US6542376B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
High density packaging of electronic components
Assignee: L3 Technologies Inc
•
Filing: 2001-03-30
•
Granted: 2003-04-01
•
Expires: 2021-03-30
Abstract
Abstract Disclosed is an electronics packaging system, which provides for a high density assembly of groups of similar solid state part packages. The system provides a novel method for interconnecting the signal paths, structurally assembling and supporting the parts, and removing heat generated within the components. The system approach disclosed typically starts at the level of assembling pre-packaged parts into modules, and permeates through to the printed circuit board and box levels of assembly. The system is applicable, but not limited to, solid state memory device packaging, which typically consists of many similar parts interconnected in a matrix bus type configuration. The assembly of a building block of numerous memory components allows for the modular construction of large amounts of solid state memory.
Inventors
- 👤 Edwin George Watson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:41
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10; H10W; H10W90/00; H05K1/00; H05K1/02; H05K1/14; H10W70/00; H10W70/40; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/20
Claims Analysis
Total Claims: 84
Claim 1
Independent Claim
77 words
A high density electronic interconnect system, comprising: a plurality of electronic components positioned adjacent to one another, each of the electronic components having at least one lead; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over member that mimics the electronic components and is electrically coupled to the interconnect member and adapted to provide interconnectivity between the interconnect member and a printed circuit board.
Claim 2
Dependent Claim
77 words
A high density electronic interconnect system, comprising: a plurality of electronic components positioned adjacent to one another, each of the electronic components having at least one lead; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over member that mimics the electronic components and is electrically coupled to the interconnect member and adapted to provide interconnectivity between the interconnect member and a printed circuit board.
Claim 3
Dependent Claim
44 words
The interconnect system of claim 1 , wherein the interconnect member defines a first plane, and the cross-over device is adapted to be coupled to a printed circuit board that defines a second plane that is at a nonzero angle to the first plane.
Claim 4
Dependent Claim
33 words
The interconnect system of claim 1 , wherein the cross-over member is adapted to be coupled to the printed circuit board via a flexible ribbon extending from an end of the cross-over member.
Claim 5
Dependent Claim
29 words
The interconnect system of claim 1 , wherein the cross-over member has at least one lead, and the interconnect member is electrically coupled to the at least one lead.
Claim 6
Dependent Claim
60 words
The interconnect system of claim 1 , wherein the plurality of electronic components are positioned adjacent to one another such that the leads define a lead plane, and wherein the cross-over member has a plurality of leads and is disposed relative to the plurality of electronic components such that the leads of the cross-over member are in the lead plane.
Claim 7
Dependent Claim
44 words
The interconnect system of claim 1 , further comprising: a second electrically conductive interconnect member that is electrically coupled to a second respective lead from each of the electronic components, wherein the cross-over member is adapted to carry electrical signals between the interconnect members.
Claim 8
Dependent Claim
31 words
The interconnect system of claim 6 , wherein the crossover member includes a housing having an interior region in which circuit paths are arranged to route signals between the interconnect members.
Claim 9
Dependent Claim
53 words
The interconnect system of claim 1 , wherein at least one of the electronic components has a control lead, the interconnect system further comprising: an electrically conductive control member that is electrically coupled to the control lead and adapted to electrically couple the at least one electronic component to a control signal source.
Claim 10
Dependent Claim
33 words
The interconnect system of claim 1 , further comprising: a thermally conductive member coupled to the plurality of electronic components and extending beyond an end of at least one of the electronic components.
Claim 11
Dependent Claim
37 words
The interconnect system of claim 9 , wherein the thermally conductive member is stamped from a sheet of thermally conductive material, and includes a tab that extends beyond the end of the at least one electronic component.
Claim 12
Dependent Claim
21 words
The interconnect system of claim 1 , wherein the electronic components are affixed to one another via a thermally conductive epoxy.
