Patent US6746894B2 successfully refreshed from Google Patents.
US6746894B2
Expired / Lapsed
US
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Ball grid array interposer, packages and methods
Assignee: Micron Technology Inc
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Filing: 2001-04-19
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Granted: 2004-06-08
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Expires: 2021-04-19
Abstract
Abstract A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.
Inventors
- 👤 Setho Sing Fee
- 👤 Lim Thiam Chye
- 👤 Steven W. Heppler
- 👤 Leng Nam Yin
- 👤 Keith Tan
- 👤 Patrick Guay
- 👤 Edmund Lua Koon Tian
- 👤 Yap Kah Eng
- 👤 Eric Tan Swee Seng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:51
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10P; H10P72/00; H10P72/70; H10P72/74; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/01; H10W70/05; H10W72/00; H10W72/071; H10W72/077; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/01; H10W72/0198; H10W72/075; H10W72/07502; H10W72/07504; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/701; H10W72/90; H10W72/931; H10W72/932; H10W74/131; H10W74/142; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 61
Claim 1
Independent Claim
55 words
An interposer for use in a semiconductor device package, comprising: a substantially planar substrate comprising a semiconductor material; a receptacle formed within and laterally confined by the substrate, the receptacle having a height that is substantially equal to a thickness of the substrate; and a film at least partially covering an end of the receptacle.
Claim 2
Dependent Claim
55 words
An interposer for use in a semiconductor device package, comprising: a substantially planar substrate comprising a semiconductor material; a receptacle formed within and laterally confined by the substrate, the receptacle having a height that is substantially equal to a thickness of the substrate; and a film at least partially covering an end of the receptacle.
Claim 3
Dependent Claim
18 words
The interposer of claim 1 , wherein the receptacle is configured to receive at least one semiconductor device.
Claim 4
Dependent Claim
22 words
The interposer of claim 2 , wherein the height of the receptacle exceeds a thickness of the at least one semiconductor device.
Claim 5
Dependent Claim
42 words
The interposer of claim 2 , wherein the substrate includes at least one contact area positioned on a first surface thereof, adjacent the receptacle, the at least one contact area corresponding to a bond pad of the at least one semiconductor device.
Claim 6
Dependent Claim
21 words
The interposer of claim 4 , further comprising at least one terminal in communication with the at least one contact area.
Claim 7
Dependent Claim
18 words
The interposer of claim 5 , wherein the at least one terminal is positioned on the first surface.
Claim 8
Dependent Claim
21 words
The interposer of claim 5 , wherein the at least one terminal is positioned on a second surface of the substrate.
Claim 9
Dependent Claim
42 words
The interposer of claim 5 , further comprising at least one secondary terminal positioned on an opposite surface of the substrate from the at least one terminal, the at least one secondary terminal in communication with another conductive area on the substrate.
Claim 10
Dependent Claim
16 words
The interposer of claim 1 , wherein the film substantially covers the end of the receptacle.
Claim 11
Dependent Claim
17 words
The interposer of claim 1 , wherein the film is secured to a surface of the substrate.
Claim 12
Dependent Claim
15 words
The interposer of claim 10 , wherein the film is removably secured to the surface.
Claim 13
Dependent Claim
19 words
The interposer of claim 1 , wherein at least a portion of the film has an adhesive material thereon.
Claim 14
Dependent Claim
16 words
The interposer of claim 12 , wherein the adhesive material comprises a pressure sensitive adhesive material.
Claim 15
Dependent Claim
14 words
The interposer of claim 1 , wherein the receptacle extends completely through the substrate.
Claim 16
Dependent Claim
108 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed within the substrate, the receptacle having a height that is substantially the same as a thickness of the substrate; a semiconductor device positioned within the receptacle, a back side of the semiconductor device being exposed through the interposer; and a quantity of encapsulant material in contact with and substantially covering an active surface of the semiconductor device and extending laterally between at least a portion of an outer periphery of the semiconductor device and a periphery of the receptacle, the quantity of encapsulant material at least partially securing the semiconductor device within the receptacle.
Claim 17
Dependent Claim
108 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed within the substrate, the receptacle having a height that is substantially the same as a thickness of the substrate; a semiconductor device positioned within the receptacle, a back side of the semiconductor device being exposed through the interposer; and a quantity of encapsulant material in contact with and substantially covering an active surface of the semiconductor device and extending laterally between at least a portion of an outer periphery of the semiconductor device and a periphery of the receptacle, the quantity of encapsulant material at least partially securing the semiconductor device within the receptacle.
Claim 18
Dependent Claim
16 words
The semiconductor device package of claim 15 , wherein the receptacle extends substantially through the substrate.
Claim 19
Dependent Claim
25 words
The semiconductor device package of claim 15 , wherein the interposer comprises a thin film at least partially covering a bottom end of the receptacle.
