US5298685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnection method and structure for organic circuit boards
Assignee: International Business Machines Corp
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Filing: 1992-07-14
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Granted: 1994-03-29
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Expires: 2012-07-14
Abstract
Abstract Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.
Inventors
- 👤 Perminder S. Bindra
- 👤 Ross Downey Havens
- 👤 Voya R. Markovich
- 👤 Jaynal A. Molla
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05K3/36; H05K3/368; H05K3/44; H05K3/445; H05K1/00; H05K1/02; H05K1/0272; H05K1/14; H05K1/144; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/0949; H05K2201/095; H05K2201/09536; H05K2201/09563; H05K2201/0959; H05K2201/096; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/05; H05K2203/0502; H05K2203/054; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/0094; H05K3/22; H05K3/28; H05K3/30; H05K3/32; H05K3/325; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4076; H05K3/42; H05K3/423; H05K3/425; H05K3/428; H05K3/4623; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
120 words
A bonded composite of at least two organic polymeric subcomposites of a circuit board obtained by (a) providing metallic dendrites on electrical contact pads of said two organic polymeric subcomposites wherein electrical contact pads of one of said organic polymeric subcomposites face electrical contact pads of the other of said organic subcompsites; and wherein an electrical contact pad on one of the subcomposites is larger than the electrical contact pad it faces on the other subcomposite; (b) contacting the electrical contact pads that face each other; (c) heating said subcomposites while the said electrical contact pads that face each other are in contact with each other to form a bonded composite; (d) and then permitting said bonded composite to cool.
Claim 2
Dependent Claim
120 words
A bonded composite of at least two organic polymeric subcomposites of a circuit board obtained by (a) providing metallic dendrites on electrical contact pads of said two organic polymeric subcomposites wherein electrical contact pads of one of said organic polymeric subcomposites face electrical contact pads of the other of said organic subcompsites; and wherein an electrical contact pad on one of the subcomposites is larger than the electrical contact pad it faces on the other subcomposite; (b) contacting the electrical contact pads that face each other; (c) heating said subcomposites while the said electrical contact pads that face each other are in contact with each other to form a bonded composite; (d) and then permitting said bonded composite to cool.
Claim 3
Dependent Claim
75 words
An integrated circuit board comprising at least two organic polymeric subcomposites wherein said subcomposites are bonded to each other by metallic dendrites on electrical contact pads of said subcomposites, wherein electrical contact pads of one of said organic polymeric subcomposites face electrical contact pads of the other of said organic subcomposites; and wherein an electrical contact pad on one of the subcomposites is larger than the electrical contact pad it faces on the other subcomposite.
Claim 4
Dependent Claim
75 words
An integrated circuit board comprising at least two organic polymeric subcomposites wherein said subcomposites are bonded to each other by metallic dendrites on electrical contact pads of said subcomposites, wherein electrical contact pads of one of said organic polymeric subcomposites face electrical contact pads of the other of said organic subcomposites; and wherein an electrical contact pad on one of the subcomposites is larger than the electrical contact pad it faces on the other subcomposite.
Claim 5
Dependent Claim
11 words
The circuit board of claim 2 wherein said dendrites are palladium.
Claim 6
Dependent Claim
34 words
The circuit board of claim 2 wherein the larger of the electrical contact pads is about 25 percent to about 75 percent larger widthwise as compared to the other of the electrical contact pads.
Claim 7
Dependent Claim
20 words
The circuit board of claim 2 wherein the height of said dendrites is about 0.5 mil to about 1 mil.
Claim 8
Dependent Claim
13 words
The circuit board of claim 2 wherein said electrical contact pads are copper.
Claim 9
Dependent Claim
19 words
The circuit board of claim 2 wherein said contact pads are about 5 mils to about 100 mils wide.
Claim 10
Dependent Claim
25 words
The circuit board of claim 3 wherein the dendrites on corresponding subcomposites are coated with a metal that is capable of bonding with each other.
Claim 11
Dependent Claim
26 words
The circuit board of claim 8 wherein dendrites one of the subcomposites is coated with gold and dendrites on the other subcomposite is coated with tin.
Claim 12
Dependent Claim
42 words
The composite of claim 1 wherein said subcomposites prior to said heating are at a temperature of about 25° C. to about 200° C. and below the melting point of the organic polymeric material of said subcomposites to provide a temporary bond.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-28 | 1997-09-27 | 1998-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-28 | 2001-09-27 | 2002-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-28 | 2005-09-27 | 2006-03-29 | $7700.00 | Window Closed / Lapsed |