US6147401A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compliant multichip package
Assignee: Adeia Semiconductor Solutions LLC
•
Filing: 2000-02-08
•
Granted: 2000-11-14
•
Expires: 2020-02-08
Abstract
Abstract A multichip package includes a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of the conductive traces adjacent the periphery of said flexible substrate, the substrate including conductive terminals accessible at a surface thereof connected to at least some of the traces. The package includes a first microelectronic element having a front face including contacts and a back face, the front face of the first microelectronic element confronting the flexible substrate. The package also includes a second microelectronic element larger than the first microelectronic element, the second microelectronic element having a front face including contacts, the second microelectronic element overlying the first microelectronic element with the front face of the second microelectronic element facing toward the substrate. A compliant element is disposed alongside the first microelectronic element between the second microelectronic element and the substrate. The flexible leads are connected to the second microelectronic element and at least some of the traces are connected to the first microelectronic element for electrically interconnecting the first and second microelectronic elements with one another and with the terminals.
Inventors
- 👤 Vernon Solberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:00
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W46/00; H10W72/01; H10W72/60; H10W90/20; H10W90/231; H10W90/288; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
178 words
A multichip package comprising: a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of said conductive traces adjacent the periphery of said flexible substrate, said substrate including conductive terminals accessible at a surface thereof connected to at least some of said traces; a first microelectronic element having a front face including contacts and a back face, the front face of said first microelectronic element confronting said flexible substrate; a second microelectronic element larger than said first microelectronic element, said second microelectronic element having a front face including contacts, said second microelectronic element overlying said first microelectronic element with said front face of said second microelectronic element facing toward said substrate, a compliant element disposed alongside said first microelectronic element between said second microelectronic element and said substrate, wherein said flexible leads are connected to said second microelectronic element and at least some of said traces are connected to said first microelectronic element for electrically interconnecting said first and second microelectronic elements with one another and with said terminals.
Claim 2
Dependent Claim
178 words
A multichip package comprising: a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of said conductive traces adjacent the periphery of said flexible substrate, said substrate including conductive terminals accessible at a surface thereof connected to at least some of said traces; a first microelectronic element having a front face including contacts and a back face, the front face of said first microelectronic element confronting said flexible substrate; a second microelectronic element larger than said first microelectronic element, said second microelectronic element having a front face including contacts, said second microelectronic element overlying said first microelectronic element with said front face of said second microelectronic element facing toward said substrate, a compliant element disposed alongside said first microelectronic element between said second microelectronic element and said substrate, wherein said flexible leads are connected to said second microelectronic element and at least some of said traces are connected to said first microelectronic element for electrically interconnecting said first and second microelectronic elements with one another and with said terminals.
Claim 3
Dependent Claim
34 words
A package as claimed in claim 1 wherein said compliant element includes a compliant layer extending between said back face of said first microelectronic element and said front face of said first microelectronic element.
Claim 4
Dependent Claim
12 words
A package as claimed in claim 2 wherein said substrate is flexible.
Claim 5
Dependent Claim
32 words
A package as claimed in claim 3, wherein said flexible substrate includes an interior bond window and said conductive traces have inner ends extending at least partially across said interior bond window.
Claim 6
Dependent Claim
18 words
A package as claimed in claim 4, wherein the inner ends of said conductive traces include flexible leads.
Claim 7
Dependent Claim
22 words
A package as claimed in claim 4, wherein the contacts of said first microelectronic element are aligned with said interior bond window.
Claim 8
Dependent Claim
37 words
A package as claimed in claim 3, wherein said flexible substrate includes a central region bounded and defined by said interior bond window, and wherein said first microelectronic element overlies said central region of said flexible substrate.
Claim 9
Dependent Claim
45 words
A package as claimed in claim 7, wherein the front face of said first microelectronic element includes a central portion and a peripheral portion surrounding said central portion, said contacts of said first microelectronic element being disposed in said peripheral portion of said front face.
Claim 10
Dependent Claim
27 words
A package as claimed in claim 8, wherein the central portion of said first microelectronic element is in contact with the central region of said flexible substrate.
Claim 11
Dependent Claim
16 words
A package as claimed in claim 3, wherein said first microelectronic element is a memory chip.
Claim 12
Dependent Claim
26 words
A package as claimed in claim 10, wherein said second microelectronic element is selected from the group consisting of microprocessors, microcontrollers, and application specific integrated circuits.
Claim 13
Dependent Claim
18 words
A package as claimed in claim 3 wherein said compliant element includes compliant encapsulant surrounding said flexible leads.
Claim 14
Dependent Claim
26 words
A package as claimed in claim 12, wherein said compliant element extends beyond the periphery of said package to provide a compliant bumper surrounding said package.
Claim 15
Dependent Claim
24 words
A package as claimed in claim 3, wherein said compliant element includes a substantially continuous compliant pad which completely covers said first microelectronic element.
Claim 16
Dependent Claim
45 words
A package as claimed in claim 3, wherein the front face of said second microelectronic element includes a central portion and a peripheral portion surrounding said central portion, said contacts of said second microelectronic element being disposed in said peripheral portion of said front face.
Claim 17
Dependent Claim
23 words
A package as claimed in claim 15, wherein the central portion of said second microelectronic element is in contact with said compliant element.
References Cited (Backward Citations)
US5148266A
Cited
US5347159A
Cited
US5148265A
Cited
US5270261A
Cited
US5489749A
Cited
US5536909A
Cited
US5534467A
Cited
US5390844A
Cited
US5398863A
Cited
US5455390A
Cited
US5518964A
Cited
US5491302A
Cited
US5659952A
Cited
US5808878A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-14 | 2004-05-15 | 2004-11-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-14 | 2008-05-15 | 2008-11-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-14 | 2012-05-15 | 2012-11-14 | $7700.00 | Window Closed / Lapsed |