US5798050A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
Assignee: International Business Machines Corp
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Filing: 1997-07-17
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Granted: 1998-08-25
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Expires: 2017-07-17
Abstract
Abstract A process for fabrication of an electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to penetrate the oxide coating on the conductive metal pads of an electronic module when force is applied to press the module against the film.
Inventors
- 👤 Michael A. Gaynes
- 👤 Jaynal A. Molla
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 10:30
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K3/40; H05K3/42; H05K3/423; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K3/10; H05K3/20; H05K3/205; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
70 words
A process for the fabrication of an adhesive dielectric film having regions of anisotropically oriented metal fibers comprising the steps of: a. producing a metallic pattern of the desired interconnection pad areas on a substrate; b. growing dendritic metallic filaments on said metallic pads; c. coating said substrate with a dielectric adhesive material to a thickness approximating the length of said filaments; and, d. selectively etching away said metallic pads.
Claim 2
Dependent Claim
70 words
A process for the fabrication of an adhesive dielectric film having regions of anisotropically oriented metal fibers comprising the steps of: a. producing a metallic pattern of the desired interconnection pad areas on a substrate; b. growing dendritic metallic filaments on said metallic pads; c. coating said substrate with a dielectric adhesive material to a thickness approximating the length of said filaments; and, d. selectively etching away said metallic pads.
Claim 3
Dependent Claim
14 words
A process according to claim 1, wherein said metallic pattern is made from nickel.
Claim 4
Dependent Claim
14 words
A process according to claim 1, wherein said dendritic filaments are made from palladium.
Claim 5
Dependent Claim
14 words
A process according to claim 1, wherein said dendritic filaments are made from palladium.
Claim 6
Dependent Claim
19 words
A process according to claim 1, wherein said dielectric adhesive film contains a dielectric filler of high thermal conductivity.
Claim 7
Dependent Claim
125 words
A process for the fabrication of an electronic assembly utilizing an adhesive dielectric film having regions of anisotropically oriented metal fibers for making connections between electronic module pads and circuit board pads comprising the steps of: a. producing a metallic pattern of the desired interconnection pad areas on a metallic substrate; b. growing dendritic metallic filaments on said metallic pads; c. coating said substrate with a dielectric adhesive material to a thickness approximating the length of said filaments; d. selectively etching away said metallic pads; e. positioning said adhesive film between said electronic modules and said circuit boards; and, f. applying pressure to said modules and said circuit board to create an electrical connection from said modules to said circuit board through said dendritic filaments.
Claim 8
Dependent Claim
125 words
A process for the fabrication of an electronic assembly utilizing an adhesive dielectric film having regions of anisotropically oriented metal fibers for making connections between electronic module pads and circuit board pads comprising the steps of: a. producing a metallic pattern of the desired interconnection pad areas on a metallic substrate; b. growing dendritic metallic filaments on said metallic pads; c. coating said substrate with a dielectric adhesive material to a thickness approximating the length of said filaments; d. selectively etching away said metallic pads; e. positioning said adhesive film between said electronic modules and said circuit boards; and, f. applying pressure to said modules and said circuit board to create an electrical connection from said modules to said circuit board through said dendritic filaments.
Claim 9
Dependent Claim
14 words
A process according to claim 6, wherein said metallic pattern is made from nickel.
Claim 10
Dependent Claim
14 words
A process according to claim 6, wherein said dendritic filaments are made from palladium.
Claim 11
Dependent Claim
14 words
A process according to claim 6, wherein said dendritic filaments are made from palladium.
Claim 12
Dependent Claim
19 words
A process according to claim 6, wherein said dielectric adhesive film contains a dielectric filler of high thermal conductivity.
Claim 13
Dependent Claim
30 words
A process according to claim 6, wherein said dielectric adhesive film contains a dielectric filler having a coefficient of thermal expansion chosen to match the film to said electronic modules.
Claim 14
Dependent Claim
31 words
A process according to claim 6, wherein said adhesive film further contains a dielectric filler having a coefficient of thermal expansion chosen to match the film to said wire carrying substrate.
Claim 15
Dependent Claim
35 words
A process according to claim 6, wherein said adhesive film further contains a dielectric filler having a coefficient of thermal expansion chosen to minimize the difference between said film, said electronic modules and said substrate.
References Cited (Backward Citations)
US5332869A
Cited
US5169471A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-24 | 2002-02-23 | 2002-08-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-24 | 2006-02-23 | 2006-08-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-24 | 2010-02-23 | 2010-08-25 | $7700.00 | Window Closed / Lapsed |