US7060153B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Display device and method of manufacturing the same
Assignee: Semiconductor Energy Laboratory Co Ltd
•
Filing: 2001-01-11
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Granted: 2006-06-13
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Expires: 2021-01-11
Abstract
Abstract To provide a technique for manufacturing a high-performance display device by employing a plastic substrate. A peeling layer is formed on an element-forming substrate, and a semiconductor element and a luminous element are further formed thereon. Then, a fixed substrate ( 130 ) is bonded on the luminous element by using a first adhesive ( 129 ). The entire substrate in this state is exposed in a gas containing halogen fluoride to thereby remove the peeling layer and separate the element-forming substrate. Thereafter, a bonding substrate ( 132 ) that comprises a plastic substrate is bonded in place of the separated element-forming substrate.
Inventors
- 👤 Shunpei Yamazaki
- 👤 Setsuo Nakajima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:25
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10D86/021; H10D86/0214; H10D86/40; H10D86/60; H10K; H10K59/00; H10K59/10; H10K59/12; H10K59/80; H10K59/87; H10K59/871; H10K59/8722; H10K71/00; H10K71/80; H10K50/00; H10K50/80; H10K50/84; H10K50/841; H10K59/1201; H10K59/131; H10K59/17; H10K59/173; H10K59/30; H10K59/38; Y; Y10; Y10S; Y10S156/00; Y10S156/918; Y10S156/919; Y10S156/922; Y10S156/924; Y10S438/00; Y10S438/977; Y10T; Y10T156/00; Y10T156/11; Y10T156/1168; Y10T156/1189
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
86 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on said peeling layer; forming a light emitting element on said insulating layer; bonding a second substrate over said light emitting element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and the first substrate; and bonding a third substrate to said insulating layer by using a second adhesive.
Claim 2
Independent Claim
86 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on said peeling layer; forming a light emitting element on said insulating layer; bonding a second substrate over said light emitting element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and the first substrate; and bonding a third substrate to said insulating layer by using a second adhesive.
Claim 3
Dependent Claim
23 words
A method according to claim 1 , wherein said first adhesive is selected from the group consisting of polyimide, acrylic, and epoxy resin.
Claim 4
Dependent Claim
19 words
A method according to claim 1 , wherein the third substrate comprises the same material as the second substrate.
Claim 5
Independent Claim
115 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on said peeling layer; forming a semiconductor element on said insulating layer; forming at least one interlayer insulating film over the semiconductor element; forming a light emitting element over the interlayer insulating film, the light emitting element electrically connected to said semiconductor element; bonding a second substrate over said light emitting element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and first substrate; and bonding a third substrate to said insulating layer by using a second adhesive.
Claim 6
Independent Claim
115 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on said peeling layer; forming a semiconductor element on said insulating layer; forming at least one interlayer insulating film over the semiconductor element; forming a light emitting element over the interlayer insulating film, the light emitting element electrically connected to said semiconductor element; bonding a second substrate over said light emitting element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and first substrate; and bonding a third substrate to said insulating layer by using a second adhesive.
Claim 7
Dependent Claim
23 words
A method according to claim 4 , wherein said first adhesive is selected from the group consisting of polyimide, acrylic, and epoxy resin.
Claim 8
Dependent Claim
19 words
A method according to claim 4 , wherein the third substrate comprises the same material as the second substrate.
Claim 9
Dependent Claim
25 words
A method according to claim 1 , wherein the first substrate is selected from the group consisting of glass, quartz, silicon, metal, and ceramic substrates.
Claim 10
Dependent Claim
26 words
A method according to claim 1 , wherein the second substrate is selected from the group consisting of plastic, glass, quartz, silicon, metal, and ceramic substrates.
Claim 11
Dependent Claim
13 words
A method according to claim 1 , wherein the peeling layer comprises silicon.
Claim 12
Dependent Claim
15 words
A method according to claim 1 , wherein the insulating layer comprises silicon and oxygen.
Claim 13
Dependent Claim
25 words
A method according to claim 4 , wherein the first substrate is selected from the group consisting of glass, quartz, silicon, metal, and ceramic substrates.
Claim 14
Dependent Claim
26 words
A method according to claim 4 , wherein the second substrate is selected from the group consisting of plastic, glass, quartz, silicon, metal, and ceramic substrates.
Claim 15
Dependent Claim
13 words
A method according to claim 4 , wherein the peeling layer comprises silicon.