Claim 13
Dependent Claim
36 words
The interconnect system of claim 6 , wherein the crossover member includes a housing having an interior region in which circuit paths are arranged to route signals between the interconnect member and the printed circuit board.
Claim 14
Dependent Claim
52 words
An interconnect ribbon for a high density electronic interconnect system, comprising: an electrically conductive elongated member, and a plurality of electrically conductive spring clips disposed along a length of the elongated member, each of said spring clips being adapted to couple the interconnect ribbon to a respective lead of an electronic component.
Claim 15
Dependent Claim
52 words
An interconnect ribbon for a high density electronic interconnect system, comprising: an electrically conductive elongated member, and a plurality of electrically conductive spring clips disposed along a length of the elongated member, each of said spring clips being adapted to couple the interconnect ribbon to a respective lead of an electronic component.
Claim 16
Dependent Claim
37 words
The interconnect ribbon of claim 13 , further comprising a plurality of solder holes disposed along the length of the elongated member and extending therethrough via which the interconnect ribbon can be soldered to the respective lead.
Claim 17
Dependent Claim
32 words
The interconnect ribbon of claim 13 , wherein at least one of the spring clips includes a solder application hole via which the interconnect ribbon can be soldered to the respective lead.
Claim 18
Dependent Claim
100 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective substrate, each said substrate having a respective trace corresponding to each said lead and extending from the corresponding lead to a respective notch at an edge of the substrate; and an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads, wherein the interconnect member engages the notches to establish electrical contact with a corresponding trace.
Claim 19
Dependent Claim
100 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective substrate, each said substrate having a respective trace corresponding to each said lead and extending from the corresponding lead to a respective notch at an edge of the substrate; and an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads, wherein the interconnect member engages the notches to establish electrical contact with a corresponding trace.
Claim 20
Dependent Claim
49 words
The interconnect system of claim 16 , wherein the interconnect member includes an elongated portion and a plurality of connection members disposed along a length of the elongated portion, each said connection member adapted to engage the edge of the substrate and establish electrical contact with the corresponding trace.
Claim 21
Dependent Claim
29 words
The interconnect system of claim 17 , wherein each said connection member includes a notch that is adapted to engage a corresponding notch at the edge of the substrate.
Claim 22
Dependent Claim
116 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source, wherein the interconnect member defines a first plane, and the cross-over device is adapted to be coupled to a substrate that defines a second plane that is at a nonzero angle to the first plane.
Claim 23
Dependent Claim
116 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source, wherein the interconnect member defines a first plane, and the cross-over device is adapted to be coupled to a substrate that defines a second plane that is at a nonzero angle to the first plane.
Claim 24
Dependent Claim
32 words
The interconnect system of claim 19 , wherein the cross-over device is adapted to be coupled to the signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 25
Dependent Claim
29 words
The interconnect system of claim 19 , wherein the cross-over device has at least one lead, and the interconnect member is electrically coupled to the at least one lead.
Claim 26
Dependent Claim
39 words
The interconnect system of claim 19 , wherein the cross-over device has a plurality of leads, and is disposed relative to the plurality of electronic components such that the leads of the cross-over device are in the lead plane.
Claim 27
Dependent Claim
44 words
The interconnect system of claim 19 , further comprising: a second electrically conductive interconnect member that is electrically coupled to a second respective lead from each of the electronic components, wherein the cross-over device is adapted to carry electrical signals between the interconnect members.
Claim 28
Dependent Claim
53 words
The interconnect system of claim 19 , wherein at least one of the electronic components has a control lead, the interconnect system further comprising: an electrically conductive control member that is electrically coupled to the control lead and adapted to electrically couple the at least one electronic component to a control signal source.
Claim 29
Dependent Claim
33 words
The interconnect system of claim 19 , further comprising: a thermally conductive member coupled to the plurality of electronic components and extending beyond an end of at least one of the electronic components.
Claim 30
Dependent Claim
37 words
The interconnect system of claim 25 , wherein the thermally conductive member is stamped from a sheet of thermally conductive material, and includes a tab that extends beyond the end of the at least one electronic component.
