Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve the yield by placing many IC chips on a substrate, measuring together the ICs, performing a burn-in test, further dividing the ICs into pieces, and placing only good ones on a hybrid integrated circuit substrate. CONSTITUTION:An insulating substrate 1 in which an island 5 for an IC mount, a bonding electrode 4, an external electrode 2 for a measurement and a burn-in test, and a connecting electrode 6 to a hybrid integrated circuit substrate are formed is prepared, and many IC chips 7 are mounted thereon. Then, after a test of operating speed classes is performed in this state, the burn-in test is achieved. Subsequently, the substrate 1 is divided along a broken line 9, good ones of the ICs divided into pieces are selected, and classified in accordance with the necessary items of the operating classes. Eventually, the IC chips are placed on the substrate. Thus, since sufficient test and the classification of every characteristic can be performed before placing on the substrate, the yield can be improved.

Inventors

• 👤 Hajime Nakamura
• 👤 肇 中村

Bibliographic Details