Patent US6650008B2 successfully refreshed from Google Patents.
US6650008B2
Expired / Lapsed
US
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Stacked semiconductor packaging device
Assignee: Macronix International Co Ltd
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Filing: 2002-03-26
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Granted: 2003-11-18
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Expires: 2022-03-26
Abstract
Abstract A stacked semiconductor packaging device consists of at least a stacked multi-chip device comprising a substrate. A first chip has a back surface faced towards the substrate and an active surface comprising a plurality of bonding pads which have a first set of elongate conductors connected to the substrate. A second chip has another back surface and another active surface comprising a plurality of bonding pads which have a second set of elongate conductors connected to the substrate. The active surface of the second chip is faced towards the active surface of said first chip and is stacked atop the first chip so as to expose all of the bonding pads. The face-to-face arrangement of the first chip and the second chip can reduce the whole packing height.
Inventors
- 👤 Chen-Jung Tsai
- 👤 Jui-Chung Lee
- 👤 Chih-Wen Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:23
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/20; H10W90/24; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
124 words
A stacked multi-chip device comprising: a substrate; a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads, wherein said second active surface is faced towards said first active surface of said first chip and is affixed to and stacked atop said first chip to expose both said first bonding pads and said second bonding pads; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 2
Dependent Claim
124 words
A stacked multi-chip device comprising: a substrate; a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads, wherein said second active surface is faced towards said first active surface of said first chip and is affixed to and stacked atop said first chip to expose both said first bonding pads and said second bonding pads; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 3
Dependent Claim
34 words
The stacked multi-chip device of claim 1 , wherein said second chip is offset in one direction from said first chip so that a rectangular edge portion having said first bonding pads is exposed.
Claim 4
Dependent Claim
34 words
The stacked multi-chip device of claim 1 , wherein said second chip is offset in two directions from said first chip so that a L-shaped edge portion having said first bonding pads is exposed.
Claim 5
Dependent Claim
46 words
The stacked multi-chip device of claim 1 , wherein said second chip is rotated in a plane substantially parallel to said first active surface of said first chip, wherein two edge portions of said first chip and two edge portions of said second chip are exposed.
Claim 6
Dependent Claim
27 words
The stacked multi-chip device of claim 1 , wherein said substrate is selected from the groups of a ceramic substrate, an organic substrate, or combination of above.
Claim 7
Dependent Claim
23 words
The stacked multi-chip device of claim 1 , wherein said first set of conductors comprises a plurality of metal wires of wire bonding.
Claim 8
Dependent Claim
25 words
The stacked multi-chip device of claim 1 , wherein said first set of conductors comprises a plurality of solder bumps combined with flexible conductive lines.
Claim 9
Dependent Claim
28 words
The stacked multi-chip device of claim 1 , wherein said first set of conductors comprises a plurality of solder bumps combined with a plurality of conductive lead frames.
Claim 10
Dependent Claim
20 words
The stacked multi-chip device of claim 1 , wherein said second set of conductors comprises a plurality of solder balls.
Claim 11
Dependent Claim
20 words
The stacked multi-chip device of claim 1 , wherein said second set of conductors comprises a plurality of solder bumps.
Claim 12
Dependent Claim
28 words
The stacked multi-chip device of claim 1 , wherein said second set of conductors comprises a plurality of solder bumps combined with a plurality of flexible conductive lines.
Claim 13
Dependent Claim
28 words
The stacked multi-chip device of claim 1 , wherein said second set of conductors comprises a plurality of solder bumps combined with a plurality of conductive lead frames.
Claim 14
Dependent Claim
20 words
The stacked multi-chip device of claim 1 , wherein said second set of conductors comprises a plurality of metal wires.
