Planar inductor with segmented conductive plane

Claim 2

An integrated circuit inductor structure comprising; a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; and an insulating layer lying between the inductor and the conductive segment.

Claim 3

The inductor structure of claim 1 , further comprising plural filaments emanating from the plural conductive segments.

Claim 4

The inductor structure of claim 1 , further comprising multiple layers between the inductor and the substrate and wherein the plural conductive segments are at least one layer below the inductor.

Claim 5

The inductor structure of claim 1 , further comprising: multiple layers between the inductor and the substrate; plural filaments at least one layer below the plural conductive segments; and wherein the plural conductive segments are at least one layer below the inductor, and the plural filaments are coupled to the plural conductive segments.

Claim 6

The inductor structure of claim 1 , wherein the plural conductive segments are metal.

Claim 7

The inductor structure of claim 1 , wherein the plural conductive segments are polysilicon.

Claim 8

The inductor structure of claim 1 , wherein the plural conductive segments comprise a diffusion layer in the substrate.

Claim 9

The inductor structure of claim 1 , wherein only one of the plural conductive segments is coupled to a fixed low impedance potential.

Claim 10

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments being arranged to allow minimal eddy currents to flow only at a point substantially below a center of the inductor, the conductive segments extending radially outward from the point in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; and an insulating layer lying between the inductor and the conductive segments.

Claim 11

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments being arranged to allow minimal eddy currents to flow only at a point substantially below a center of the inductor, the conductive segments extending radially outward from the point in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; and an insulating layer lying between the inductor and the conductive segments.

Claim 12

The inductor structure of claim 9 , further comprising plural filaments emanating from the plural conductive segments.

Claim 13

The inductor structure of claim 9 , further comprising multiple layers between the inductor and the substrate and wherein the plural conductive segments are at least one layer below the inductor.

Claim 14

The inductor structure of claim 9 , further comprising: multiple layers between the inductor and the substrate; plural filaments at least one layer below the plural conductive segments; and wherein the plural conductive segments are at least one layer below the inductor, and the plural filaments are coupled to the plural conductive segments.

Claim 15

The inductor structure of claim 9 , wherein the plural conductive segments are metal.

Claim 16

The inductor structure of claim 9 , wherein the plural conductive segments are polysilicon.

Claim 17

The inductor structure of claim 9 , wherein the plural conductive segments comprise a diffusion layer in the substrate.

Claim 18

The inductor structure of claim 9 , wherein only one of the plural conductive segments is coupled to a fixed low impedance potential.

Claim 19

An integrated circuit inductor structure comprising: a substrate; an inductor lying above the substrate; plural conductive segments that emanate radially outward from a point below the inductor in angularly spaced manner, the conductive segments lying above the substrate, the conductive segments terminating at respective free ends to be isolated one from the other thereat; and an insulating layer lying between the inductor and the conductive segments.

Claim 20

An integrated circuit inductor structure comprising: a substrate; an inductor lying above the substrate; plural conductive segments that emanate radially outward from a point below the inductor in angularly spaced manner, the conductive segments lying above the substrate, the conductive segments terminating at respective free ends to be isolated one from the other thereat; and an insulating layer lying between the inductor and the conductive segments.

Claim 23

The method of claim 18 , further comprising placing plural filaments coupled to the conductive segments.

Claim 24

The method of claim 18 , further comprising placing plural filaments at least one layer below the conductive segments, and wherein the plural filaments are coupled to the conductive segments.

Claim 25

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; plural filaments emanating from the plural conductive segments; and an insulating layer lying between the inductor and the conductive segments.

Claim 26

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; plural filaments emanating from the plural conductive segments; and an insulating layer lying between the inductor and the conductive segments.

Claim 27

The inductor structure of claim 21 , wherein each of the plural filaments have a respective end away from the plural conductive segment from which the plural filament emanates.

Claim 28

The inductor structure of claim 22 , wherein each respective end is electrically isolated from the other respective ends so that the filaments are not included within any closed loops through which an eddy current can flow.

Claim 29

The inductor structure of claim 21 , wherein the plural conductive segments and the plural filaments provide electrical shielding for the substrate from the inductor.

Claim 30

An integrated circuit inductor structure comprising: a substrate; an inductor; multiple layers between the inductor and substrate; plural conductive segments located between the substrate arid the inductor at least one layer below the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; plural filaments located between the substrate and inductor at least one layer below the plural conductive segments and coupled to the plural conductive segments; and an insulating layer lying between the inductor and the conductive segments.

Claim 31

An integrated circuit inductor structure comprising: a substrate; an inductor; multiple layers between the inductor and substrate; plural conductive segments located between the substrate arid the inductor at least one layer below the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat; plural filaments located between the substrate and inductor at least one layer below the plural conductive segments and coupled to the plural conductive segments; and an insulating layer lying between the inductor and the conductive segments.

Claim 32

The inductor structure of claim 25 , wherein the plural filaments are made from a different material than the plural conductive segments.

Claim 33

The inductor structure of claim 26 , wherein the plural conductive segments are metal and the plural filaments are polysilicon.

Claim 34

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat, wherein only one of the plural conductive segments is coupled to a fixed low impedance potential; and an insulating layer lying between the inductor and the conductive segments.

Claim 35

An integrated circuit inductor structure comprising: a substrate; an inductor; plural conductive segments located between the substrate and the inductor, the conductive segments connecting at a point substantially below a center of the inductor and extending radially outward therefrom in angularly spaced manner, the conductive segments terminating at respective free ends to be isolated one from the other thereat, wherein only one of the plural conductive segments is coupled to a fixed low impedance potential; and an insulating layer lying between the inductor and the conductive segments.

Claim 36

The inductor structure of claim 1 , wherein the plural conductive segments do not extend substantially beyond an area directly below and corresponding to an inductor area taken up by the inductor.

Claim 37

The inductor structure of claim 9 , wherein the plural conductive segments do not extend substantially beyond an area directly below and corresponding to an inductor area taken up by the inductor.

Claim 38

The inductor structure of claim 9 , wherein the plural conductive segments are not included within any closed loops through which an eddy current can flow.

Claim 39

The inductor structure of claim 9 , wherein the plural conductive segments connect at the point.

Claim 40

The inductor structure of claim 32 , wherein each of the plural conductive segments has a respective end away from the point, wherein each respective end does not intersect with, and is not directly or indirectly coupled to, any of the other respective ends.