US6194076B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming adherent metal components on a polyimide substrate
Assignee: GlobalFoundries Inc
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Filing: 1997-04-22
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Granted: 2001-02-27
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Expires: 2017-04-22
Abstract
Abstract A method for attaching adherent metal components, particularly a copper film, on at least one surface of a polyimide substrate is provided. The method comprises the steps of: exposing at least one surface of the polyimide substrate to a reactive gas plasma that provides a level of ion bombardment of the polyimide surface sufficient to disrupt at least a portion of the imide groups on the surface and to form reactive carboxylate groups, carbonyl groups and other carbon-oxygen functional groups on the surface; and then depositing a metal film onto the chemically-modified surface without intervening exposure to air. The present invention also provides a copper-coated polyimide product comprising a polyimide substrate having a substantially smooth and chemically-modified surface and a copper film directly attached to the surface, i.e., the product is free of a polymeric adhesive layer or tie coat between the surface of the polyimide substrate and the copper film.
Inventors
- 👤 Luis J. Matienzo
- 👤 Kim J. Blackwell
- 👤 Frank D. Egitto
- 👤 Allan R. Knoll
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 08:44
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B38/00; B32B38/0008; B32B7/00; B32B7/04; B32B7/12; C; C23; C23C; C23C14/00; C23C14/02; C23C14/021; C23C14/022; C23C14/06; C23C14/14; C23C14/20; C23C14/205; H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; B32B2311/00; B32B2311/12; B32B2379/00; B32B2379/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/06; H05K2203/065; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
160 words
A copper-coated polyimide product comprising; a polyimide substrate having a substantially smooth surface; and a copper film attached to the substrate surface; wherein a portion of the copper atoms in the copper film are chemically bonded to functional groups of the polyimide at the surface; said copper being attached to the polyimide surface by the steps of: (a) exposing at least one surface of the polyimide substrate to a reactive gas plasma that provides a level of ion bombardment of at least 5×10 17 eV/liter-atm, wherein the level of ion bombardment is represented by the expression: (q)×(n + )×(φ f )/p; where q=the unit electronic charge (equal to 1 for units of eV/liter-atm); n + =the number density of positive ions in the plasma (liter −1 ); (φ f )=the potential difference between the plasma and the polyimide surface (volts); and p=pressure in atmospheres; and (b) then depositing a copper film onto the ion-bombarded surface without intervening exposure to air.
Claim 2
Dependent Claim
160 words
A copper-coated polyimide product comprising; a polyimide substrate having a substantially smooth surface; and a copper film attached to the substrate surface; wherein a portion of the copper atoms in the copper film are chemically bonded to functional groups of the polyimide at the surface; said copper being attached to the polyimide surface by the steps of: (a) exposing at least one surface of the polyimide substrate to a reactive gas plasma that provides a level of ion bombardment of at least 5×10 17 eV/liter-atm, wherein the level of ion bombardment is represented by the expression: (q)×(n + )×(φ f )/p; where q=the unit electronic charge (equal to 1 for units of eV/liter-atm); n + =the number density of positive ions in the plasma (liter −1 ); (φ f )=the potential difference between the plasma and the polyimide surface (volts); and p=pressure in atmospheres; and (b) then depositing a copper film onto the ion-bombarded surface without intervening exposure to air.
Claim 3
Dependent Claim
87 words
A copper-coated polyimide product comprising; a polyimide substrate having a substantially smooth surface; and a copper film attached to the substrate surface; wherein a portion of the copper atoms in the copper film are chemically-bonded to functional groups of the polyimide at the surface; said copper being attached to the polyimide surface by the steps of: (a) exposing the polyimide substrate to a reactive gas plasma comprising oxygen ions or nitrogen ions; and (b) then depositing a copper film onto the surface without intervening exposure to air.
Claim 4
Dependent Claim
87 words
A copper-coated polyimide product comprising; a polyimide substrate having a substantially smooth surface; and a copper film attached to the substrate surface; wherein a portion of the copper atoms in the copper film are chemically-bonded to functional groups of the polyimide at the surface; said copper being attached to the polyimide surface by the steps of: (a) exposing the polyimide substrate to a reactive gas plasma comprising oxygen ions or nitrogen ions; and (b) then depositing a copper film onto the surface without intervening exposure to air.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-27 | 2004-08-28 | 2005-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-27 | 2008-08-28 | 2009-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-27 | 2012-08-28 | 2013-02-27 | $7700.00 | Window Closed / Lapsed |