Compact high density interconnected microwave system

Claim 2

A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers.

Claim 3

The microwave system recited in claim 1 further comprising: a flexible support member bonded to said flexible high density interconnect structure at a bend in said flexible high density interconnect structure, said flexible high density interconnect structure at the bend having an inside facing radially inwardly and an outside facing radially outwardly.

Claim 4

The microwave system recited in claim 2 wherein: said flexible support member is disposed on the outside of said high density interconnect structure at said bend.

Claim 5

The microwave system recited in claim 2 wherein: said flexible support member is bonded to the same side of said dielectric layer as said electronic modules.

Claim 6

The microwave system recited in claim 4 wherein: said flexible support member is disposed on the outside of said high density interconnect structure at said bend.

Claim 7

The microwave system recited in claim 4 wherein: said electronic modules are bonded to said dielectric layer by an adhesive material, and said flexible support member is bonded to said dielectric layer by the same adhesive material as bonds said electronic modules to said dielectric layer.

Claim 8

The microwave system recited in claim 6 wherein: said flexible support member is disposed at a bend in said flexible high density interconnect structure; and at said bend, said support member is disposed on the outside of said high density interconnect structure.

Claim 9

The microwave system recited in claim 4 further comprising: a second support member bonded to the opposite side of said structure from said electronic modules.

Claim 10

A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and flexible conductors supported by said dielectric layer which are ohmically connected to said respective electrical contacts of said microwave electronic modules; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a first flexible support member bonded to said flexible high density interconnect structure at a bend in said high density interconnect structure; a second flexible support member bonded to the opposite side of said structure from said electronic modules; said second flexible support member being disposed at another bend in said flexible high density interconnect structure, said flexible high density interconnect structure at said another bend having an inside facing radially inwardly and an outside facing radially outwardly; and said second flexible support member being disposed on the outside of said high density interconnect structure at said another bend.

Claim 11

A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and flexible conductors supported by said dielectric layer which are ohmically connected to said respective electrical contacts of said microwave electronic modules; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a first flexible support member bonded to said flexible high density interconnect structure at a bend in said high density interconnect structure; a second flexible support member bonded to the opposite side of said structure from said electronic modules; said second flexible support member being disposed at another bend in said flexible high density interconnect structure, said flexible high density interconnect structure at said another bend having an inside facing radially inwardly and an outside facing radially outwardly; and said second flexible support member being disposed on the outside of said high density interconnect structure at said another bend.

Claim 12

The microwave system recited in claim 9 further comprising: a heat sink disposed in thermal contact with one of said modules.

Claim 13

The microwave system recited in claim 10 wherein: said stack has two ends and said module which is disposed in thermal contact with said heat sink is disposed at one end of said stack.

Claim 14

The electronic system recited in claim 10 wherein: each of said modules has a face side bonded to said dielectric layer and a back side opposite the face side, and two sequential ones of said modules are disposed in back-to-back relation.

Claim 15

The microwave system recited in claim 12 wherein: said back-to-back modules are disposed in back-to-back contact.

Claim 16

The microwave system recited in claim 12 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure between tiers of said stack.

Claim 17

The microwave system recited in claim 1 wherein: said high density interconnect structure comprises a serpentine structure in which said modules are disposed between bends in said serpentine structure.

Claim 18

The microwave system recited in claim 15 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure.

Claim 19

The microwave system recited in claim 1 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure.

Claim 20

The microwave system recited in claim 1 wherein: two sequential ones of said modules are disposed back-to-back relation.

Claim 21

The microwave system recited in claim 18 wherein: said back-to-back modules are disposed in back-to-back contact.

Claim 22

The microwave system recited in claim 1 wherein: said modules are electrically connected in series.

Claim 23

The microwave system recited in claim 1 wherein: said modules are electrically connected in parallel.

Claim 24

The microwave system recited in claim 1 wherein: said system includes a heat spreading member; and a first one of said modules is disposed in thermal contact with said heat spreading member.

Claim 25

A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a support mandrel having a curved surface; and a portion of said flexible high density interconnect structure being disposed in contact with said curved surface where said flexible high density interconnect structure is bent between two adjacent ones of said modules.

Claim 26

A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a support mandrel having a curved surface; and a portion of said flexible high density interconnect structure being disposed in contact with said curved surface where said flexible high density interconnect structure is bent between two adjacent ones of said modules.

Claim 29

The method recited in claim 24 wherein the step of bending comprises: providing a support mandrel; and bending said flexible portion of said high density interconnect structure along a curved surface of the support mandrel.

Claim 30

The method recited in claim 24 wherein the step of physically and electrically interconnecting said components includes: bonding such components to one side of the high density interconnect structure; and which method further comprises the step of: bonding a support member to the side of said high density interconnect structure opposite said components.