US6258626B1
Expired / Lapsed
US
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Method of making stacked chip package
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2000-07-06
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Granted: 2001-07-10
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Expires: 2020-07-06
Abstract
Abstract A method of making a stacked chip package comprises the steps of: (a) placing a first chip onto a substrate in a manner that solder bumps on the first chip are aligned with corresponding flip-chip pads formed on a surface of the substrate; (b) reflowing the solder bumps; (c) attaching a second chip to the first chip through an adhesive layer; (d) curing the adhesive layer; (e) forming an underfill between the first chip and the substrate; (f) curing the underfill; (g) electrically coupling the second chip to corresponding wire-bondable pads formed on the surface of the substrate; and (h) encapsulating the first chip and the second chip against a portion of the surface of the substrate. This invention is characterized in that the adhesive layer is cured before underfilling thereby forming a protection layer on the first chip. Therefore, the cured adhesive layer can help the first chip to resist stresses created during curing process of the underfill, thereby reducing the problem of die cracking.
Inventors
- 👤 Hsueh-Te Wang
- 👤 Su Tao
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:55
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/072; H10W72/073; H10W72/075; H10W72/20; H10W72/251; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W74/00; H10W74/10; H10W74/15; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
181 words
A method of making a stacked chip package comprising the steps of: providing a substrate having opposing upper and lower surfaces, the upper surface of the substrate being provided with a plurality of flip-chip pads and a plurality of wire-bondable pads arranged about the periphery of the flip-chip pads; providing a first chip having a plurality of solder bumps on the active surface thereof; placing the first chip onto the substrate in a manner that the solder bumps of the first chip are aligned with the flip-chip pads of the substrate; reflowing the solder bumps so as to mechanically and electrically attach the first chip to the substrate; providing a second chip having a plurality of bonding pads formed on the active surface thereof; attaching the second chip to the first chip through an adhesive layer; curing the adhesive layer; forming an underfill between the first chip and the substrate; curing the underfill; electrically coupling the second chip to the wire-bondable pads; and encapsulating the first chip and the second chip against a portion of the upper surface of the substrate.
Claim 2
Independent Claim
181 words
A method of making a stacked chip package comprising the steps of: providing a substrate having opposing upper and lower surfaces, the upper surface of the substrate being provided with a plurality of flip-chip pads and a plurality of wire-bondable pads arranged about the periphery of the flip-chip pads; providing a first chip having a plurality of solder bumps on the active surface thereof; placing the first chip onto the substrate in a manner that the solder bumps of the first chip are aligned with the flip-chip pads of the substrate; reflowing the solder bumps so as to mechanically and electrically attach the first chip to the substrate; providing a second chip having a plurality of bonding pads formed on the active surface thereof; attaching the second chip to the first chip through an adhesive layer; curing the adhesive layer; forming an underfill between the first chip and the substrate; curing the underfill; electrically coupling the second chip to the wire-bondable pads; and encapsulating the first chip and the second chip against a portion of the upper surface of the substrate.
Claim 3
Dependent Claim
41 words
The method as claimed in claim 1 , wherein the substrate further comprises a plurality of solder pads on the lower surface of the substrate wherein the solder pads are electrically connected to the flip-chip pads and the wire-bondable pads, respectively.
Claim 4
Dependent Claim
21 words
The method as claimed in claim 2 , further comprising the step of respectively mounting solder balls onto the solder pads.
Claim 5
Dependent Claim
38 words
The method as claimed in claim 1 , wherein the adhesive layer is capable of substantially completely curing in less than 10 minutes at a temperature in the range of about 125° C. up to about 150° C.
Claim 6
Dependent Claim
22 words
The method as claimed in claim 1 , wherein the substrate is formed from polyimide film or fiberglass reinforced BT (bismaleimide-triazine) resin.
Claim 7
Dependent Claim
19 words
The method as claimed in claim 5 , wherein the substrate has a thickness less than about 0.36 Mm.
Claim 8
Independent Claim
200 words
A method of making a stacked chip package comprising the steps of: providing a substrate having opposing upper and lower surfaces, the upper surface of the substrate being provided with a plurality of flip-chip pads and a plurality of wire-bondable pads arranged about the periphery of the flip-chip pads; providing a first chip having a plurality of solder bumps on the active surface thereof; placing the first chip onto the substrate in a manner that the solder bumps of the first chip are aligned with the flip-chip pads of the substrate; reflowing the solder bumps so as to mechanically and electrically attach the first chip to the substrate; forming an underfill between the first chip and the substrate; partially curing the underfill such that it gels but does not harden; providing a second chip having a plurality of bonding pads formed on the active surface thereof; attaching the second chip to the first chip through an adhesive layer; curing the adhesive layer and the underfill between the first chip and the substrate; electrically coupling the second chip to the wire-bondable pads; and encapsulating the first chip and the second chip against a portion of the upper surface of the substrate.
Claim 9
Independent Claim
200 words
A method of making a stacked chip package comprising the steps of: providing a substrate having opposing upper and lower surfaces, the upper surface of the substrate being provided with a plurality of flip-chip pads and a plurality of wire-bondable pads arranged about the periphery of the flip-chip pads; providing a first chip having a plurality of solder bumps on the active surface thereof; placing the first chip onto the substrate in a manner that the solder bumps of the first chip are aligned with the flip-chip pads of the substrate; reflowing the solder bumps so as to mechanically and electrically attach the first chip to the substrate; forming an underfill between the first chip and the substrate; partially curing the underfill such that it gels but does not harden; providing a second chip having a plurality of bonding pads formed on the active surface thereof; attaching the second chip to the first chip through an adhesive layer; curing the adhesive layer and the underfill between the first chip and the substrate; electrically coupling the second chip to the wire-bondable pads; and encapsulating the first chip and the second chip against a portion of the upper surface of the substrate.
Claim 10
Dependent Claim
41 words
The method as claimed in claim 7 , wherein the substrate further comprises a plurality of solder pads on the lower surface of the substrate wherein the solder pads are electrically connected to the flip-chip pads and the wire-bondable pads, respectively.
Claim 11
Dependent Claim
21 words
The method as claimed in claim 8 , further comprising the step of respectively mounting solder balls onto the solder pads.
Claim 12
Dependent Claim
38 words
The method as claimed in claim 7 , wherein the adhesive layer is capable of substantially completely curing in less than 10 minutes at a temperature in the range of about 125° C. up to about 150° C.
Claim 13
Dependent Claim
22 words
The method as claimed in claim 7 , wherein the substrate is formed from polyimide film or fiberglass reinforced BT (bismaleimide-triazine) resin.
Claim 14
Dependent Claim
19 words
The method as claimed in claim 7 , wherein the substrate has a thickness less than about 0.36 mm.
Claim 15
Dependent Claim
26 words
The method as claimed in claim 7 , wherein the maximum exothermic temperature of the adhesive layer is substantially the same as that of the underfill.
Claim 16
Dependent Claim
28 words
The method as claimed in claim 13 , wherein the step of curing the adhesive layer and the underfill comprises curing the adhesive layer and the underfill simultaneously.
Claim 17
Dependent Claim
24 words
The method as claimed in claim 7 , wherein the maximum exothermic temperature of the adhesive layer is lower than that of the underfill.
Claim 18
Dependent Claim
29 words
The method as claimed in claim 15 , wherein the step of curing the adhesive layer and the underfill comprises curing the adhesive layer and then curing the underfill.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-09 | 2005-01-08 | 2005-07-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-09 | 2009-01-08 | 2009-07-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-09 | 2013-01-08 | 2013-07-10 | $7700.00 | Window Closed / Lapsed |