US6492260B1
Expired / Lapsed
US
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Method of fabricating damascene metal wiring
Assignee: Samsung Electronics Co Ltd
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Filing: 1999-11-22
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Granted: 2002-12-10
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Expires: 2019-11-22
Abstract
Abstract A method of forming damascene wiring without dishing and erosion employs a dummy layer to slow or delay polishing in selected regions and thereby prevent dishing and erosion of the damascene wiring. The dummy layer is above wide damascene regions and areas containing closely packed damascene regions. Therefore, non-uniform sheet resistance of the damascene metal wiring and electro-migration due to an increase in the local current density of the metal wiring can be prevented.
Inventors
- 👤 Young-wug Kim
- 👤 Kyung-Tae Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:05
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/062; H10W20/071; H10W20/074; H10W20/077
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
146 words
A method of forming damascene wiring in a semiconductor device, comprising: forming an insulative layer; patterning the insulative layer to form a damascene region in the insulative layer; forming a first conductive layer on the surface of the insulative layer, the conductive layer filling the damascene region; forming a dummy layer on a portion of the first conductive layer that is in the damascene region, wherein a top surface of the portion of the first conductive layer in the damascene region is lower than a top surface of the insulative layer; forming a second conductive layer on the first conductive layer and the dummy layer; and planarizing a resulting structure by removing portions of the dummy layer and the first and second conductive layers until the insulative layer is exposed, such that a portion of the dummy layer remains after the planarization of the resulting structure.
Claim 2
Independent Claim
146 words
A method of forming damascene wiring in a semiconductor device, comprising: forming an insulative layer; patterning the insulative layer to form a damascene region in the insulative layer; forming a first conductive layer on the surface of the insulative layer, the conductive layer filling the damascene region; forming a dummy layer on a portion of the first conductive layer that is in the damascene region, wherein a top surface of the portion of the first conductive layer in the damascene region is lower than a top surface of the insulative layer; forming a second conductive layer on the first conductive layer and the dummy layer; and planarizing a resulting structure by removing portions of the dummy layer and the first and second conductive layers until the insulative layer is exposed, such that a portion of the dummy layer remains after the planarization of the resulting structure.
Claim 3
Dependent Claim
29 words
The method of claim 1 , wherein the first conductive layer is formed of a metal selected from a group consisting of copper, aluminum, silver, gold, and alloys thereof.
Claim 4
Dependent Claim
21 words
The method of claim 1 , further comprising forming a barrier layer on the insulative layer after patterning the insulative layer.
Claim 5
Dependent Claim
13 words
The method of claim 1 , wherein chemical mechanical polishing performs the planarizing.
Claim 6
Dependent Claim
27 words
The method of claim 4 , wherein a selectivity of the dummy layer against the chemical mechanical polishing is lower than that of the first conductive layer.
Claim 7
Dependent Claim
23 words
The method of claim 5 , wherein a selectivity ratio of the dummy layer to the first conductive layer is 1 to 5.
Claim 8
Dependent Claim
34 words
The method of claim 1 , wherein the dummy layer is formed of a material selected from a group consisting of SiO 2 , Si 3 N 4 , TiO 2 , and TiN.
Claim 9
Dependent Claim
20 words
The method of claim 1 , wherein a thickness of the dummy layer is between 500 Å and 5000 Å.
Claim 10
Dependent Claim
42 words
The method of claim 1 , wherein a difference in heights between the top surface of the portion of the first conductive layer in the damascene region and the top surface of the insulative layer is between 500 Å and 1000 Å.
Claim 11
Dependent Claim
22 words
The method of claim 1 , wherein a width of the damascene region under the dummy layer is 10 μm or more.
Claim 12
Dependent Claim
50 words
The method of claim 1 , wherein the patterning of the insulative layer forms a plurality of damascene regions, and the dummy layer is formed on a portion of the first conductive layer, under which the damascene regions occupy 20% or more of a total area under the dummy layer.