Claim 15
Dependent Claim
143 words
A chip-stacked device comprising: a substrate; at least a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads located at a first edge portion of said first active surface; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads located at a second edge portion of said second chip, wherein said second active surface is faced towards said first active surface of said first chip and is offset stacked atop said first chip to expose said first edge portion and said second edge portion; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 16
Dependent Claim
143 words
A chip-stacked device comprising: a substrate; at least a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads located at a first edge portion of said first active surface; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads located at a second edge portion of said second chip, wherein said second active surface is faced towards said first active surface of said first chip and is offset stacked atop said first chip to expose said first edge portion and said second edge portion; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 17
Dependent Claim
30 words
The chip-stacked device of claim 14 , wherein said second chip is offset in one direction from said first chip so that said first edge portion is rectangular or U-shaped.
Claim 18
Dependent Claim
35 words
The stacked multi-chip device of claim 14 , wherein said second chip is offset in two directions from said first chip so that said first edge portion or said second edge portion is L shaped.
Claim 19
Dependent Claim
26 words
The chip-stacked device of claim 14 , wherein said substrate is selected from the groups of a ceramic substrate, an organic substrate, or combination of above.
Claim 20
Dependent Claim
56 words
The chip-stacked device of claim 14 , wherein said first set of conductors is selected from the groups of a plurality of metal wires of wire bonding, a plurality of solder bumps combined with flexible conductive lines, a plurality of solder bumps combined with a plurality of conductive lead frames, or a plurality of solder balls.
Claim 21
Dependent Claim
56 words
The chip-stacked device of claim 14 , wherein said second set of conductors is selected from the groups of a plurality of solder bumps, a plurality of solder bumps combined with a plurality of flexible conductive lines, a plurality of solder bumps combined with a plurality of conductive lead frames, or a plurality of metal wires.
Claim 22
Dependent Claim
145 words
A chip-stacked device comprising: a substrate; at least a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads located at at-least two first edge portions of said first active surface; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads located at at-least two second edge portions of said second chip, wherein said second active surface is faced towards said first active surface of said first chip and is offset stacked atop said first chip to expose said first edge portions and said second edge portions; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 23
Dependent Claim
145 words
A chip-stacked device comprising: a substrate; at least a first chip having a first back surface affixed to said substrate and a first active surface, said first active surface comprising a plurality of first bonding pads located at at-least two first edge portions of said first active surface; a second chip having a second back surface and a second active surface, said second active surface comprising a plurality of second bonding pads located at at-least two second edge portions of said second chip, wherein said second active surface is faced towards said first active surface of said first chip and is offset stacked atop said first chip to expose said first edge portions and said second edge portions; a first set of conductors connecting said first bonding pads with said substrate; and a second set of conductors connecting said second bonding pads with said substrate.
Claim 24
Dependent Claim
18 words
The chip-stacked device of claim 20 , wherein said second chip is between said two first edge portions.
Claim 25
Dependent Claim
18 words
The chip-stacked device of claim 20 , wherein said first chip is between said two second edge portions.
Claim 26
Dependent Claim
26 words
The chip-stacked device of claim 20 , wherein said substrate is selected from the groups of a ceramic substrate, an organic substrate, or combination of above.
Claim 27
Dependent Claim
56 words
The chip-stacked device of claim 20 , wherein said first set of conductors is selected from the groups of a plurality of metal wires of wire bonding, a plurality of solder bumps combined with flexible conductive lines, a plurality of solder bumps combined with a plurality of conductive lead frames, or a plurality of solder balls.
Claim 28
Dependent Claim
56 words
The chip-stacked device of claim 20 , wherein said second set of conductors is selected from the groups of a plurality of solder bumps, a plurality of solder bumps combined with a plurality of flexible conductive lines, a plurality of solder bumps combined with a plurality of conductive lead frames, or a plurality of metal wires.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2006-11-17 | 2007-05-19 | 2007-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-11-17 | 2011-05-19 | 2011-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-11-17 | 2015-05-19 | 2015-11-18 | $7700.00 | Window Closed / Lapsed |