Patent US6812063B2 successfully refreshed from Google Patents.
US6812063B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package and fabricating method thereof
Assignee: Siliconware Precision Industries Co Ltd
•
Filing: 2003-07-25
•
Granted: 2004-11-02
•
Expires: 2023-07-25
Abstract
Abstract A semiconductor package and a fabricating method thereof are proposed. The semiconductor package includes a semiconductor chip; a plurality of leads surrounding the chip and formed with a plurality of connecting mechanisms and strengthening structures; and an encapsulant for encapsulating the chip and the leads. The foregoing semiconductor package eliminates the use of a die pad, allowing the thickness of the package to be reduced and a surface of the chip to be exposed to the outside of the encapsulant for improving the heat dissipating efficiency thereof. The leads have the same height as the semiconductor package, allowing upper and lower surfaces of the leads to be exposed to the outside of the encapsulant, which further enhance the dissipation of heat generated by the chip in operation. The strengthening structures of the leads significantly enhance the bonding strength between the leads and the encapsulant for preventing delamination or crack from occurrence, so that quality and liability of the semiconductor package can be assured.
Inventors
- 👤 Chien Ping Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:53
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07302; H10W72/07304; H10W72/075; H10W72/07502; H10W72/07504; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/131; H10W74/142; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
148 words
A fabricating method of a semiconductor package, comprising the steps of: providing a lead frame having a plurality of leads extending inwardly from a frame of the lead frame, wherein the leads are formed with strengthening structures on sides thereof, and connecting mechanisms are on surfaces of inner sides of the leads; attaching a supporting carrier to a bottom surface of the lead frame; mounting a semiconductor chip having a first surface and a second surface in a space on the carrier, wherein the space is predefined by the frame of the lead frame and the leads; electrically connecting the first surface of the chip to the corresponding connecting mechanisms of the leads; performing a molding process to form an encapsulant in the space defined by the frame of the lead frame and the leads; removing the carrier; and performing a singulating process to form individual semiconductor packages.
Claim 2
Dependent Claim
148 words
A fabricating method of a semiconductor package, comprising the steps of: providing a lead frame having a plurality of leads extending inwardly from a frame of the lead frame, wherein the leads are formed with strengthening structures on sides thereof, and connecting mechanisms are on surfaces of inner sides of the leads; attaching a supporting carrier to a bottom surface of the lead frame; mounting a semiconductor chip having a first surface and a second surface in a space on the carrier, wherein the space is predefined by the frame of the lead frame and the leads; electrically connecting the first surface of the chip to the corresponding connecting mechanisms of the leads; performing a molding process to form an encapsulant in the space defined by the frame of the lead frame and the leads; removing the carrier; and performing a singulating process to form individual semiconductor packages.
Claim 3
Dependent Claim
39 words
The fabricating method of claim 1 , wherein the connecting mechanisms are electrically connected to the chip by means of metal wires having two ends thereof respectively welded at the first surface of the chip and the connecting mechanisms.
Claim 4
Dependent Claim
39 words
The fabricating method of claim 1 , wherein the connecting mechanisms extend to a position above the first surface of the chip and are electrically connected to the chip through solder balls by a TAB (tape automated bonding) process.
Claim 5
Dependent Claim
35 words
The fabricating method of claim 1 , wherein the leads formed with the connecting mechanisms have an integral cross section of a L-like shape, an inverted T shape, a cross-like shape or an inverted-L shape.
Claim 6
Dependent Claim
15 words
The fabricating method of claim 1 , wherein the strengthening structures are sides having gradients.
Claim 7
Dependent Claim
20 words
The fabricating method of claim 1 , wherein the strengthening structures are protrusions formed on the sides of the leads.
Claim 8
Dependent Claim
21 words
The fabricating method of claim 1 , wherein the strengthening structures are embossed patterns formed on the sides of the leads.
Claim 9
Dependent Claim
24 words
The fabricating method of claim 1 , wherein the strengthening structures are a plurality of recess holes formed on the sides of the leads.
Claim 10
Dependent Claim
24 words
The fabricating method of claim 1 , wherein the strengthening structures are a plurality of protruding points formed on the sides of the leads.
Claim 11
Dependent Claim
20 words
The fabricating method of claim 1 , wherein the molding process utilizes upper and lower molds with no mold cavity.
Claim 12
Dependent Claim
37 words
The fabricating method of claim 1 , wherein the encapsulant is formed with at least the second surface of the chip and upper and bottom surfaces of the leads being exposed to the outside of the encapsulant.
References Cited (Backward Citations)
US5172214A
Cited
US5942794A
Cited
US5894108A
Cited
US6201292B1
Cited
US6303997B1
Cited
US6075284A
Cited
US6281568B1
Cited
US6297543B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-11-02 | 2008-05-03 | 2008-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-11-02 | 2012-05-03 | 2012-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-11-02 | 2016-05-03 | 2016-11-02 | $7700.00 | Window Closed / Lapsed |