Patent US6747361B2 successfully refreshed from Google Patents.
US6747361B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and packaging method thereof
Assignee: NEC Electronics Corp
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Filing: 2001-07-24
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Granted: 2004-06-08
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Expires: 2021-07-24
Abstract
Abstract A semiconductor chip semiconductor device of the present invention is capable of obtaining a high-quality bare chip (HQC) easily and can retain quality without being affected by the surrounding environment. Electrodes formed on the surface of a first resin sealed package for sealing a semiconductor chip are connected to the electrodes of the semiconductor chip and each electrode comprises a mounting area to be connected to an object to be mounted and a testing area for connecting testing equipment.
Inventors
- 👤 Michihiko Ichinose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:54
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W72/00; H10W72/071; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W90/811; H10W72/01; H10W72/015; H10W72/01515; H10W72/073; H10W72/075; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/50; H10W72/521; H10W72/527; H10W72/531; H10W72/537; H10W72/541; H10W72/5445; H10W72/5449; H10W72/851; H10W72/874; H10W72/884
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
131 words
A semiconductor device comprising: a first resin package comprising: a semiconductor chip; a chip electrode on a surface of said semiconductor chip; a first resin sealing said semiconductor chip; and a first package electrode on a surface of said first resin being electrically connected to said chip electrode, said first package electrode comprising a mounting pad and a testing pad provided apart from said mounting pad and said testing pad enabling electrical measurement of said semiconductor chip without using said mounting pad; a mounted object connected to said mounting pad, and a wiring connecting said mounting pad to said mounting object, wherein said mounting pad is arranged along an edge of said first resin package, and wherein said testing pad is arranged at inner position with respect to said mounting pad.
Claim 2
Dependent Claim
131 words
A semiconductor device comprising: a first resin package comprising: a semiconductor chip; a chip electrode on a surface of said semiconductor chip; a first resin sealing said semiconductor chip; and a first package electrode on a surface of said first resin being electrically connected to said chip electrode, said first package electrode comprising a mounting pad and a testing pad provided apart from said mounting pad and said testing pad enabling electrical measurement of said semiconductor chip without using said mounting pad; a mounted object connected to said mounting pad, and a wiring connecting said mounting pad to said mounting object, wherein said mounting pad is arranged along an edge of said first resin package, and wherein said testing pad is arranged at inner position with respect to said mounting pad.
Claim 3
Dependent Claim
27 words
The semiconductor device as claimed in claim 1 , further comprising: a second resin sealing said first resin package and a first surface of said mounted object.
Claim 4
Dependent Claim
22 words
The semiconductor device as claimed in claim 2 , further comprising: an inner wiring connecting said chip electrode to said mounting pad.
Claim 5
Dependent Claim
17 words
The semiconductor device as claimed in claim 1 , wherein said mounted object is a mounting substrate.
References Cited (Backward Citations)
JPH0653393A
Cited
JPH0662382A
Cited
EP0623954A1
Cited
JPH0722567A
Cited
JPH0738240A
Cited
JPH08504036A
Cited
US5683942A
Cited
US6060768A
Cited
JPH0917910A
Cited
US6072239A
Cited
US6013948A
Cited
US6147401A
Cited
US5963433A
Cited
JPH1140617A
Cited
US6221682B1
Cited
US6429532B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-08 | 2007-12-08 | 2008-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-08 | 2011-12-08 | 2012-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-08 | 2015-12-08 | 2016-06-08 | $7700.00 | Window Closed / Lapsed |