Claim 31
Dependent Claim
21 words
The interconnect system of claim 19 , wherein the electronic components are affixed to one another via a thermally conductive epoxy.
Claim 32
Dependent Claim
113 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source, wherein the cross-over device has a plurality of leads, and is disposed relative to the plurality of electronic components such that the leads of the cross-over device are in the lead plane.
Claim 33
Dependent Claim
113 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source, wherein the cross-over device has a plurality of leads, and is disposed relative to the plurality of electronic components such that the leads of the cross-over device are in the lead plane.
Claim 34
Dependent Claim
32 words
The interconnect system of claim 28 , wherein the cross-over device is adapted to be coupled to the signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 35
Dependent Claim
29 words
The interconnect system of claim 28 , wherein the cross-over device has at least one lead, and the interconnect member is electrically coupled to the at least one lead.
Claim 36
Dependent Claim
44 words
The interconnect system of claim 28 , further comprising: a second electrically conductive interconnect member that is electrically coupled to a second respective lead from each of the electronic components, wherein the cross-over device is adapted to carry electrical signals between the interconnect members.
Claim 37
Dependent Claim
54 words
The interconnect system of claim 28 , where in at least one of the electronic components has a control lead, the interconnect system further comprising: an electrically conductive control member that is electrically coupled to the control lead and adapted to electrically couple the at least one electronic component to a control signal source.
Claim 38
Dependent Claim
33 words
The interconnect system of claim 28 , further comprising: a thermally conductive member coupled to the plurality of electronic components and extending beyond an end of at least one of the electronic components.
Claim 39
Dependent Claim
37 words
The interconnect system of claim 33 , wherein the thermally conductive member is stamped from a sheet of thermally conductive material, and includes a tab that extends beyond the end of the at least one electronic component.
Claim 40
Dependent Claim
21 words
The interconnect system of claim 28 , wherein the electronic components are affixed to one another via a thermally conductive epoxy.
Claim 41
Dependent Claim
105 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source; and a thermally conductive member coupled to the plurality of electronic components and extending beyond an end of at least one of the electronic components.
Claim 42
Dependent Claim
105 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source; and a thermally conductive member coupled to the plurality of electronic components and extending beyond an end of at least one of the electronic components.
Claim 43
Dependent Claim
32 words
The interconnect system of claim 36 , wherein the cross-over device is adapted to be coupled to the signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 44
Dependent Claim
29 words
The interconnect system of claim 36 , wherein the cross-over device has at least one lead, and the interconnect member is electrically coupled to the at least one lead.
Claim 45
Dependent Claim
44 words
The interconnect system of claim 36 , further comprising: a second electrically conductive interconnect member that is electrically coupled to a second respective lead from each of the electronic components, wherein the cross-over device is adapted to carry electrical signals between the interconnect members.
Claim 46
Dependent Claim
53 words
The interconnect system of claim 36 , wherein at least one of the electronic components has a control lead, the interconnect system further comprising: an electrically conductive control member that is electrically coupled to the control lead and adapted to electrically couple the at least one electronic component to a control signal source.
Claim 47
Dependent Claim
37 words
The interconnect system of claim 36 , wherein the thermally conductive member is stamped from a sheet of thermally conductive material, and includes a tab that extends beyond the end of the at least on electronic component.
Claim 48
Dependent Claim
21 words
The interconnect system of claim 36 , wherein the electronic components are affixed to one another via a thermally conductive epoxy.
Claim 49
Dependent Claim
91 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane and affixed to one another via a thermally conductive epoxy; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source.
Claim 50
Dependent Claim
91 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each having a plurality of leads, the plurality of electronic components positioned adjacent to one another such that the leads define a lead plane and affixed to one another via a thermally conductive epoxy; an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components; and a cross-over device that is electrically coupled to the interconnect member and adapted to carry electrical signals between the interconnect member and a signaling source.
