US6061245A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Free standing, three dimensional, multi-chip, carrier package with air flow baffle
Assignee: International Business Machines Corp
•
Filing: 1998-01-22
•
Granted: 2000-05-09
•
Expires: 2018-01-22
Abstract
Abstract An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
Inventors
- 👤 Anthony P. Ingraham
- 👤 Glenn L. Kehley
- 👤 Sanjeev B. Sathe
- 👤 John R. Slack
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:01
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H10; H10W; H10W40/00; H10W40/40; H10W40/43; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H10W72/00; H10W72/60; H10W90/20; H10W90/231; H10W90/288
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
94 words
A circuitized chip carrier comprising: a circuitized substrate composed of a flexible material formed into a predetermined shape which functions as an air flow baffle; a means for holding said circuitized flexible material in the predetermined shape, wherein said means for holding is circuitized with a multiplicity of conductive pads; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling air passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 2
Dependent Claim
94 words
A circuitized chip carrier comprising: a circuitized substrate composed of a flexible material formed into a predetermined shape which functions as an air flow baffle; a means for holding said circuitized flexible material in the predetermined shape, wherein said means for holding is circuitized with a multiplicity of conductive pads; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling air passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 3
Dependent Claim
19 words
A circuitized chip carrier as in claim 1, wherein said means for holding contains a multiplicity of electrical contacts.
Claim 4
Dependent Claim
30 words
A circuitized chip carrier as in claim 2, wherein said flexible material has a multiplicity of electrical connection pads to connect to said electrical contacts on said means for holding.
Claim 5
Dependent Claim
27 words
A circuitized chip carrier as in claim 3, wherein said means for holding has contact pads for mounting electrical components, chips, modules, substrates, or circuitized flexible material.
Claim 6
Dependent Claim
64 words
A circuitized chip carrier comprising: a circuitized substrate formed into a spring-like coil which functions as an air flow baffle; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling air passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 7
Dependent Claim
64 words
A circuitized chip carrier comprising: a circuitized substrate formed into a spring-like coil which functions as an air flow baffle; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling air passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 8
Dependent Claim
31 words
A circuitized chip carrier as in claim 5, wherein said spring-like coil is comprised of a series of geometric shapes selected from the group consisting of triangles, squares, polygons, or circles.
Claim 9
Dependent Claim
80 words
A circuitized chip carrier comprising: a circuitized substrate composed of a flexible material formed into a predetermined shape by a pair of slotted end caps having directional fluid flow openings which functions as an air flow baffle; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 10
Dependent Claim
80 words
A circuitized chip carrier comprising: a circuitized substrate composed of a flexible material formed into a predetermined shape by a pair of slotted end caps having directional fluid flow openings which functions as an air flow baffle; electronic component connection means on the circuitized substrate at locations that expose connected electronic components to cooling passing through the air flow baffle; and interconnection pads on the circuitized substrate for connecting the circuitized substrate to another substrate, module or other chip carrier.
Claim 11
Independent Claim
108 words
A method of attaching at least a first flexible circuit substrate to a second flexible circuit substrate, each said flexible circuit substrate including surface component mounting contact pads, flex circuit contact pads, and flex to substrate contact pads, said method comprising the steps of: attaching surface mount components to said first and second flexible circuit substrates; forming said first and second flexible circuit substrates into a three dimensional shape; attaching end caps at each end of said formed first and second flexible circuit substrates; and joining said flex circuit contact pads of said first flexible circuit substrate to said flex circuit contact pads of second flexible circuit substrate.
Claim 12
Independent Claim
108 words
A method of attaching at least a first flexible circuit substrate to a second flexible circuit substrate, each said flexible circuit substrate including surface component mounting contact pads, flex circuit contact pads, and flex to substrate contact pads, said method comprising the steps of: attaching surface mount components to said first and second flexible circuit substrates; forming said first and second flexible circuit substrates into a three dimensional shape; attaching end caps at each end of said formed first and second flexible circuit substrates; and joining said flex circuit contact pads of said first flexible circuit substrate to said flex circuit contact pads of second flexible circuit substrate.
Claim 13
Dependent Claim
27 words
The method of claim 8 further including the step of: attaching substrate contact pads of said joined first and second flexible circuit substrates to a circuit substrate.
Claim 14
Dependent Claim
40 words
The method of claim 9 wherein a conductive adhesive is used in attaching surface mount components to said first and second flexible circuit substrates, joining said flex circuit contact pads and attaching said substrate contact pads to said circuit substrate.
Claim 15
Dependent Claim
28 words
The method of claim 8 wherein in the forming step, said first and second flexible circuit substrates are folded over a cylindrical shape thereby preventing circuit line damage.
Claim 16
Dependent Claim
23 words
The method of claim 8 wherein in the forming step, said first and second flexible circuit substrates are folded to form serpentine structures.
Claim 17
Dependent Claim
23 words
The method of claim 8 wherein in the forming step, said first and second flexible circuit substrates are folded to form coiled structures.
Claim 18
Dependent Claim
36 words
The method of claim 8 wherein in the forming step, said first flexible circuit substrates is folded to form a coiled structure and said second first flexible circuit substrates is folded to form a serpentine structure.
References Cited (Backward Citations)
US3341742A
Cited
US3454911A
Cited
DE2844096A1
Cited
US4426689A
Cited
JPS58171689A
Cited
US5220488A
Cited
US4781601A
Cited
US5345205A
Cited
US5452182A
Cited
US5252857A
Cited
US5179501A
Cited
US5382829A
Cited
JPH0697621A
Cited
US5544015A
Cited
US5519578A
Cited
US5747743A
Cited
US5448511A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-09 | 2003-11-08 | 2004-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-09 | 2007-11-08 | 2008-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-09 | 2011-11-08 | 2012-05-09 | $7700.00 | Window Closed / Lapsed |