Patent US6876069B2 successfully refreshed from Google Patents.
US6876069B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ground plane for exposed package
Assignee: Stats Chippac Pte Ltd
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Filing: 2003-06-16
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Granted: 2005-04-05
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Expires: 2023-06-16
Abstract
Abstract A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.
Inventors
- 👤 Jefferey D. Punzalan
- 👤 Hien Boon Tan
- 👤 Zheng Zheng
- 👤 Jae Hak Yee
- 👤 Byung Joon Han
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
107 words
An interface for mounting a semiconductor device in a semiconductor package, comprising: a die attach paddle; a leadframe; and a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle.
Claim 2
Dependent Claim
107 words
An interface for mounting a semiconductor device in a semiconductor package, comprising: a die attach paddle; a leadframe; and a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle.
Claim 3
Dependent Claim
45 words
The interface of claim 1 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 4
Dependent Claim
20 words
The interface of claim 1 , said ground-plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 5
Dependent Claim
206 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said around plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 6
Dependent Claim
206 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said around plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 7
Dependent Claim
27 words
The semiconductor device package of claim 4 , said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires.
Claim 8
Dependent Claim
15 words
The semiconductor device package of claim 4 , said second conductive interconnects comprising ground wires.
Claim 9
Dependent Claim
47 words
The semiconductor device package of claim 4 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 10
Dependent Claim
23 words
The semiconductor device package of claim 4 , said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 11
Dependent Claim
146 words
An interface for mounting a semiconductor device in a semiconductor package, comprising: a die attach paddle; a leadframe; and a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle.
Claim 12
Dependent Claim
146 words
An interface for mounting a semiconductor device in a semiconductor package, comprising: a die attach paddle; a leadframe; and a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle.
Claim 13
Dependent Claim
21 words
The interface of claim 9 , said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 14
Dependent Claim
225 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 15
Dependent Claim
225 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 16
Dependent Claim
15 words
The semiconductor device package of claim 11 , said second conductive interconnects comprising ground wires.
Claim 17
Dependent Claim
47 words
The semiconductor device package of claim 11 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 18
Dependent Claim
23 words
The semiconductor device package of claim 11 , said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 19
Dependent Claim
232 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 20
Dependent Claim
232 words
A semiconductor device package, comprising: a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle; a leadframe; a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said ground plane comprising separated layers of metal spatially surrounding said die attach paddle; first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires; and a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 21
Dependent Claim
47 words
The semiconductor device package of claim 15 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 22
Dependent Claim
23 words
The semiconductor device package of claim 15 , said ground plane comprising a square or rectangular geometric shape when viewed in top view.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-04-04 | 2008-10-04 | 2009-04-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-04-04 | 2012-10-04 | 2013-04-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-04-04 | 2016-10-04 | 2017-04-05 | $7700.00 | Window Closed / Lapsed |