US6282092B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic circuit device and method of fabricating the same
Assignee: Honda Motor Co Ltd
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Filing: 1999-05-28
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Granted: 2001-08-28
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Expires: 2019-05-28
Abstract
Abstract An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface and the case is united with a radiating fin in one body. The metal substrate is installed in the case such that the metal substrate serves as a cap of the case and the first surface of the metal substrate faces to the case. A resin is provided to fill up a space between the metal substrate and the case, whereby heat generated from the electronic parts is dissipated to the exterior from both the radiating fin and the second surface of the metal substrate.
Inventors
- 👤 Mikio Okamoto
- 👤 Katsumi Ebara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:40
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20845; H05K7/20854; H05K5/00; H05K5/0026; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W90/00
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
181 words
An electronic circuit device comprising: a metal substrate having a first surface and a second surface; electronic parts mounted on only the first surface of said metal substrate; a case including a radiating fin which is of a one-piece structure therewith, said case having said metal substrate housed therein, wherein said metal substrate serves as a cap of said case, and the first surface of said metal substrate faces an interior region of said case; and a resin disposed in a space between said metal substrate and said interior region of said case, wherein both said radiating fin and the second surface of said metal substrate dissipate heat generated from said electronic parts to an exterior of said case, wherein said case defines a first area at which said case is distanced from said metal substrate with a first interval therebetween providing a least amount of space needed for enclosing said electronic parts, and a second area at which said case is distanced from said metal substrate with a second interval therebetween, said first interval being smaller than said second interval.
Claim 2
Dependent Claim
181 words
An electronic circuit device comprising: a metal substrate having a first surface and a second surface; electronic parts mounted on only the first surface of said metal substrate; a case including a radiating fin which is of a one-piece structure therewith, said case having said metal substrate housed therein, wherein said metal substrate serves as a cap of said case, and the first surface of said metal substrate faces an interior region of said case; and a resin disposed in a space between said metal substrate and said interior region of said case, wherein both said radiating fin and the second surface of said metal substrate dissipate heat generated from said electronic parts to an exterior of said case, wherein said case defines a first area at which said case is distanced from said metal substrate with a first interval therebetween providing a least amount of space needed for enclosing said electronic parts, and a second area at which said case is distanced from said metal substrate with a second interval therebetween, said first interval being smaller than said second interval.
Claim 3
Dependent Claim
30 words
An electronic circuit device according to claim 1 , wherein said case further defines a third area at which said case is brought into close contact with said metal substrate.
Claim 4
Dependent Claim
23 words
An electronic circuit device according to claim 2 , wherein said first interval is not larger than one half of said second interval.
Claim 5
Dependent Claim
77 words
An electronic circuit device according to claim 3 , wherein said metal substrate has a conductive pattern formed on an insulating film formed over a metal plate, and said electronic parts includes flat package parts mounted on said conductive pattern and in the first area of said case and a plurality of electrodes, mounted on said conductive pattern and in the second area of said case, for electrically connecting said electronic circuit device to an external circuit.
Claim 6
Dependent Claim
43 words
An electronic circuit device according to claim 2 , wherein said case and said metal substrate have mounting holes for use of fixing said case and said metal substrate to each other, said holes being provided in the third area of said case.
Claim 7
Dependent Claim
21 words
An electronic circuit device according to claim 1 , wherein said second surface of said metal substrate protrudes from said case.
Claim 8
Dependent Claim
50 words
An electronic circuit device according to claim 1 , wherein said case has a guide for positionally fixing said metal substrate to prevent the positional deviation of said metal substrate, said guide bringing said case into close contact with said metal substrate along an outer periphery of said metal substrate.
Claim 9
Independent Claim
159 words
A method of fabricating an electronic circuit device, the method comprising the steps of: mounting electronic parts on a metal substrate having a first surface and a second surface, said electronic parts being mounted on only the first surface of said metal substrate, said electronic parts including a plurality of electrodes for connecting said electronic circuit device to an external circuit; installing said metal substrate in a case including a radiating fin which is of a one-piece structure therewith, wherein said metal substrate serves as a cap of said case and the first surface of said metal substrate faces an interior region of said case, said case being provided with an opening for drawing out said plurality of electrodes to an exterior; injecting laterally a resin into said interior region between said metal substrate and said case from said opening of said case; and inserting a member into said opening of said case to protect said plurality of electrodes.
Claim 10
Independent Claim
159 words
A method of fabricating an electronic circuit device, the method comprising the steps of: mounting electronic parts on a metal substrate having a first surface and a second surface, said electronic parts being mounted on only the first surface of said metal substrate, said electronic parts including a plurality of electrodes for connecting said electronic circuit device to an external circuit; installing said metal substrate in a case including a radiating fin which is of a one-piece structure therewith, wherein said metal substrate serves as a cap of said case and the first surface of said metal substrate faces an interior region of said case, said case being provided with an opening for drawing out said plurality of electrodes to an exterior; injecting laterally a resin into said interior region between said metal substrate and said case from said opening of said case; and inserting a member into said opening of said case to protect said plurality of electrodes.
Claim 11
Dependent Claim
22 words
An electronic circuit device according to claim 1 , wherein said radiating fin is located at said first area of said case.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-27 | 2005-02-26 | 2005-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-27 | 2009-02-26 | 2009-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-27 | 2013-02-26 | 2013-08-28 | $7700.00 | Window Closed / Lapsed |