US6518516B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayered laminate
Assignee: GlobalFoundries Inc
•
Filing: 2002-04-11
•
Granted: 2003-02-11
•
Expires: 2022-04-11
Abstract
Abstract A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures and (c) a second intermediate layer having microvias and conductive lands.
Inventors
- 👤 Kim J. Blackwell
- 👤 Frank D. Egitto
- 👤 Voya R. Markovich
- 👤 Manh-Quan T. Nguyen
- 👤 Douglas O. Powell
- 👤 David L. Thomas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:52
CPC Classifications
H; H10; H10W; H10W72/00; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W90/00; H10W90/401; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2201/095; H05K2201/09536; H05K3/40; H05K3/42; H05K3/429; H05K3/4602; H05K3/4623; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
157 words
A method for forming a multilayered laminate, comprising: stacking a plurality of signal/power plane substructures to form a stack of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S3P substructure, and an 0S1P substructure and a 0S3P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; positioning a first continuously conductive layer on a first dielectric layer, said first dielectric layer stacked on a first side of said stack of signal/power plane substructures; positioning a second continuously conductive layer on a second dielectric layer, said second dielectric layer stacked on a second side of said stack of signal/power plane substructures; and applying heat and/or pressure to the resultant stack of signal/power plane substructures and said first and second dielectric layers and said first and second continuously conductive layers to form said multilayered laminate.
Claim 2
Independent Claim
157 words
A method for forming a multilayered laminate, comprising: stacking a plurality of signal/power plane substructures to form a stack of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S3P substructure, and an 0S1P substructure and a 0S3P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; positioning a first continuously conductive layer on a first dielectric layer, said first dielectric layer stacked on a first side of said stack of signal/power plane substructures; positioning a second continuously conductive layer on a second dielectric layer, said second dielectric layer stacked on a second side of said stack of signal/power plane substructures; and applying heat and/or pressure to the resultant stack of signal/power plane substructures and said first and second dielectric layers and said first and second continuously conductive layers to form said multilayered laminate.
Claim 3
Independent Claim
172 words
A method for forming a multilayered laminate, comprising: stacking a plurality of signal/power plane substructures to form a stack of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S1P substructure and a 2S1P substructure, an 0S3P substructure and said 2S1P substructure, and said 0S1P substructure and said 0S3P substructure and said 2S1P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; positioning a first continuously conductive layer on a first dielectric layer, said first dielectric layer stacked on a first side of said stack of signal/power plane substructures; positioning a second continuously conductive layer on a second dielectric layer, said second dielectric layer stacked on a second side of said stack of signal/power plane substructures; and applying heat and/or pressure to the resultant stack of signal/power plane substructures and said first and second dielectric layers and said first and second continuously conductive layers to form said multilayered laminate.
Claim 4
Independent Claim
172 words
A method for forming a multilayered laminate, comprising: stacking a plurality of signal/power plane substructures to form a stack of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S1P substructure and a 2S1P substructure, an 0S3P substructure and said 2S1P substructure, and said 0S1P substructure and said 0S3P substructure and said 2S1P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; positioning a first continuously conductive layer on a first dielectric layer, said first dielectric layer stacked on a first side of said stack of signal/power plane substructures; positioning a second continuously conductive layer on a second dielectric layer, said second dielectric layer stacked on a second side of said stack of signal/power plane substructures; and applying heat and/or pressure to the resultant stack of signal/power plane substructures and said first and second dielectric layers and said first and second continuously conductive layers to form said multilayered laminate.
Claim 5
Dependent Claim
47 words
The method of claim 2 , wherein said plurality of signal/power planes includes at least one 0S1P substructure and wherein intervening dielectric layers immediately adjacent to opposite sides of each 0S1P substructure are laminated to each 0S1P substructure prior to stacking said stack of signal/power planes substructures.
Claim 6
Dependent Claim
41 words
The method of claim 2 , wherein said first dielectric layer is applied to said first continuously conductive layer and said second dielectric layer is applied to said second continuously conductive layer prior to stacking said stack of signal/power planes substructures.
Claim 7
Dependent Claim
19 words
The method of claim 2 , further comprising forming one or more plated through holes through said multilayered laminate.
Claim 8
Dependent Claim
53 words
The method of claim 2 , further comprising: forming microvias and conductive lands in said first continuously conductive layer and said first dielectric layer to form a first intermediate layer; and forming microvias and conductive lands in said second continuously conductive layer and said second dielectric layer to form a second intermediate layer.
