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US3801388A Expired / Lapsed US ⏱️ 0.0 years remaining

Printed circuit board crossover and method for manufacturing the same

Assignee: Sony Corp
•
Filing: 1972-09-25
•
Granted: 1974-04-02
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Expires: 1992-09-25
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Abstract

Abstract A printed circuit board which has an insulating base plate, a plurality of conductors spearately formed on the insulating base plate, conductive studs formed on the ends of two of the conductors, and cross-over conductor connected to the conductive studs but electrically isolated from one of a plurality of conductors passing between the ends of the two conductors. The cross-over conductor is shaped to have a configuration such that its end portions are wider than its mid portion. The material forming the studs are selected different from the material forming all of the conductors so that they are not removed by the same etchant.

Inventors

  • 👤 K Akiyama
  • 👤 Y Kajiyama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 09:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4685

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 54 words
The method of manufacturing a printed circuit board as recited in claim 1 wherein the step of etching the first layer comprises forming a conductive path portion from the first layer which connects the two terminal portions, the path portion being formed to have a narrower width than the width of the terminal portions.
Claim 2
Dependent Claim 27 words
A method of manufacturing a printed circuit board as recited in claim 1 comprising the further step of attaching an electronic element between the two terminal portions.
Claim 3
Independent Claim 139 words
A method of manufacturing a printed circuit board having at least one cross-over area comprising the steps of: forming first and second metal layers on opposite plane surfaces of a metal substratE, the metal of the first and second layers having different etching characteristics from the metal substrate, etching the first metal layer to form a first conductor, etching the second metal layer to form at least a second and third conductor, the first conductor being formed such that its end portions are wider than its mid portion and are opposed to the second and third conductors at their end portions through the metal substrate, securing at least the second and third conductors to an insulating substrate, and etching the metal substrate so as to remove it except for portions under the wider end portions of the first conductor.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-04-01 1977-10-01 1978-04-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-04-01 1981-10-01 1982-04-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-04-01 1985-10-01 1986-04-02 $7700.00 Window Closed / Lapsed

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