US5901037A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Closed loop liquid cooling for semiconductor RF amplifier modules
Assignee: Northrop Grumman Systems Corp
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Filing: 1997-06-18
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Granted: 1999-05-04
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Expires: 2017-06-18
Abstract
Abstract A closed loop liquid cooling system for an RF transistor module including a plurality of elongated microchannels connected between a pair of coolant manifolds for conducting liquid coolant beneath one or more transistor dies to dissipate the heat generated thereby, a heat exchanger, a miniature circulating pump located on the module, and passive check valves having tapered passages for controlling the flow of coolant in the loop. The valves are truncated tapered passage microchannel valves having no moving parts and are fabricated so as to be a part of either the circulating pump, the coolant manifolds, or the microchannels.
Inventors
- 👤 Robin E. Hamilton
- 👤 Thomas J. Fagan
- 👤 Paul G. Kennedy
- 👤 William S. Woodward
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:28
CPC Classifications
F; F28; F28F; F28F3/00; F28F3/12; F28F9/00; F28F9/02; F28F9/026; F28F9/0282; H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W40/00; H10W40/40; H10W40/47; F28F2250/00; F28F2250/08; F28F2260/00; F28F2260/02
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
96 words
A microchannel liquid cooling system for dissipating heat generated in a semiconductor module, comprising: a semiconductor substrate; a plurality of microchannels and a pair of coolant manifolds therefor formed in said substrate below at least one semiconductor device for conducting a coolant therethrough; a heat exchanger; a coolant circulating pump; said pump, said microchannels, and said heat exchanger being connected in a closed loop coolant circulating path; and a pair of passive check valves having no moving parts formed in said substrate adjacent said manifolds for controlling the flow of coolant in said coolant circulating path.
Claim 2
Dependent Claim
96 words
A microchannel liquid cooling system for dissipating heat generated in a semiconductor module, comprising: a semiconductor substrate; a plurality of microchannels and a pair of coolant manifolds therefor formed in said substrate below at least one semiconductor device for conducting a coolant therethrough; a heat exchanger; a coolant circulating pump; said pump, said microchannels, and said heat exchanger being connected in a closed loop coolant circulating path; and a pair of passive check valves having no moving parts formed in said substrate adjacent said manifolds for controlling the flow of coolant in said coolant circulating path.
Claim 3
Dependent Claim
27 words
A cooling system according to claim 1 wherein each of said passive check valves have a tapered passage with an input aperture larger than an output aperture.
Claim 4
Dependent Claim
15 words
A cooling system according to claim 2 wherein said tapered passage comprises a truncated polyhedron.
Claim 5
Dependent Claim
15 words
A cooling system according to claim 2 wherein said tapered passage comprises a truncated pyramid.
Claim 6
Dependent Claim
15 words
A cooling system according to claim 4 wherein said pyramid comprises a four sided pyramid.
Claim 7
Dependent Claim
15 words
A cooling system according to claim 2 wherein said tapered passage comprises a truncated cone.
Claim 8
Dependent Claim
22 words
A cooling system according to claim 2 wherein said tapered passage defines an interior included angle ranging between approximately 55° and 70°.
Claim 9
Dependent Claim
27 words
A cooling system according to claim 2 wherein the distance between the input aperture(D) and the output aperture(d) ranges between about 0.04 in. and about 0.09 in.
Claim 10
Dependent Claim
20 words
A cooling system according to claim 2 wherein the input aperture(D) ranges between about 0.01 in. and about 0.04 in.
Claim 11
Dependent Claim
15 words
A cooling system according to claim 2 wherein said valves are part of said manifolds.
Claim 12
Dependent Claim
18 words
A cooling system according to claim 10 wherein said tapered passage comprises a truncated polyhedron or truncated cone.
Claim 13
Dependent Claim
15 words
A cooling system according to claim 1 wherein said tapered passage comprises a truncated pyramid.
Claim 14
Dependent Claim
15 words
A cooling system according to claim 2 wherein said valves are part of said microchannels.
Claim 15
Dependent Claim
17 words
A cooling system according to claim 13 wherein said tapered passage comprises a truncated polyhedron or cone.
Claim 16
Dependent Claim
15 words
A cooling system according to claim 13 wherein said tapered passage comprises a truncated pyramid.
Claim 17
Dependent Claim
109 words
A microchannel liquid cooling system for dissipating heat generated in a semiconductor module, comprising: a semiconductor substrate; a plurality of microchannels and a pair of coolant manifolds therefor formed in said substrate below at least one semiconductor device for conducting a coolant therethrough; a heat exchanger; a coolant circulating pump; said pump, said microchannels, and said heat exchanger being connected in a closed loop coolant circulating path; and a pair of passive check valves formed in the substrate and having tapered passages, comprising a truncated polyhedron or truncated cone, said check valves being located immediately adjacent said coolant manifolds for controlling the flow of coolant in said circulating path.
Claim 18
Dependent Claim
109 words
A microchannel liquid cooling system for dissipating heat generated in a semiconductor module, comprising: a semiconductor substrate; a plurality of microchannels and a pair of coolant manifolds therefor formed in said substrate below at least one semiconductor device for conducting a coolant therethrough; a heat exchanger; a coolant circulating pump; said pump, said microchannels, and said heat exchanger being connected in a closed loop coolant circulating path; and a pair of passive check valves formed in the substrate and having tapered passages, comprising a truncated polyhedron or truncated cone, said check valves being located immediately adjacent said coolant manifolds for controlling the flow of coolant in said circulating path.
Claim 19
Dependent Claim
24 words
A microchannel liquid cooling system according to claim 16 and wherein said tapered passages have interior included angles ranging between about 55° and 70°.
References Cited (Backward Citations)
US5218515A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-03 | 2002-11-02 | 2003-05-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-03 | 2006-11-02 | 2007-05-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-03 | 2010-11-02 | 2011-05-04 | $7700.00 | Window Closed / Lapsed |