method according to claim 13 , further comprising arranging the majority of the second plurality of contact pads which are laterally offset relative to their associated ones of the first plurality of contact pads in a pattern which is substantially symmetrical about a center of the electronic device.
Claim 17
Dependent Claim
30 words
The method according to claim 1 , wherein providing a first component further comprises providing a semiconductor device and wherein providing a second component further comprises providing a carrier substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2010-05-07 | 2010-11-06 | 2011-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2014-05-07 | 2014-11-06 | 2015-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2018-05-07 | 2018-11-06 | 2019-05-08 | $7700.00 | Window Closed / Lapsed |