Claim 20
Dependent Claim
20 words
The semiconductor device package of claim 17 , wherein the thin film is secured to a surface of the substrate.
Claim 21
Dependent Claim
21 words
The semiconductor device package of claim 18 , wherein the thin film is removably secured to the surface of the substrate.
Claim 22
Dependent Claim
20 words
The semiconductor device package of claim 17 , wherein at least portions of the thin film have adhesive material thereon.
Claim 23
Dependent Claim
18 words
The semiconductor device package of claim 20 , wherein the adhesive material comprises a pressure sensitive adhesive material.
Claim 24
Dependent Claim
22 words
The semiconductor device package of claim 17 , wherein the thin film is located adjacent a back side of the semiconductor device.
Claim 25
Dependent Claim
43 words
The semiconductor device package of claim 15 , wherein the interposer further includes at least one contact area on a first surface thereof, proximate the receptacle, the at least one contact area corresponding to at least one bond pad of the semiconductor device.
Claim 26
Dependent Claim
31 words
The semiconductor device package of claim 23 , wherein the interposer further includes at least one terminal on the first surface and in communication with the at least one contact area.
Claim 27
Dependent Claim
31 words
The semiconductor device package of claim 24 , wherein the interposer includes a plurality of contact areas and corresponding terminals, the terminals being arranged over the first surface in an array.
Claim 28
Dependent Claim
47 words
The semiconductor device package of claim 24 , wherein the interposer further includes at least one secondary terminal on a second surface of the substrate, opposite the first surface, the at least one secondary terminal corresponding to at least one other contact area on the first surface.
Claim 29
Dependent Claim
25 words
The semiconductor device package of claim 24 , further comprising at least one conductive structure secured to and protruding from the at least one terminal.
Claim 30
Dependent Claim
31 words
The semiconductor device package of claim 23 , further comprising at least one intermediate conductive element electrically connecting the at least one bond pad to the at least one contact area.
Claim 31
Dependent Claim
22 words
The semiconductor device package of claim 28 , wherein the quantity of encapsulant material encapsulates the at least one intermediate conductive element.
Claim 32
Dependent Claim
18 words
The semiconductor device package of claim 15 , wherein the quantity of encapsulant material substantially fills the receptacle.
Claim 33
Dependent Claim
25 words
The semiconductor device package of claim 15 , wherein the quantity of encapsulant material at least partially covers an active surface of the semiconductor device.
Claim 34
Dependent Claim
22 words
The semiconductor device package of claim 15 , wherein the quantity of encapsulant material laterally confines the semiconductor device within the receptacle.
Claim 35
Independent Claim
125 words
A method for assembling a semiconductor device package, comprising: providing an interposer with a substantially planar substrate and a receptacle formed substantially through the substantially planar substrate; positioning at least one semiconductor device within the receptacle; electrically connecting the at least one semiconductor device to the interposer; and introducing encapsulant material in contact with an active surface of the semiconductor device so as to substantially cover the active surface and into the receptacle so as to substantially fill space remaining within the receptacle and to extend laterally between at least a portion of an outer periphery of the at least one semiconductor device and a periphery of the receptacle, the encapsulant material at least laterally confining the at least one semiconductor device within the receptacle.
Claim 36
Independent Claim
125 words
A method for assembling a semiconductor device package, comprising: providing an interposer with a substantially planar substrate and a receptacle formed substantially through the substantially planar substrate; positioning at least one semiconductor device within the receptacle; electrically connecting the at least one semiconductor device to the interposer; and introducing encapsulant material in contact with an active surface of the semiconductor device so as to substantially cover the active surface and into the receptacle so as to substantially fill space remaining within the receptacle and to extend laterally between at least a portion of an outer periphery of the at least one semiconductor device and a periphery of the receptacle, the encapsulant material at least laterally confining the at least one semiconductor device within the receptacle.
Claim 37
Dependent Claim
28 words
The method of claim 33 , wherein providing comprises providing an interposer with a thin film covering at least a portion of a bottom end of the receptacle.
Claim 38
Dependent Claim
20 words
The method of claim 34 , wherein positioning comprises positioning the at least one semiconductor device on the thin film.
Claim 39
Dependent Claim
24 words
The method of claim 35 , wherein positioning comprises positioning a back side of the at least one semiconductor device against the thin film.
Claim 40
Dependent Claim
20 words
The method of claim 35 , wherein positioning comprises securing the at least one semiconductor device to the thin film.
Claim 41
Dependent Claim
14 words
The method of claim 34 , further comprises removing the thin film following introducing.
Claim 42
Dependent Claim
18 words
The method of claim 33 , wherein positioning comprises positioning a plurality of semiconductor devices within the receptacle.