Claim 16
Dependent Claim
15 words
A method according to claim 4 , wherein the insulating layer comprises silicon and oxygen.
Claim 17
Independent Claim
113 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on the peeling layer; forming a switching element on the insulating layer; forming at least one interlayer insulating film over the switching element; forming a display element over the interlayer insulating film, the display element electrically connected to the switching element; bonding a second substrate over the display element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding the second substrate to thereby remove the peeling layer and the first substrate; and bonding a third substrate to the insulating layer by using a second adhesive.
Claim 18
Independent Claim
113 words
A method of manufacturing a display device, comprising: forming a peeling layer on a first substrate; forming an insulating layer on the peeling layer; forming a switching element on the insulating layer; forming at least one interlayer insulating film over the switching element; forming a display element over the interlayer insulating film, the display element electrically connected to the switching element; bonding a second substrate over the display element by using a first adhesive; exposing the peeling layer to a gas containing halogen fluoride after bonding the second substrate to thereby remove the peeling layer and the first substrate; and bonding a third substrate to the insulating layer by using a second adhesive.
Claim 19
Dependent Claim
25 words
A method according to claim 15 , wherein the first substrate is selected from the group consisting of glass, quartz, silicon, metal, and ceramic substrates.
Claim 20
Dependent Claim
26 words
A method according to claim 15 , wherein the second substrate is selected from the group consisting of plastic, glass, quartz, silicon, metal, and ceramic substrates.
Claim 21
Dependent Claim
19 words
A method according to claim 15 , wherein the third substrate comprises the same material as the second substrate.
Claim 22
Dependent Claim
23 words
A method according to claim 15 , wherein said first adhesive is selected from the group consisting of polyimide, acrylic, and epoxy resin.
Claim 23
Dependent Claim
16 words
A method according to claim 15 , wherein the display device is an electroluminescence display device.
Claim 24
Dependent Claim
13 words
A method according to claim 15 , wherein the peeling layer comprises silicon.
Claim 25
Dependent Claim
15 words
A method according to claim 15 , wherein the insulating layer comprises silicon and oxygen.
Claim 26
Independent Claim
140 words
A method of manufacturing a display device comprising: forming a peeling layer on a first substrate; forming an insulating layer on the peeling layer; forming active layers, a gate insulating layer, and gate electrodes over the insulating layer; forming a first interlayer insulating layer to cover the gate electrodes; forming wirings and pixel electrodes over the first interlayer insulating layer, the wirings and the pixel electrodes electrically connected with the active layers, respectively; exposing the peeling layer to a gas containing halogen fluoride to thereby remove the peeling layer; forming a light emitting layer and a cathode on at least one of the pixel electrodes; bonding a second substrate on the cathode by using a first adhesive; removing the first substrate after bonding the second substrate; and bonding a third substrate to the insulating layer by using a second adhesive.
Claim 27
Independent Claim
140 words
A method of manufacturing a display device comprising: forming a peeling layer on a first substrate; forming an insulating layer on the peeling layer; forming active layers, a gate insulating layer, and gate electrodes over the insulating layer; forming a first interlayer insulating layer to cover the gate electrodes; forming wirings and pixel electrodes over the first interlayer insulating layer, the wirings and the pixel electrodes electrically connected with the active layers, respectively; exposing the peeling layer to a gas containing halogen fluoride to thereby remove the peeling layer; forming a light emitting layer and a cathode on at least one of the pixel electrodes; bonding a second substrate on the cathode by using a first adhesive; removing the first substrate after bonding the second substrate; and bonding a third substrate to the insulating layer by using a second adhesive.
Claim 28
Dependent Claim
25 words
A method according to claim 23 , wherein the first substrate is selected from the group consisting of glass, quartz, silicon, metal, and ceramic substrates.
Claim 29
Dependent Claim
26 words
A method according to claim 23 , wherein the second substrate is selected from the group consisting of plastic, glass, quartz, silicon, metal, and ceramic substrates.
Claim 30
Dependent Claim
19 words
A method according to claim 23 , wherein the third substrate comprises the same material as the second substrate.
Claim 31
Dependent Claim
23 words
A method according to claim 23 , wherein said first adhesive is selected from the group consisting of polyimide, acrylic, and epoxy resin.
Claim 32
Dependent Claim
13 words
A method according to claim 23 , wherein the peeling layer comprises silicon.
Claim 33
Dependent Claim
15 words
A method according to claim 23 , wherein the insulating layer comprises silicon and oxygen.
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