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Methods for detaching a layer from a substrate

Assignee: Fujitsu Ltd
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Filing: 2001-05-31
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Granted: 2003-04-08
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Expires: 2021-05-31
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Abstract

Abstract Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

Inventors

  • 👤 Mark Thomas McCormack
  • 👤 James Roman
  • 👤 Lei Zhang
  • 👤 Solomon I. Beilin

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 07:33
CPC Classifications
B; B32; B32B; B32B37/00; B32B37/14; B32B37/26; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K3/10; H05K3/20; H05K3/205; H10; H10P; H10P72/00; H10P72/70; H10P72/74; B32B2457/00; B32B2457/08; H10P72/7412; H10P72/7424; H10P72/744; Y; Y10; Y10S; Y10S438/00; Y10S438/957; Y10S438/968; Y10S438/976; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1082; Y10T156/11; Y10T156/1153; Y10T156/1158; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/4916

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 70 words
A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
Claim 2
Independent Claim 70 words
A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
Claim 3
Dependent Claim 11 words
The method of claim 1 wherein said plasma comprises oxygen plasma.
Claim 4
Independent Claim 79 words
A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said first layer comprises a dielectric layer, and wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
Claim 5
Independent Claim 79 words
A method for detaching a layer from a substrate comprising: depositing a first layer on a substrate; treating a surface of the first layer to form a treated-surface on the first layer; forming a second layer on the treated surface; and removing the second layer from the treated surface of the first layer, wherein said first layer comprises a dielectric layer, and wherein said treating of said surface of said first layer comprises exposing said surface to a plasma.
Claim 6
Dependent Claim 11 words
The method of claim 3 wherein said plasma comprises oxygen plasma.
Claim 7
Dependent Claim 13 words
The method of claim 4 wherein said second layer includes a conductive layer.
Claim 8
Dependent Claim 44 words
The method of claim 5 wherein said moving of the second layer comprises peeling the second layer from the treated surface, and additionally comprising exposing the first layer to a fluid selected from the group consisting of a liquid, a gas, and mixtures thereof.
Claim 9
Dependent Claim 20 words
The method of claim 6 wherein said fluid is selected from the group consisting of water, steam, and mixtures thereof.
Claim 10
Dependent Claim 20 words
The method of claim 7 additionally comprising cutting the second layer prior to exposing the first layer to said fluid.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2006-04-07 2006-10-07 2007-04-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2010-04-07 2010-10-07 2011-04-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2014-04-07 2014-10-07 2015-04-08 $7700.00 Window Closed / Lapsed

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