Patent US6694583B2 successfully refreshed from Google Patents.
US6694583B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate
Assignee: National Semiconductor Corp
•
Filing: 2001-02-16
•
Granted: 2004-02-24
•
Expires: 2021-02-16
Abstract
Abstract An apparatus and method for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual electrode layers must be connected electrically. According to the present invention, a multi-layer capacitor is formed on a first ceramic tape layer. A second tape layer having an opening is placed on top of the first layer. The opening in the second layer is formed such that exposed vias are present on at least two sides of the opening to electrically connect to the electrodes. When the tape layers are pressed and fired, the exposed vias and electrodes form common electrical connections. A third layer having a terminal via may be placed on top of the second layer.
Inventors
- 👤 Shaul Branchevsky
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:44
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K1/02; H05K1/03; H05K1/0306; H05K1/18; H05K1/182; H05K1/185; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09645; H05K3/00; H05K3/40; H05K3/403; H05K3/4038; H05K3/4053; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
110 words
A method of forming an embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate, the method comprising: forming a first terminal via in a first ceramic tape layer; forming a first electrode on the first ceramic tape layer, the first electrode connecting to the first terminal via; forming a first dielectric layer on top of the first electrode; forming a second electrode on top of the first dielectric layer; forming an opening in a second ceramic tape layer, wherein the opening has at least two exposed vias; and placing the second ceramic tape layer on top of the first ceramic tape layer, with the opening aligned with the electrodes.
Claim 2
Independent Claim
110 words
A method of forming an embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate, the method comprising: forming a first terminal via in a first ceramic tape layer; forming a first electrode on the first ceramic tape layer, the first electrode connecting to the first terminal via; forming a first dielectric layer on top of the first electrode; forming a second electrode on top of the first dielectric layer; forming an opening in a second ceramic tape layer, wherein the opening has at least two exposed vias; and placing the second ceramic tape layer on top of the first ceramic tape layer, with the opening aligned with the electrodes.
Claim 3
Dependent Claim
47 words
The method of claim 1 , further comprising placing a third ceramic tape layer having a second terminal via on top of the second ceramic tape layer, wherein the first terminal via connects to the first electrode and the second terminal via connects to the second electrode.
Claim 4
Dependent Claim
29 words
The method of claim 2 , further comprising forming two separate multi-layer capacitors within the opening, each capacitor connected to a separate set of exposed vias in the opening.
Claim 5
Dependent Claim
24 words
The method of claim 3 , further comprising forming a plurality of electrodes and dielectric layers on top of the first ceramic tape layer.
Claim 6
Dependent Claim
32 words
The method of claim 4 , wherein a first set of electrodes are connected to the first terminal via, and a second set of electrodes are connected to the second terminal via.
Claim 7
Dependent Claim
21 words
The method of claim 5 , further comprising pressing the layers together and firing the layers to form a hardened substrate.
Claim 8
Independent Claim
142 words
A method of forming an embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate, the method comprising: forming a first terminal via in a first ceramic tape layer; forming a multi-layer capacitor on the first ceramic tape layer; forming an opening in a second ceramic tape layer, the process of forming the opening comprising: forming at least two vias in the second ceramic tape layer; and removing a portion of the second ceramic tape layer to expose the at least two vias; placing the second ceramic tape layer on the first ceramic tape layer, wherein the opening is aligned with the multi-layer capacitor of the first layer, so that the multi-layer capacitor is placed within the opening; forming a second terminal via in a third ceramic tape layer; and placing the third ceramic tape layer on the second ceramic tape layer.
Claim 9
Independent Claim
142 words
A method of forming an embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate, the method comprising: forming a first terminal via in a first ceramic tape layer; forming a multi-layer capacitor on the first ceramic tape layer; forming an opening in a second ceramic tape layer, the process of forming the opening comprising: forming at least two vias in the second ceramic tape layer; and removing a portion of the second ceramic tape layer to expose the at least two vias; placing the second ceramic tape layer on the first ceramic tape layer, wherein the opening is aligned with the multi-layer capacitor of the first layer, so that the multi-layer capacitor is placed within the opening; forming a second terminal via in a third ceramic tape layer; and placing the third ceramic tape layer on the second ceramic tape layer.
Claim 10
Dependent Claim
35 words
The method of claim 7 , further comprising forming a second multi-layer capacitor on the first ceramic layer, and forming at least two additional exposed vias in the opening to connect to the second capacitor.
Claim 11
Dependent Claim
20 words
The method of claim 7 , wherein the at least two vias are located on opposite sides of the opening.
Claim 12
Dependent Claim
21 words
The method of claim 9 , further comprising pressing the tape layers together and firing the layers to harden the substrate.
References Cited (Backward Citations)
US4237606A
Cited
US4082906A
Cited
US4528072A
Cited
US5383093A
Cited
US5027253A
Cited
US5800575A
Cited
US5736448A
Cited
US5855995A
Cited
US6061228A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-02-23 | 2007-08-25 | 2008-02-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-02-23 | 2011-08-25 | 2012-02-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-02-23 | 2015-08-25 | 2016-02-24 | $7700.00 | Window Closed / Lapsed |