Claim 9
Dependent Claim
67 words
The method of claim 8 , further comprising: forming one or more plated through holes through said multilayered laminate; laminating a first surface layer to said first intermediate layer; and forming microvias in said first surface layer, at least some of said microvias formed in said first surface layer conductively coupled to microvias and conductive lands of said first intermediate layer and to said plated through holes.
Claim 10
Dependent Claim
56 words
The method of claim 7 , further comprising: laminating a second surface layer to said second intermediate layer; and forming microvias in said second surface layer, at least some of said microvias formed in said second surface layer conductively coupled to microvias and conductive lands of said second intermediate layer and to said plated through holes.
Claim 11
Dependent Claim
76 words
The method of claim 2 , wherein said first and second dielectric layers and said intervening dielectric layers include material selected from the group consisting of a photoimageable dielectric material, a pure resin material, an epoxy material, a glass-reinforced dielectric, an allylated polyphenylene ether resin and a silica filled polytetraflouroethylene resin and wherein said first and second continuously conductive layers include material selected from the group consisting of copper, a copper alloy, or a copper-Invar-copper sandwich.
Claim 12
Dependent Claim
87 words
An electrical structure comprising: a multilayered laminate that includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S3P substructure, and an 0S1P substructure and a 0S3P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; and (c) a second intermediate layer having microvias and conductive lands.
Claim 13
Dependent Claim
87 words
An electrical structure comprising: a multilayered laminate that includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S3P substructure, and an 0S1P substructure and a 0S3P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; and (c) a second intermediate layer having microvias and conductive lands.
Claim 14
Dependent Claim
102 words
An electrical structure comprising: a multilayered laminate that includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S1P substructure and a 2S1P substructure, an 0S3P substructure and said 2S1P substructure, and said 0S1P substructure and said 0S3P substructure and said 2S1P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; and (c) a second intermediate layer having microvias and conductive lands.
Claim 15
Dependent Claim
102 words
An electrical structure comprising: a multilayered laminate that includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a subset of the plurality of signal/power plane substructures is selected from the group consisting of an 0S1P substructure and a 2S1P substructure, an 0S3P substructure and said 2S1P substructure, and said 0S1P substructure and said 0S3P substructure and said 2S1P substructure, and wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures; and (c) a second intermediate layer having microvias and conductive lands.
Claim 16
Dependent Claim
19 words
The electrical structure of claim 11 , further comprising one or more plated through holes through said multilayered laminate.
Claim 17
Dependent Claim
53 words
The electrical structure of claim 11 , further comprising a first surface layer having microvias conductively coupled to said first intermediate layer, at least some of said microvias of said first surface layer conductively coupled to said microvias and said conductive lands of said first intermediate layer and to said plated through holes.
Claim 18
Dependent Claim
51 words
The electrical structure of claim 13 , further comprising a second surface layer having microvias conductively coupled to said second intermediate layer, at least some of said microvias of said second surface layer conductively coupled to microvias and conductive lands of said second intermediate layer and to said plated through holes.
Claim 19
Dependent Claim
19 words
The electrical structure of claim 13 , wherein an electronic device is conductively coupled to said first surface layer.
Claim 20
Dependent Claim
45 words
The electrical structure of claim 11 wherein at least some of said microvias of said first and second intermediate layer are conductively coupled to plated vias and signal planes of a substructure selected from the group of substructures consisting of 01SP, 0S3P and 2S1P substructures.
Claim 21
Dependent Claim
70 words
The electrical structure of claim 11 , wherein said intervening dielectric layers include material selected from the group consisting of a photoimageable dielectric material, a pure resin material, an epoxy material, a glass-reinforced dielectric, an allylated polyphenylene ether resin and a silica filled polytetraflouroethylene resin and wherein said first and second continuously conductive layers include material selected from the group consisting of copper, a copper alloy, or a copper-Invar-copper sandwich.
References Cited (Backward Citations)
US5185502A
Cited
US5316787A
Cited
US5298685A
Cited
US5435057A
Cited
US5558928A
Cited
US5362534A
Cited
US5557843A
Cited
US5745333A
Cited
US5747222A
Cited
US5834160A
Cited
US5822856A
Cited
US6255039B1
Cited
US6131279A
Cited
US6181004B1
Cited
US6103135A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-10 | 2006-08-12 | 2007-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-10 | 2010-08-12 | 2011-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-10 | 2014-08-12 | 2015-02-11 | $7700.00 | Window Closed / Lapsed |