Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument

Claim 2

A semiconductor device comprising: a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon in a first region thereof, wherein: the substrates are stacked over top of each other; a first semiconductor chip mounted on a first stacked substrate is electrically connected to a second semiconductor chip mounted on a second stacked substrate through first terminals provided in a second region of each of the first and second stacked substrates outside the first region; a lowest substrate of the stacked substrates having second terminals provided in a third region of the lowest substrate that is closer to a center of the lowest substrate than the second region, the second terminals electrically connected to one of the semiconductor chips; and a pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals.

Claim 3

The semiconductor device of claim 1 , wherein: the first terminals are arranged along an edge of one of the semiconductor chips; and the second terminals are provided in the first region such that the third region is within the first region.

Claim 4

The semiconductor device of claim 1 , wherein: the first terminals have projections formed to project from a surface of one of the substrates; and by means of the projections of the first terminals, the first semiconductor chip is electrically connected to the second semiconductor chip.

Claim 5

The semiconductor device of claim 3 , wherein: in each of the substrates, a plurality of first through holes are formed; and the projections of the first terminals project from the surface of one of the substrates through the first through holes.

Claim 6

The semiconductor device of claim 3 , wherein: on each of the substrates, an interconnecting pattern is formed; the first terminals are a part of the interconnecting pattern; and the projections of the first terminals are formed by a part of the interconnecting pattern being bent in the direction away from the surface of one of the substrates.

Claim 7

The semiconductor device of claim 3 , wherein: on each of the substrates, an interconnecting pattern is formed; and the projections of the first terminals are bumps provided so as to be electrically connected to the interconnecting pattern.

Claim 8

The semiconductor device of claim 5 , wherein: the second terminals have external terminals on the lowest substrate of the stacked substrates, the external terminals projecting from a surface of the lowest substrate of the stacked substrates, the surface opposite to that opposing another of the stacked substrates.

Claim 9

The semiconductor device of claim 6 , wherein: the second terminals have external terminals on the lowest substrate of the stacked substrates, the external terminals projecting from a surface of the lowest substrate of the stacked substrates, the surface oppposite to that opposing another of the stacked substrates.

Claim 10

The semiconductor device of claim 7 , wherein: in the lowest substrate of the stacked substrates, a plurality of second through holes are formed; and the external terminals of the second terminals project through the second through holes from the surface opposite to that opposing another of the stacked substrates.

Claim 11

The semiconductor device of claim 8 , wherein: in the lowest substrate of the stacked substrates, a plurality of second through holes are formed; and the external terminals of the second terminals project through the second through holes from the surface opposite to that opposing another of the stacked substrates.

Claim 12

The semiconductor device of claim 7 , wherein: the external terminals of the second terminals are bumps provided so as to be electrically connected to the interconnecting pattern.

Claim 13

The semiconductor device of claim 5 , wherein: the second terminals are a part of the interconnecting pattern.

Claim 14

The semiconductor device of claim 6 , wherein: the second terminals are a part of the interconnecting pattern.

Claim 15

The semiconductor device of claim 7 , wherein: the second terminals are a part of the interconnecting pattern.

Claim 16

The semiconductor device of claim 9 , wherein: the second terminals are a part of the interconnecting pattern.

Claim 17

The semiconductor device of claim 14 , wherein: the external terminals of the second terminals are formed by bending a part of the interconnecting pattern in the direction away from the surface opposite to that opposing another of the substrates.

Claim 18

The semiconductor device of claim 15 , wherein: the external terminals of the second terminals are formed by bending a part of the interconnecting pattern in the direction away from the surface opposite to that opposing another of the substrates.

Claim 19

A circuit board on which a semiconductor device is mounted, the semiconductor device comprising: a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon in a first region thereof, each of the substrates having an outline larger than each of the semiconductor chips, wherein: the substrates are stacked over top of each other; a first semiconductor chip mounted on a first stacked substrate is electrically connected to a second semiconductor chip mounted on a second stacked substrate through first terminals provided in a second region of each of the first and second stacked substrates outside the first region; a lowest substrate of the stacked substrates having second terminals provided in a third region of the lowest substrate that is closer to a center of the lowest substrate than the second region, the second terminals electrically connected to one of the semiconductor chips; and a pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals, wherein the semiconductor device is electrically connected to the circuit board through the second terminals.

Claim 20

A circuit board on which a semiconductor device is mounted, the semiconductor device comprising: a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon in a first region thereof, each of the substrates having an outline larger than each of the semiconductor chips, wherein: the substrates are stacked over top of each other; a first semiconductor chip mounted on a first stacked substrate is electrically connected to a second semiconductor chip mounted on a second stacked substrate through first terminals provided in a second region of each of the first and second stacked substrates outside the first region; a lowest substrate of the stacked substrates having second terminals provided in a third region of the lowest substrate that is closer to a center of the lowest substrate than the second region, the second terminals electrically connected to one of the semiconductor chips; and a pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals, wherein the semiconductor device is electrically connected to the circuit board through the second terminals.

Claim 21

An electronic instrument comprising a semiconductor device, the semiconductor device comprising: a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon in a first region thereof, each of the substrates having an outline larger than each of the semicondutor chips, wherein: the substrates are stacked over top of each other; a first semiconductor chip mounted on a first stacked substrate is electrically connected to a seocnd semiconductor chip mounted on a second stacked substrate through first terminals provided in a second region of each of the first and second stacked substrates outside the first region; a lowest substrate of the stacked substrates having second terminals provided in a third region of the lowest substrate that is closer to a center of the lowest substrate than the second region, the second terminals electrically connected to one of the semiconductor chips; and a pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals.

Claim 22

An electronic instrument comprising a semiconductor device, the semiconductor device comprising: a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon in a first region thereof, each of the substrates having an outline larger than each of the semicondutor chips, wherein: the substrates are stacked over top of each other; a first semiconductor chip mounted on a first stacked substrate is electrically connected to a seocnd semiconductor chip mounted on a second stacked substrate through first terminals provided in a second region of each of the first and second stacked substrates outside the first region; a lowest substrate of the stacked substrates having second terminals provided in a third region of the lowest substrate that is closer to a center of the lowest substrate than the second region, the second terminals electrically connected to one of the semiconductor chips; and a pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals.