Abstract A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the top surface of the substrate body and a pre-solder material is formed on the bumped pads. The wire-bonding pads are disposed on the top surface of the substrate body and a Ni/Au layer is formed on the wire-bonding pads. In order to avoid the bumping pads and the wire-bonding pads from oxidation during packaging processes. The pre-solder material fully covers the bumping pads to avoid the Au intermetallics generated in a plurality of bumps on a bumped chip during packaging processes. The reliability of the multi-chip stacked package for both flip-chip bumping and wire-bonding applications will be greatly improved.
The method for manufacturing a multi-chip package substrate, comprising: providing a substrate body having a top surface and a bottom surface; disposing a plurality of bumping pads and a plurality of wire-bonding pads on the top surface of the substrate body, the wire-bonding pads being arranged around the bumping pads; forming a Ni/Au layer on the wire-bonding pads; and forming a pre-solder material on the bumping pads, further comprising: forming a photoresist layer on the top surface of the substrate body, the photoresist layer having a plurality of openings to expose the wire-bonding pads, the bumping pads being covered by the photoresist layer during forming the Ni/Au layer.
Claim 2
Independent Claim
108 words
The method for manufacturing a multi-chip package substrate, comprising: providing a substrate body having a top surface and a bottom surface; disposing a plurality of bumping pads and a plurality of wire-bonding pads on the top surface of the substrate body, the wire-bonding pads being arranged around the bumping pads; forming a Ni/Au layer on the wire-bonding pads; and forming a pre-solder material on the bumping pads, further comprising: forming a photoresist layer on the top surface of the substrate body, the photoresist layer having a plurality of openings to expose the wire-bonding pads, the bumping pads being covered by the photoresist layer during forming the Ni/Au layer.
Claim 3
Dependent Claim
24 words
The method in accordance with claim 1 , wherein a plurality of ball pads are formed on the bottom surface of the substrate body.
Claim 4
Dependent Claim
18 words
The method in accordance with claim 2 , wherein a protective film is formed on the ball pads.
Claim 5
Dependent Claim
38 words
The method in accordance with claim 3 , wherein the protective film is selected from a group of a Ni/Au layer, a pre-solder material, an organic solderability preservative (OSP), a chemical sputtering Ag layer and a Ni/Pd layer.