US6410983B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
Assignee: Fujitsu Ltd
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Filing: 2000-02-24
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Granted: 2002-06-25
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Expires: 2020-02-24
Abstract
Abstract A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.
Inventors
- 👤 Kiyokazu Moriizumi
- 👤 Satoshi Osawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:33
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/147; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H05K1/148; H05K1/18; H05K1/189; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10704; H05K3/00; H05K3/36; H05K3/361; H05K3/368; H10W70/62; H10W70/63; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/90; H10W72/941; H10W72/9415; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
75 words
A semiconductor device comprising: a first multi-chip module having a plurality of functional parts mounted on a first rigid circuit board; a second multi-chip module having a plurality of functional parts mounted on a second rigid circuit board; a flexible wiring board connecting the first multi-chip module to the second multi-chip module; and an interface part mounted on the flexible wiring board, the interface part controlling input and output signals of the first multi-chip module.
Claim 2
Dependent Claim
75 words
A semiconductor device comprising: a first multi-chip module having a plurality of functional parts mounted on a first rigid circuit board; a second multi-chip module having a plurality of functional parts mounted on a second rigid circuit board; a flexible wiring board connecting the first multi-chip module to the second multi-chip module; and an interface part mounted on the flexible wiring board, the interface part controlling input and output signals of the first multi-chip module.
Claim 3
Dependent Claim
77 words
The semiconductor device as claimed in claim 1 , wherein a connecting portion of the flexible wiring board is connected to the first multi-chip module by being mounted to the circuit board of the first multi-chip module so that the interface part is mounted on the connecting portion of the flexible wiring board, a terminal of the first multi-chip module being electrically connected to a wiring pattern of the first multi-chip module through the flexible wiring board.
Claim 4
Dependent Claim
38 words
The semiconductor device as claimed in claim 2 , wherein the terminal of the first multi-chip module is electrically connected to the wiring pattern of the first multi-chip module by a via formed in the flexible wiring board.
Claim 5
Dependent Claim
47 words
The semiconductor device as claimed in claim 1 , further comprising a third multi-chip module having a plurality of functional parts mounted on a circuit board, wherein the flexible wiring board connects the first multi-chip module to both the second multi-chip module and the third multi-chip module.
Claim 6
Dependent Claim
43 words
The semiconductor device as claimed in claim 4 , wherein the flexible wiring board has a first portion extending from the first multi-chip to the second multi-chip module and a second portion extending from the first multi-chip module to the third multi-chip module.
Claim 7
Dependent Claim
51 words
The semiconductor device as claimed in claim 1 , further comprising a third multi-chip module and a fourth multi-chip module, wherein the flexible wiring board has a substantially square shape so that four corners of the flexible wiring board are connected to the first, second, third and fourth multi-chip modules, respectively.
Claim 8
Dependent Claim
33 words
The semiconductor device as claimed in claim 6 , wherein the flexible wiring board has a structure to absorb a positional offset of each of the first, second, third and fourth multi-chip modules.
Claim 9
Dependent Claim
30 words
The semiconductor device as claimed in claim 7 , wherein the structure to absorb a positional offset includes a square opening formed in the center of the flexible wiring board.
Claim 10
Dependent Claim
30 words
The semiconductor device as claimed in claim 7 , wherein the structure to absorb a positional offset includes a cross-shaped slit formed in the center of the flexible wiring board.
Claim 11
Dependent Claim
27 words
The semiconductor device as claimed in claim 7 , further comprising a frame retaining the first, second, third and fourth multi-chip modules in a predetermined positional relationship.
Claim 12
Dependent Claim
90 words
A printed circuit-board unit comprising: a motherboard; and a semiconductor device mounted on the motherboard, the semiconductor device comprising: a first multi-chip module having a plurality of functional parts mounted on a first rigid circuit board; a second multi-chip module having a plurality of functional parts mounted on a second rigid circuit board; a flexible wiring board connecting the first multi-chip module to the second multi-chip module; and an interface part mounted on the flexible wiring board, the interface part controlling input and output signals of the first multi-chip module.
Claim 13
Dependent Claim
90 words
A printed circuit-board unit comprising: a motherboard; and a semiconductor device mounted on the motherboard, the semiconductor device comprising: a first multi-chip module having a plurality of functional parts mounted on a first rigid circuit board; a second multi-chip module having a plurality of functional parts mounted on a second rigid circuit board; a flexible wiring board connecting the first multi-chip module to the second multi-chip module; and an interface part mounted on the flexible wiring board, the interface part controlling input and output signals of the first multi-chip module.
Claim 14
Dependent Claim
56 words
A semiconductor device comprising: a plurality of multi-chip modules each having a plurality of functional parts mounted on a rigid circuit board; a flexible wiring board connecting the multi-chip modules to each other; and an interface part mounted on the wiring board, the interface part controlling input and output signals of each of the multi-chip modules.
Claim 15
Dependent Claim
56 words
A semiconductor device comprising: a plurality of multi-chip modules each having a plurality of functional parts mounted on a rigid circuit board; a flexible wiring board connecting the multi-chip modules to each other; and an interface part mounted on the wiring board, the interface part controlling input and output signals of each of the multi-chip modules.
Claim 16
Dependent Claim
71 words
A printed circuit-board unit comprising: a motherboard; and a semiconductor device mounted on the motherboard, the semiconductor device comprising: a plurality of multi-chip modules each having a plurality of functional parts mounted on a rigid circuit board; a flexible wiring board connecting the multi-chip modules to each other; and an interface part mounted on the wiring board, the interface part controlling input and output signals of each of the multi-chip modules.
Claim 17
Dependent Claim
71 words
A printed circuit-board unit comprising: a motherboard; and a semiconductor device mounted on the motherboard, the semiconductor device comprising: a plurality of multi-chip modules each having a plurality of functional parts mounted on a rigid circuit board; a flexible wiring board connecting the multi-chip modules to each other; and an interface part mounted on the wiring board, the interface part controlling input and output signals of each of the multi-chip modules.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-24 | 2005-12-24 | 2006-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-24 | 2009-12-24 | 2010-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-24 | 2013-12-24 | 2014-06-25 | $7700.00 | Window Closed / Lapsed |