Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
145 words
Method of manufacturing a smart card having a thermoplastic material card body with substantially parallel major sides; a support member with a graphic on at least one side; and an electronic module comprising a contact array to one side of which is fixed a chip including an integrated circuit, comprising the steps of: placing said support member in a mold comprising a hollow space defining volume and shape of said card and delimited by first and second main walls corresponding to the major sides of said card; holding said support member against said first main wall of said mold; injecting a thermoplastic material into the volume defined by said hollow space to fill that portion of said volume not occupied by said support member; and then inserting said electronic module at an appropriate position in said thermoplastic material before said injected material has solidified completely.
Claim 2
Dependent Claim
145 words
Method of manufacturing a smart card having a thermoplastic material card body with substantially parallel major sides; a support member with a graphic on at least one side; and an electronic module comprising a contact array to one side of which is fixed a chip including an integrated circuit, comprising the steps of: placing said support member in a mold comprising a hollow space defining volume and shape of said card and delimited by first and second main walls corresponding to the major sides of said card; holding said support member against said first main wall of said mold; injecting a thermoplastic material into the volume defined by said hollow space to fill that portion of said volume not occupied by said support member; and then inserting said electronic module at an appropriate position in said thermoplastic material before said injected material has solidified completely.
Claim 3
Dependent Claim
76 words
Method according to claim 1, further comprising the steps of accommodating said electronic module in a cavity which opens into said second main wall of the mold in such a way as to communicate with said hollow space, and moving said module from a first position in which it is retracted and does not project beyond said second wall of the mold to a second position in which said electronic module is in an extended position.
Claim 4
Dependent Claim
13 words
Method according to claim 1 wherein said electronic module is inserted under pressure.
Claim 5
Dependent Claim
56 words
Method according to claim 1 wherein the respective materials of said card body and said electronic module are such that, in the liquid or viscous state, due to temperature and pressure, when the electronic module is inserted, intermolecular chemical bonds are formed between the material of the card body and the material of the electronic module.
Claim 6
Dependent Claim
24 words
Method according to claim 4 wherein the card body material is acrilonitrile-butadiene-styrene (ABS) and the electronic module material is polyamide (PA) or polybutyleneteraphtalate (PBT).
Claim 7
Dependent Claim
27 words
Method according to claim 4 wherein the card body material is polycarbonate (PC) and the electronic module material is the same material or polyamide or polybutyleneteraphtalate (PBT).
Claim 8
Dependent Claim
20 words
Method according to claim 4 wherein the respective materials of said card body and said electronic module comprise benzene rings.
Claim 9
Dependent Claim
33 words
Method according to claim 1 wherein said electronic module is inserted in said hollow space after a time lapse from injection of the material into the hollow space of less than one second.
Claim 10
Dependent Claim
20 words
Method according to claim 4 wherein the respective materials of said card body and said electronic module comprise --C═CO groups.
Claim 11
Dependent Claim
34 words
Method according to claim 8 wherein said electronic module is inserted in said hollow space after a time lapse from injection of the material into the hollow space of between 0.1 and 0.5 seconds.