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US7037455B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Insert molding method

Assignee: Mattel Inc
•
Filing: 2002-12-20
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Granted: 2006-05-02
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Expires: 2022-12-20
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Abstract

Abstract A method of insert molding a preformed item into a molded product, the molded product being formed by injecting a moldable material into a mold, is disclosed. The method includes adhering the preformed item to a surface of the mold with an adhesive, wherein the surface to which the preformed item is adhered is free of any features provided for holding the preformed item in place on the mold surface. The method next includes injecting the moldable material into the mold such that the moldable material at least partially surrounds the preformed item, and curing the moldable material. Articles molded via the disclosed method are also described.

Inventors

  • 👤 Jon C. Marine

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 17:33
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; A; A63; A63H; A63H3/00; A63H3/36; A63H9/00; B29C39/00; B29C39/02; B29C39/10; B29C41/00; B29C41/02; B29C41/20; B29C45/14639; B29C45/14065; B29C2045/14114; B29C41/04; B29C41/18; B29C70/00; B29C70/68; B29C70/681; B29C70/683; B29K; B29K2713/00; B29L; B29L2031/00; B29L2031/52; B29L2031/5209; B29L2031/5218

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 142 words
A method of insert molding an electronic element into a molded product, the molded product being formed by injecting a moldable material into a mold, the method comprising: adhering the electronic element to a surface of the mold with an adhesive configured to decompose with heat and/or pressure in the molding process, wherein the surface to which the electronic element is adhered is free of any features provided for holding the electronic element in place on the mold surface; injecting the moldable material into the mold such that the moldable material at least partially surrounds the electronic element; and curing the moldable material, decomposing the adhesive with heat and/or pressure to reduce the amount of any residue wherein the molded product is a doll, and wherein the electronic element includes a controller configured to control an interactive feature incorporated into the doll.
Claim 2
Independent Claim 142 words
A method of insert molding an electronic element into a molded product, the molded product being formed by injecting a moldable material into a mold, the method comprising: adhering the electronic element to a surface of the mold with an adhesive configured to decompose with heat and/or pressure in the molding process, wherein the surface to which the electronic element is adhered is free of any features provided for holding the electronic element in place on the mold surface; injecting the moldable material into the mold such that the moldable material at least partially surrounds the electronic element; and curing the moldable material, decomposing the adhesive with heat and/or pressure to reduce the amount of any residue wherein the molded product is a doll, and wherein the electronic element includes a controller configured to control an interactive feature incorporated into the doll.
Claim 3
Dependent Claim 15 words
The method of claim 1 , wherein the electronic element is a printed circuit board.
Claim 4
Dependent Claim 18 words
The method of claim 2 , wherein the printed circuit board includes circuits formed with surface mount components.
Claim 5
Dependent Claim 19 words
The method of claim 1 , wherein the adhesive is applied to the electronic element via a release sheet.
Claim 6
Dependent Claim 14 words
The method of claim 1 , wherein the adhesive is a block copolymer adhesive.
Claim 7
Dependent Claim 13 words
The method of claim 1 , wherein the adhesive is a pressure-sensitive adhesive.
Claim 8
Dependent Claim 33 words
The method of claim 1 , wherein the adhesive is applied to the electronic element in a layer having a thickness of 0.002–0.005 inches before the electronic element is adhered to the mold.
Claim 9
Dependent Claim 27 words
The method of claim 1 , wherein injecting the moldable material into the mold includes reaction injection molding with at least two reactive components into the mold.
Claim 10
Dependent Claim 21 words
The method of claim 1 , wherein the moldable material is selected from the group consisting of ABS plastic and elastomers.
Claim 11
Dependent Claim 30 words
The method of claim 1 , further comprising removing the molded product from the mold after curing the moldable material, and then coating any remaining adhesive with an inert substance.
Claim 12
Dependent Claim 13 words
The method of claim 10 , wherein the inert substance is talcum powder.
Claim 13
Dependent Claim 16 words
The method of claim 1 , wherein the doll is molded via a roto-casting molding process.
Claim 14
Dependent Claim 16 words
The method of claim 1 , wherein the doll is molded via a slush molding process.
Claim 15
Dependent Claim 27 words
The method of claim 1 , further comprising adhering a piece of fabric to a surface of the mold before injecting the moldable material into the mold.
Claim 16
Dependent Claim 48 words
The method of claim 14 , wherein the doll includes a head having an eye, and wherein the piece of fabric is adhered to the mold in a location such that the piece of fabric is insert molded into the head adjacent the eye of the doll's head.
Claim 17
Dependent Claim 41 words
The method of claim 1 , further comprising adhering a support piece configured to support a shape of a surface feature of a face of the doll to a surface of the mold before injecting the moldable material into the mold.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2009-05-01 2009-10-31 2010-05-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2013-05-01 2013-10-31 2014-05-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2017-05-01 2017-10-31 2018-05-02 $7700.00 Window Closed / Lapsed

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