Claim 43
Dependent Claim
37 words
The method of claim 33 , wherein the electrically connecting comprises positioning an intermediate conductive element between at least one bond pad of the at least one semiconductor device and a corresponding contact area of the interposer.
Claim 44
Dependent Claim
29 words
The method of claim 40 , wherein positioning the intermediate conductive element comprises connecting a bond wire between the at least one bond pad and the corresponding contact area.
Claim 45
Dependent Claim
20 words
The method of claim 33 , further comprising placing a conductive structure on at least one terminal of the interposer.
Claim 46
Dependent Claim
124 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed substantially through the substrate, the substrate substantially completely laterally confining the receptacle; at least one semiconductor device positioned within the receptacle; at least one intermediate conductive element electrically connecting at least one bond pad of the at least one semiconductor device to a corresponding contact area of the interposer; and encapsulant material in contact with and substantially covering an active surface of the at least one semiconductor device and located within the receptacle, the encapsulant material within the receptacle extending between an outer periphery of the at least one semiconductor device and a periphery of the receptacle to substantially laterally confine the at least one semiconductor device within the receptacle.
Claim 47
Dependent Claim
124 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed substantially through the substrate, the substrate substantially completely laterally confining the receptacle; at least one semiconductor device positioned within the receptacle; at least one intermediate conductive element electrically connecting at least one bond pad of the at least one semiconductor device to a corresponding contact area of the interposer; and encapsulant material in contact with and substantially covering an active surface of the at least one semiconductor device and located within the receptacle, the encapsulant material within the receptacle extending between an outer periphery of the at least one semiconductor device and a periphery of the receptacle to substantially laterally confine the at least one semiconductor device within the receptacle.
Claim 48
Dependent Claim
21 words
The semiconductor device package of claim 43 , wherein a back side of the at least one semiconductor device is exposed.
Claim 49
Dependent Claim
22 words
The semiconductor device package of claim 43 , further comprising at least one contact pad in communication with the corresponding contact area.
Claim 50
Dependent Claim
26 words
The semiconductor device package of claim 45 , further comprising at least one conductive structure secured to and protruding from the at least one contact pad.
Claim 51
Dependent Claim
66 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed within the substrate, the receptacle extending substantially through a thickness of the substrate; and a semiconductor device suspended within the receptacle, a back side of the semiconductor device being exposed through the interposer; and a quantity of encapsulant material in contact with and substantially covering an active surface of the semiconductor device.
Claim 52
Dependent Claim
66 words
A semiconductor device package, comprising: an interposer including: a substrate; and a receptacle formed within the substrate, the receptacle extending substantially through a thickness of the substrate; and a semiconductor device suspended within the receptacle, a back side of the semiconductor device being exposed through the interposer; and a quantity of encapsulant material in contact with and substantially covering an active surface of the semiconductor device.
Claim 53
Dependent Claim
51 words
The semiconductor device package of claim 47 , further comprising a quantity of encapsulant material extending laterally between at least a portion of an outer periphery of the semiconductor device and a periphery of the receptacle, the quantity of encapsulant material at least partially retaining the semiconductor device within the receptacle.
Claim 54
Dependent Claim
43 words
The semiconductor device package of claim 47 , wherein the interposer further includes at least one contact area on a first surface thereof, proximate the receptacle, the at least one contact area corresponding to at least one bond pad of the semiconductor device.
Claim 55
Dependent Claim
31 words
The semiconductor device package of claim 49 , wherein the interposer further includes at least one terminal on the first surface and in communication with the at least one contact area.
Claim 56
Dependent Claim
32 words
The semiconductor device package of claim 50 , wherein the interposer includes a plurality of contact areas and corresponding terminals, the corresponding terminals being arranged over the first surface in an array.
Claim 57
Dependent Claim
47 words
The semiconductor device package of claim 50 , wherein the interposer further includes at least one secondary terminal on a second surface of the substrate, opposite the first surface, the at least one secondary terminal corresponding to at least one other contact area on the first surface.
Claim 58
Dependent Claim
25 words
The semiconductor device package of claim 50 , further comprising at least one conductive structure secured to and protruding from the at least one terminal.
Claim 59
Dependent Claim
31 words
The semiconductor device package of claim 49 , further comprising at least one intermediate conductive element electrically connecting the at least one bond pad to the at least one contact area.
Claim 60
Dependent Claim
18 words
The semiconductor device package of claim 54 , wherein the at least one intermediate conductive element is encapsulated.
Claim 61
Dependent Claim
18 words
The semiconductor device package of claim 48 , wherein the quantity of encapsulant material substantially fills the receptacle.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-08 | 2007-12-08 | 2008-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-08 | 2011-12-08 | 2012-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-08 | 2015-12-08 | 2016-06-08 | $7700.00 | Window Closed / Lapsed |