Claim 51
Dependent Claim
32 words
The interconnect system of claim 43 , wherein the cross-over device is adapted to be coupled to the signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 52
Dependent Claim
29 words
The interconnect system of claim 43 , wherein the cross-over device has at least one lead, and the interconnect member is electrically coupled to the at least one lead.
Claim 53
Dependent Claim
44 words
The interconnect system of claim 43 , further comprising: a second electrically conductive interconnect member that is electrically coupled to a second respective lead from each of the electronic components, wherein the cross-over device is adapted to carry electrical signals between the interconnect members.
Claim 54
Dependent Claim
53 words
The interconnect system of claim 43 , wherein at least one of the electronic components has a control lead, the interconnect system further comprising: an electrically conductive control member that is electrically coupled to the control lead and adapted to electrically couple the at least one electronic component to a control signal source.
Claim 55
Dependent Claim
123 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective substrate, each said substrate having a respective trace corresponding to each said lead and extending from the corresponding lead to an edge of the substrate; and an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads, wherein the interconnect member includes an elongated portion and a plurality of connection members disposed along a length of the elongated portion, each said connection member adapted to engage the edge of the substrate and establish electrical contact with a corresponding trace.
Claim 56
Dependent Claim
123 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective substrate, each said substrate having a respective trace corresponding to each said lead and extending from the corresponding lead to an edge of the substrate; and an electrically conductive interconnect member that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads, wherein the interconnect member includes an elongated portion and a plurality of connection members disposed along a length of the elongated portion, each said connection member adapted to engage the edge of the substrate and establish electrical contact with a corresponding trace.
Claim 57
Dependent Claim
19 words
The interconnect system of claim 48 , wherein the traces extend to notches at the edge of the substrate.
Claim 58
Dependent Claim
41 words
The interconnect system of claim 48 , wherein the traces extend to notches at the edge of the substrate, and each said connection member includes a notch that is adapted to engage a corresponding notch at the edge of the substrate.
Claim 59
Dependent Claim
30 words
The interconnect system of claim 48 , wherein the substrates are portions of a flexible ribbon and the interconnect member is an electrically conductive trace disposed on the flexible ribbon.
Claim 60
Dependent Claim
84 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective portion of a flexible ribbon, each said portion having a respective trace corresponding to each said lead and extending from the corresponding lead to an edge of the portion; and an electrically conductive trace that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads.
Claim 61
Dependent Claim
84 words
A high density electronic interconnect system, comprising: a plurality of electronic components, each of said electronic components having a plurality of leads and being mounted to a respective portion of a flexible ribbon, each said portion having a respective trace corresponding to each said lead and extending from the corresponding lead to an edge of the portion; and an electrically conductive trace that is electrically coupled to a respective lead from each of the electronic components via the traces corresponding to the respective leads.
Claim 62
Dependent Claim
19 words
The interconnect system of claim 52 , wherein the traces extend to notches at the edge of the substrate.
Claim 63
Dependent Claim
29 words
The interconnect system of claim 53 , wherein each said connection member includes a notch that is adapted to engage a corresponding notch at the edge of the substrate.
Claim 64
Independent Claim
76 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having at least one lead; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over member that mimics the electronic components and is adapted to provide interconnectivity between the interconnect member and a printed circuit board.
Claim 65
Independent Claim
76 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having at least one lead; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over member that mimics the electronic components and is adapted to provide interconnectivity between the interconnect member and a printed circuit board.
Claim 66
Dependent Claim
56 words
The method of claim 55 , further comprising: coupling the interconnect member to the electronic components and the cross-over member such that the interconnect member defines a first plane, and the cross-over member can be coupled to a printed circuit board that defines a second plane that is at a nonzero angle to the first plane.
Claim 67
Dependent Claim
44 words
The method of claim 55 , further comprising: coupling the interconnect member to a cross-over member that is adapted to carry electrical signals between the interconnect member and the printed circuit board via a flexible ribbon extending from an end of the cross-over member.
