Electrical circuit board and method for making the same

Claim 2

A circuit board assembly comprising: a first circuit portion in which an amount of heat is generated, wherein said first circuit portion includes a first and a second conductive layer and a core layer which is disposed between said first and second conductive layers; a heat pipe which is integrally formed within said core layer of said first circuit portion, wherein said heat pipe comprises a plurality of elongated fin members which extend longitudinally within said heat pipe; an amount of fluid which is disposed within said heat pipe; and a heat pump comprising an acoustic transducer which is effective to produce sound waves at a resonant frequency which are transferred to said amount of fluid, and a diaphragm which is effective to transfer said sound waves to said amount of fluid, wherein said heat pump is operatively disposed within first circuit portion and which communicates with said heat pipe and said amount of fluid, said heat pump being effective to produce pressure fluctuations within said amount of fluid, thereby causing said amount of fluid to circulate within said heat pipe and dissipate said amount of heat.

Claim 3

The circuit board assembly of claim 1 further comprising a heat sink which is operatively disposed within said first circuit portion and which communicates with said heat pipe, thereby assisting in dissipating said amount of heat.

Claim 4

The circuit board assembly of claim 2 wherein said heat pipe is generally “S”-shaped.

Claim 5

The circuit board assembly of claim 1 wherein said core layer comprises an aluminum material.

Claim 6

The circuit board assembly of claim 4 wherein said heat pipe is formed within said core layer by use of an etching process.

Claim 7

A multi-layer circuit board assembly comprising: a first pre-circuit assembly including a first and second conductive layer, a first core layer disposed between said first and said second conductive layers, and a first channel formed within said first conductive layer and said first core layer; a second pre-circuit assembly comprising a third and fourth conductive layer, a second core layer disposed between said third and said fourth conductive layers, and a second channel which is formed within said third conductive layer and said second core layer; a third core member is disposed between said first pre-circuit assembly and said second pre-circuit assembly, said third core member having at least one third channel which cooperates with said first channel and said second channel to form a heat pipe within said circuit assembly; a component which generates an amount of heat within said circuit board assembly; a cooling material which is operatively disposed within said heat pipe; and a heat pump which is operatively coupled to said first pre-circuit assembly and which communicates with said heat pipe and said cooling material, said heat pump being effective to circulate said cooling material within said heat pipe, thereby dissipating said amount of heat.

Claim 8

A multi-layer circuit board assembly comprising: a first pre-circuit assembly including a first and second conductive layer, a first core layer disposed between said first and said second conductive layers, and a first channel formed within said first conductive layer and said first core layer; a second pre-circuit assembly comprising a third and fourth conductive layer, a second core layer disposed between said third and said fourth conductive layers, and a second channel which is formed within said third conductive layer and said second core layer; a third core member is disposed between said first pre-circuit assembly and said second pre-circuit assembly, said third core member having at least one third channel which cooperates with said first channel and said second channel to form a heat pipe within said circuit assembly; a component which generates an amount of heat within said circuit board assembly; a cooling material which is operatively disposed within said heat pipe; and a heat pump which is operatively coupled to said first pre-circuit assembly and which communicates with said heat pipe and said cooling material, said heat pump being effective to circulate said cooling material within said heat pipe, thereby dissipating said amount of heat.

Claim 9

The multi-layer circuit board assembly of claim 6 wherein said first pre-circuit assembly and said second pre-circuit assembly are coupled to said third core member by use of an adhesive material.

Claim 10

The multi-layer circuit board assembly of claim 6 wherein said heat pump comprises an acoustic driver.

Claim 11

The multi-layer circuit board assembly of claim 8 further comprising a heat sink which is operatively coupled to said second pre-circuit assembly and which is effective to assist in dissipating said amount of heat.

Claim 12

The multi-layer circuit board assembly of claim 9 wherein said cooling material comprises a fluid.

Claim 15

The method of claim 11 further comprising the step of: providing a heat sink; and coupling said heat sink to said circuit board, such that said heat sink communicates with said heat pipe and assists in removing said amount of heat.

Claim 16

The method of claim 11 wherein said heat pipe is formed by use of an etching process.