Claim 13
Dependent Claim
13 words
The method of claim 11 , wherein chemical mechanical polishing performs the planarizing.
Claim 14
Dependent Claim
31 words
The method of claim 12 , wherein a selectivity of the dummy layer against the chemical mechanical polishing is the same as or lower than that of the first conductive layer.
Claim 15
Dependent Claim
28 words
The method of claim 13 , wherein a selectivity ratio of the dummy layer to the first conductive layer is between 1 to 1 and 1 to 2.
Claim 16
Dependent Claim
16 words
The method of claim 11 , wherein the dummy layer is formed of SiO 2 .
Claim 17
Dependent Claim
20 words
The method of claim 11 , wherein a thickness of the dummy layer is between 500 Å and 3000 Å.
Claim 18
Independent Claim
121 words
A method of forming damascene wiring in a semiconductor device, comprising: forming an insulative layer; patterning the insulative layer to form a plurality of damascene regions in the insulative layer; forming a first conductive layer on the surface of the insulative layer, the first conductive layer filling the damascene regions; forming a first dummy layer on a portion of the first conductive layer in a first portion of the damascene regions; forming a second dummy layer on a portion of the first conductive layer, under which a second portion of the damascene regions is located; and planarizing a resulting structure by removing portions of the first and second dummy layers and the first conductive layer until the insulative layer is exposed.
Claim 19
Independent Claim
121 words
A method of forming damascene wiring in a semiconductor device, comprising: forming an insulative layer; patterning the insulative layer to form a plurality of damascene regions in the insulative layer; forming a first conductive layer on the surface of the insulative layer, the first conductive layer filling the damascene regions; forming a first dummy layer on a portion of the first conductive layer in a first portion of the damascene regions; forming a second dummy layer on a portion of the first conductive layer, under which a second portion of the damascene regions is located; and planarizing a resulting structure by removing portions of the first and second dummy layers and the first conductive layer until the insulative layer is exposed.
Claim 20
Dependent Claim
13 words
The method of claim 17 , wherein chemical mechanical polishing performs the planarizing.
Claim 21
Dependent Claim
28 words
The method of claim 18 , wherein a selectivity of the first dummy layer against the chemical mechanical polishing is lower than that of the first conductive layer.
Claim 22
Dependent Claim
24 words
The method of claim 19 , wherein a selectivity ratio of the first dummy layer to the first conductive layer is 1 to 5.
Claim 23
Dependent Claim
32 words
The method of claim 18 , wherein a selectivity of the second dummy layer against the chemical mechanical polishing is the same as or lower than that of the first conductive layer.
Claim 24
Dependent Claim
29 words
The method of claim 21 , wherein a selectivity ratio of the second dummy layer to the first conductive layer is between 1 to 1 and 1 to 2.
Claim 25
Dependent Claim
25 words
The method of claim 17 , further comprising forming a second conductive layer on the first and second dummy layers and the first conductive layer.
Claim 26
Dependent Claim
33 words
The method of claim 23 , wherein a top surface of the portion of the first conductive layer below the first dummy layer is lower than a top surface of the insulative layer.
Claim 27
Dependent Claim
42 words
The method of claim 24 , wherein the height difference between the top surface of the portion of the first conductive layer below the first dummy layer and the top surface of the insulative layer is between 500 Å and 1000 Å.
Claim 28
Dependent Claim
18 words
The method of claim 24 , wherein a portion of the first dummy layer remains after the planarizing.
Claim 29
Dependent Claim
29 words
The method of claim 17 , wherein a width of the first portion of the damascene regions, which is under the first dummy layer, is 10 μm or more.
Claim 30
Dependent Claim
21 words
The method of claim 17 , wherein the damascene regions are closely packed in the second portion of the damascene regions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-09 | 2006-06-10 | 2006-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-09 | 2010-06-10 | 2010-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-09 | 2014-06-10 | 2014-12-10 | $7700.00 | Window Closed / Lapsed |