Patent US6727116B2 successfully refreshed from Google Patents.
US6727116B2
Expired / Lapsed
US
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Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
Assignee: Micron Technology Inc
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Filing: 2002-06-27
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Granted: 2004-04-27
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Expires: 2022-06-27
Abstract
Abstract A semiconductor device package is disclosed which is substantially die-sized with respect to each of the X, Y and Z axes. The package includes outer connectors that are located along at least one peripheral edge thereof and that extend substantially across the height of the peripheral edge. Each outer connector is formed by severing a conductive via that extends substantially through a substrate blank, such as a silicon wafer, at a street located adjacent to an outer periphery of the semiconductor device of the package. The outer connectors may include recesses that at least partially receive conductive columns protruding from a support substrate therefor. Assemblies may include the packages in stacked arrangement, without height-adding connectors.
Inventors
- 👤 Chia Yong Poo
- 👤 Boon Suan Jeung
- 👤 Low Siu Waf
- 👤 Chan Min Yu
- 👤 Neo Yong Loo
- 👤 Chua Swee Kwang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:39
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W90/00; H10W72/00; H10W72/801
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
123 words
A method for packaging a semiconductor device, comprising: providing a substrate blank including at least one semiconductor device fabricated thereon; forming at least one through-hole substantially through the substrate blank at a conductive via location adjacent to an outer periphery of the at least one semiconductor device; forming at least one conductive trace to extend between a bond pad of the at least one semiconductor device and the conductive via location; introducing conductive material into the at least one through-hole to form a conductive via therein, the conductive via being in electrical communication with the at least one conductive trace and extending substantially through the substrate blank; and severing the substrate blank and the at least one conductive via along the outer periphery.
Claim 2
Independent Claim
123 words
A method for packaging a semiconductor device, comprising: providing a substrate blank including at least one semiconductor device fabricated thereon; forming at least one through-hole substantially through the substrate blank at a conductive via location adjacent to an outer periphery of the at least one semiconductor device; forming at least one conductive trace to extend between a bond pad of the at least one semiconductor device and the conductive via location; introducing conductive material into the at least one through-hole to form a conductive via therein, the conductive via being in electrical communication with the at least one conductive trace and extending substantially through the substrate blank; and severing the substrate blank and the at least one conductive via along the outer periphery.
Claim 3
Dependent Claim
24 words
The method of claim 1 , wherein providing the substrate blank comprises providing a substrate blank with a plurality of semiconductor devices fabricated thereon.
Claim 4
Dependent Claim
37 words
The method of claim 2 , wherein forming the at least one through-hole comprises forming the at least one through-hole at a street defined by outer peripheries of adjacent semiconductor devices of the plurality of semiconductor devices.
Claim 5
Dependent Claim
30 words
The method of claim 3 , wherein severing comprises severing the conductive via into at least two outer connectors that are located on peripheral edges of the adjacent semiconductor devices.
Claim 6
Dependent Claim
18 words
The method of claim 1 , wherein introducing comprises plating the at least one through-hole with conductive material.
Claim 7
Dependent Claim
20 words
The method of claim 5 , wherein plating comprises at least one of electrolytic plating, electroless plating, and immersion plating.
Claim 8
Dependent Claim
33 words
The method of claim 1 , wherein introducing comprises introducing at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor-filled elastomer into the at least one through-hole.
Claim 9
Dependent Claim
10 words
The method of claim 1 , wherein severing comprises sawing.
Claim 10
Dependent Claim
28 words
The method of claim 1 , wherein forming the at least one conductive trace comprises forming the at least one conductive trace on an insulative layer or structure.
Claim 11
Dependent Claim
25 words
The method of claim 1 , further comprising: forming an insulative layer over at least the at least one conductive trace and the bond pad.
Claim 12
Dependent Claim
20 words
The method of claim 1 , further comprising: forming an insulative lining on surfaces of the at least one through-hole.
Claim 13
Dependent Claim
22 words
The method of claim 1 , further comprising: forming a back side insulative layer on a back side of the substrate blank.
Claim 14
Independent Claim
72 words
A method for assembling semiconductor device components, comprising: providing a support substrate; securing and electrically connecting at least one conductive column to a conductive structure of the support substrate; positioning at least one semiconductor device including at least one outer connector on a peripheral edge thereof on the support substrate such that the at least one conductive column and the at least one outer connector are in electrical communication with one another.
Claim 15
Independent Claim
72 words
A method for assembling semiconductor device components, comprising: providing a support substrate; securing and electrically connecting at least one conductive column to a conductive structure of the support substrate; positioning at least one semiconductor device including at least one outer connector on a peripheral edge thereof on the support substrate such that the at least one conductive column and the at least one outer connector are in electrical communication with one another.
Claim 16
Dependent Claim
26 words
The method of claim 13 , wherein providing comprises providing at least one of a circuit board, an interposer, a lead frame, and another semiconductor device.
Claim 17
Dependent Claim
27 words
The method of claim 13 , wherein securing and electrically connecting comprises placing a conductive material between the at least one conductive column and the conductive structure.
Claim 18
Dependent Claim
41 words
The method of claim 15 , wherein placing the conductive material comprises placing at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor-filled elastomer between the at least one conductive column and the conductive structure.
Claim 19
Dependent Claim
28 words
The method of claim 13 , wherein securing and electrically connecting comprises forming the at least one conductive column on the conductive structure with a wire bonding capillary.
Claim 20
Dependent Claim
27 words
The method of claim 13 , wherein securing comprises positioning an end of the at least one conductive column in an aperture formed in the support substrate.
Claim 21
Dependent Claim
38 words
The method of claim 18 , wherein electrically connecting comprises placing the conductive material in contact with the at least one conductive column and a portion of the conductive structure adjacent to the at least one conductive column.
Claim 22
Dependent Claim
44 words
The method of claim 19 , wherein placing the conductive material comprises placing at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor-filled elastomer in contact with both the at least one conductive column and the conductive structure.
Claim 23
Dependent Claim
28 words
The method of claim 13 , wherein positioning the at least one semiconductor device comprises positioning a plurality of semiconductor devices in stacked arrangement over the support substrate.
Claim 24
Dependent Claim
33 words
The method of claim 21 , wherein positioning includes establishing electrical communication between the at least one conductive column and corresponding outer connectors of at least some of the plurality of semiconductor devices.
Claim 25
Dependent Claim
22 words
The method of claim 13 , further comprising: securing the at least one conductive column to the at least one outer connector.
Claim 26
Dependent Claim
54 words
The method of claim 23 , wherein securing the at least one conductive column to the at least one outer connector comprises securing the at least one conductive column to the at least one outer connector with at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor-filled elastomer.
Claim 27
Dependent Claim
30 words
The method of claim 13 , wherein providing comprises providing a test substrate and wherein the positioning comprises removably positioning the at least one semiconductor device on the test substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-04-27 | 2007-10-27 | 2008-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-04-27 | 2011-10-27 | 2012-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-04-27 | 2015-10-27 | 2016-04-27 | $7700.00 | Window Closed / Lapsed |