Power module and production method thereof

Claim 2

A power module comprising: a circuit board including plural first devices and plural second devices mounted thereto, said circuit board and said plural first and second devices constituting an electric power conversion circuit, said plural first devices each having a high heating value, a heat sink, and a member having electrical insulation characteristics and high thermal conductivity, that is disposed between said plural first and second devices and said heat sink, said member having a first portion and a second portion, wherein said first portion of said member adheres to each of said plural first devices for transferring heat from said plural first devices to said heat sink, and wherein said second portion of said member is spaced from and not in contact with said plural first and second devices, and said circuit board and said member remaining substantially uniform in thickness at said second portion of said member.

Claim 3

A power module in accordance with claim 1 , wherein said heat sink has a depressed portion and said member is filled in said depressed portion.

Claim 4

A power module in accordance with claim 1 , wherein said member has thermosetting resin and inorganic filler as chief ingredients.

Claim 5

A power module in accordance with claim 1 , wherein all of said plural first and second devices are short in height and mounted to a side of said circuit board that faces said heat sink.

Claim 6

A power module comprising: a circuit board having first and second surfaces, each said first and second surfaces including plural first devices and plural second devices mounted thereto, said circuit board and said plural first and second devices constituting an electric power conversion circuit, said plural first devices each having a high heating value; first and second heat sinks mounted on the first and second surfaces of said circuit board, respectively; and first and second members mounted on the first and second surfaces of said circuit board, respectively, each said member having electrical insulation characteristics and high thermal conductivity, each said member having a first portion and a second portion, wherein said first member is disposed between said plural first and second devices and said first heat sink, and said second member is disposed between said plural first and second devices and said second heat sink, wherein said first portion of said first member adheres to each of said plural first devices for transferring heat from said plural first devices to said first heat sink, said second portion of said first member is spaced from and not in contact with said plural first and second devices and said circuit board, and said first member remains substantially uniform in thickness at said second portion of said first member, and wherein said first portion of said second member adheres to each of said plural first devices for transferring heat from said plural first devices to said second heat sink, said second portion of said second member is spaced from and not in contact with said plural first and second devices and said circuit board, and said second member remains substantially uniform in thickness at said second portion of said second member.

Claim 7

A power module comprising: a circuit board having first and second surfaces, each said first and second surfaces including plural first devices and plural second devices mounted thereto, said circuit board and said plural first and second devices constituting an electric power conversion circuit, said plural first devices each having a high heating value; first and second heat sinks mounted on the first and second surfaces of said circuit board, respectively; and first and second members mounted on the first and second surfaces of said circuit board, respectively, each said member having electrical insulation characteristics and high thermal conductivity, each said member having a first portion and a second portion, wherein said first member is disposed between said plural first and second devices and said first heat sink, and said second member is disposed between said plural first and second devices and said second heat sink, wherein said first portion of said first member adheres to each of said plural first devices for transferring heat from said plural first devices to said first heat sink, said second portion of said first member is spaced from and not in contact with said plural first and second devices and said circuit board, and said first member remains substantially uniform in thickness at said second portion of said first member, and wherein said first portion of said second member adheres to each of said plural first devices for transferring heat from said plural first devices to said second heat sink, said second portion of said second member is spaced from and not in contact with said plural first and second devices and said circuit board, and said second member remains substantially uniform in thickness at said second portion of said second member.