Claim 68
Dependent Claim
28 words
The method of claim 55 , wherein coupling the interconnect member to the cross-over member comprises electrically coupling the interconnect member to a lead of the cross-over member.
Claim 69
Dependent Claim
45 words
The method of claim 55 , further comprising: electrically coupling a second electrically conductive interconnect member to the cross-over member and to a second respective lead from each of the electronic components, such that the cross-over member can carry electrical signals between the interconnect members.
Claim 70
Dependent Claim
46 words
The method of claim 55 , further comprising: electrically coupling an electrically conductive control member to a control lead of at least one of the electronic components, the control member being adapted to electrically couple the at least one electronic component to a control signal source.
Claim 71
Dependent Claim
38 words
The method of claim 55 , further comprising: coupling a thermally conductive member to a least one of the electronic components such that the thermally conductive member extends beyond an end of the at least one electronic component.
Claim 72
Dependent Claim
27 words
The method of claim 55 , wherein bonding together the plurality of electronic components comprises affixing the electronic components to one another via a thermally conductive epoxy.
Claim 73
Independent Claim
26 words
The method of clam 55 , wherein coupling the electrically conductive interconnect member to the respective leads comprises soldering the interconnect member to the respective leads.
Claim 74
Independent Claim
26 words
The method of clam 55 , wherein coupling the electrically conductive interconnect member to the respective leads comprises soldering the interconnect member to the respective leads.
Claim 75
Independent Claim
125 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source, such that the interconnect member defines a first plane, and the cross-over device can be coupled to a substrate that defines a second plane that is at a nonzero angle to the first plane.
Claim 76
Independent Claim
125 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source, such that the interconnect member defines a first plane, and the cross-over device can be coupled to a substrate that defines a second plane that is at a nonzero angle to the first plane.
Claim 77
Independent Claim
103 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 78
Independent Claim
103 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source via a flexible ribbon extending from an end of the cross-over device.
Claim 79
Independent Claim
94 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a lead of a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source.
Claim 80
Independent Claim
94 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a lead of a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source.
Claim 81
Independent Claim
121 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source; and coupling a thermally conductive member to a least one of the electronic components such that the thermally conductive member extends beyond an end of the at least one electronic component.
Claim 82
Independent Claim
121 words
A method for manufacturing a high density electronic interconnect system, the method comprising: bonding together a plurality of electronic components, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source; and coupling a thermally conductive member to a least one of the electronic components such that the thermally conductive member extends beyond an end of the at least one electronic component.
Claim 83
Independent Claim
107 words
A method for manufacturing a high density electronic interconnect system, the method comprising: affixing a plurality of electronic components to one another via a thermally conductive epoxy, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source, wherein bonding together the plurality of electronic components comprises.
Claim 84
Independent Claim
107 words
A method for manufacturing a high density electronic interconnect system, the method comprising: affixing a plurality of electronic components to one another via a thermally conductive epoxy, each said electronic component having a plurality of leads, such that the plurality of electronic components are positioned adjacent to one another and the leads define a lead plane; electrically coupling an electrically conductive interconnect member to a respective lead from each of the electronic components; and electrically coupling to the interconnect member a cross-over device that is adapted to carry electrical signals between the interconnect member and a signaling source, wherein bonding together the plurality of electronic components comprises.
References Cited (Backward Citations)
US3878341A
Cited
US5343075A
Cited
US5637536A
Cited
US5677569A
Cited
US5592364A
Cited
US5514907A
Cited
US5764497A
Cited
US5754405A
Cited
US5841638A
Cited
US5969953A
Cited
US5857858A
Cited
US6061245A
Cited
US6153929A
Cited
US6410983B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-31 | 2006-09-30 | 2007-04-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-31 | 2010-09-30 | 2011-04-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-31 | 2014-09-30 | 2015-04-01 | $7700.00 | Window Closed / Lapsed |