US5316787A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate
Assignee: International Business Machines Corp
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Filing: 1992-11-17
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Granted: 1994-05-31
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Expires: 2012-11-17
Abstract
Abstract A method and system for manufacturing electrically isolated vias in a flexible substrate composed of a metal core laminated by layers of an organic material. The method includes the steps of etching via holes, hydrolyzing the inner organic surfaces of the via holes and baking a polyimide solution coated in the via holes.
Inventors
- 👤 Richard F. Frankeny
- 👤 Ronald L. Imken
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:17
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K3/44; H05K3/445; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W70/688; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2201/09654; H05K2201/09718; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/03; H05K2203/0323; H05K2203/14; H05K2203/1438; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
107 words
A method for producing electrically isolated vias in a flexible substrate comprising the steps of: forming at least one aperture in a laminate to produce at least one via hole, said laminate comprising a metal core laminated by layers of an organic material; etching said via holes to remove some metal core material exposed in said via holes, thereby creating an exposed core which includes exposed metal and inner organic surfaces; hydrolyzing said inner organic surfaces; permeating said via holes with a polyimide solution; removing excess polyimide solution from said via holes; and baking said laminate to produce adhesion between said exposed core and said polyimide solution.
Claim 2
Independent Claim
107 words
A method for producing electrically isolated vias in a flexible substrate comprising the steps of: forming at least one aperture in a laminate to produce at least one via hole, said laminate comprising a metal core laminated by layers of an organic material; etching said via holes to remove some metal core material exposed in said via holes, thereby creating an exposed core which includes exposed metal and inner organic surfaces; hydrolyzing said inner organic surfaces; permeating said via holes with a polyimide solution; removing excess polyimide solution from said via holes; and baking said laminate to produce adhesion between said exposed core and said polyimide solution.
Claim 3
Dependent Claim
27 words
A method for producing electrically isolated vias in a flexible substrate as in claim 1 wherein said aperture is formed by any of drilling, punching, or ablation.
Claim 4
Dependent Claim
23 words
A method for producing electrically isolated vias in a flexible substrate as in claim 1 wherein said organic material comprises a polyimide material.
Claim 5
Dependent Claim
13 words
A flexible multilayer substrate produced in accordance with the process of claim 1.
Claim 6
Dependent Claim
14 words
Means for producing a flexible multilayer in accordance with the process of claim 1.
Claim 7
Independent Claim
119 words
A system for producing electrically isolated vias in a flexible substrate comprising the steps of: means for forming at least one aperture in a laminate to produce at least one via hole, said laminate comprising a metal core laminated by layers of an organic material; means for etching said via holes to remove some metal core material exposed in said via holes, thereby creating an exposed core which includes exposed metal and inner organic surfaces; means for hydrolyzing said inner organic surfaces; means for permeating said via holes with a polyimide solution; means for removing excess polyimide solution from said via holes; and means for baking said laminate to produce adhesion between said exposed core and said polyimide solution.
Claim 8
Independent Claim
119 words
A system for producing electrically isolated vias in a flexible substrate comprising the steps of: means for forming at least one aperture in a laminate to produce at least one via hole, said laminate comprising a metal core laminated by layers of an organic material; means for etching said via holes to remove some metal core material exposed in said via holes, thereby creating an exposed core which includes exposed metal and inner organic surfaces; means for hydrolyzing said inner organic surfaces; means for permeating said via holes with a polyimide solution; means for removing excess polyimide solution from said via holes; and means for baking said laminate to produce adhesion between said exposed core and said polyimide solution.
Claim 9
Dependent Claim
25 words
The system of claim 6 wherein said means for forming at least one aperture comprises means for drilling, means for punching, or means for ablation.
Claim 10
Dependent Claim
13 words
The system of claim 6 wherein said organic material comprises a polyimide material.
References Cited (Backward Citations)
US4026008A
Cited
US4234666A
Cited
US4426773A
Cited
US4480288A
Cited
US4517051A
Cited
JPS6041238A
Cited
DE3505579A1
Cited
US4701781A
Cited
US4801561A
Cited
US4649415A
Cited
US4723197A
Cited
US4681654A
Cited
US4721992A
Cited
US4791248A
Cited
JPS6481397A
Cited
JPH01228198A
Cited
US5208068A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |