US6777796B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked semiconductor chips on a wiring board
Assignee: Adeia Semiconductor Advanced Technologies Inc
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Filing: 2002-12-17
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Granted: 2004-08-17
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Expires: 2022-12-17
Abstract
Abstract A semiconductor device includes: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected to the wiring board via a raised electrode, the circuitry side of the first chip facing the principal surface of the wiring board; and a second semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which includes an external electrode on the circuitry side thereof. The non-circuitry sides of the first and second semiconductor chips are secured to each other. The external electrode of the second semiconductor chip is connected to the wiring board via a metal fine wire. The external and raised electrodes are so disposed as not to overlap each other as viewed vertically downward from over the principal surface of the wiring board.
Inventors
- 👤 Hiroaki Fujimoto
- 👤 Yoshinobu Kunitomo
- 👤 Takashi Yui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:20
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/20; H10W90/24; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
165 words
A semiconductor device comprising: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected to the wiring board via raised electrodes, the circuitry sides of the first semiconductor chip facing a principal surface of the wiring board; and a second semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which includes an external electrodes on the circuitry side thereof, wherein the non-circuitry side of the first and second semiconductor chip are secured to each other, and wherein each of the external electrodes is connected to the wiring board via metal fine wires, and wherein the external electrodes are so disposed as not to overlap with the raised electrodes, and wherein at least one of the side faces of the first semiconductor chip and at least one of the side faces of the second semiconductor chip are almost aligned with each other.
Claim 2
Dependent Claim
165 words
A semiconductor device comprising: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected to the wiring board via raised electrodes, the circuitry sides of the first semiconductor chip facing a principal surface of the wiring board; and a second semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which includes an external electrodes on the circuitry side thereof, wherein the non-circuitry side of the first and second semiconductor chip are secured to each other, and wherein each of the external electrodes is connected to the wiring board via metal fine wires, and wherein the external electrodes are so disposed as not to overlap with the raised electrodes, and wherein at least one of the side faces of the first semiconductor chip and at least one of the side faces of the second semiconductor chip are almost aligned with each other.
Claim 3
Dependent Claim
24 words
The device of claim 1 , wherein the first semiconductor chip and the second semiconductor chip have a thickness of 300 μm or lower.
Claim 4
Dependent Claim
27 words
The device of claim 1 , wherein the external electrodes are provided on the inner side of the second semiconductor chip with respect to the raised electrodes.
Claim 5
Dependent Claim
27 words
The device of claim 1 , wherein the external electrodes are disposed so as to align, and wherein the raised electrodes are disposed so as to align.
Claim 6
Dependent Claim
23 words
The device of claim 1 , wherein the raised electrodes and the wiring board are secured to each other with a conductive adhesive.
Claim 7
Dependent Claim
23 words
The device of claim 1 , wherein the raised electrodes and the wiring board are secured to each other with a low-melting metal.
Claim 8
Dependent Claim
22 words
The device of claim 1 , wherein the raised electrodes are in direct contact with the principle surface of the wiring board.
Claim 9
Dependent Claim
19 words
The device of claim 1 , wherein the first semiconductor chip and the second semiconductor chip are LSI chips.
Claim 10
Dependent Claim
19 words
The device of claim 8 , wherein the combination of chips is a logic chip and a memory chip.
Claim 11
Dependent Claim
28 words
The device of claim 1 , wherein side faces of the second semiconductor chip are on the inner side of the side faces of the first semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-08-17 | 2008-02-16 | 2008-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-08-17 | 2012-02-16 | 2012-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-08-17 | 2016-02-16 | 2016-08-17 | $7700.00 | Window Closed / Lapsed |